A two-dimensional model has been developed for numerical prediction of viscous laminar flow, mixed convection, and conjugate heat transfer between parallel plates with uniform block heat sources and with openings on the integrated circuit board. A control volume pressure-based finite difference numerical scheme, PISO, is used to solve this problem. The differential pressure below and above the openings of the board induces upward streams, which break the stagnant region between the blocks and, consequently, enhance the heat dissipation. Geometrically, parametric study has indicated that an opening at the appropriate location makes a flatter temperature distribution and a lower peak temperature. Because of the existence of both natural convection and opening-induced passive flow streams, the resulting flow field depends on the inlet conditions and the magnitude of the heat source. The enhancement of heat transfer is reflected by a global increase of Nusselt number on the blocks, and is especially apparent ...

Conjugate Heat Transfer Analysis for the Passive Enhancement of Electronic Cooling Through Geometric Modification in a Mixed Convection Domain

Conjugate heat transfer has significant relevance to a number of thermal systems and techniques which demand stringent temperature control, such as electronic cooling and chemical vapor deposition. A detailed experimental and numerical study is carried out to investigate conjugate heat transfer in a common configuration consisting of a horizontal channel with a heated section. Experimental data obtained from this study provides physical insight into conjugate heat transfer effects and facilitates validation of numerical conjugate heat transfer models. The basic characteristics of the flow and the associated thermal transport are studied. The numerical model is used to carry out a parametric study of operating conditions and design variables, thus allowing for the characterization of the conjugate heat transfer effects

Experimental and Numerical Study of Conjugate Heat Transfer in a Horizontal Channel Heated From Below

Conjugate heat transfer from a small heated strip

Experimental and numerical investigations on optimal distribution of heat source array under natural and forced convection in a horizontal channel

Numerical simulation of conjugate heat transfer in electronic cooling and analysis based on field synergy principle

A numerical investigation of conjugate heat transfer from a flush heat source on a conductive board in laminar channel flow

A numerical investigation was conducted on the heat transfer from a uniformly powered strip source of heat that is located on the surface of a two-dimensional conducting substrate. The upper and lower surfaces of the substrate are cooled by forced laminar flow that is two-dimensional, steady, and with constant properties. The problem is a paradigm for the investigation of the competing effects of substrate conduction and fluid convection in the cooling of electronic components, i.e. chips or chip carriers, on boards or substrates that are cooled by air flowing parallel to the surface. The objectives of the study were to investigate the conjugate heat transfer mechanisms in great detail and in a methodical way, such as to use the results as a baseline for succeedingly more complex situations of aircooling of component on board situations. Results are presented for substrate conductivity to fluid conductivity ratio, k/sub sk/sub f/ from 0.1 to 100, channel Reynolds number from order 100 to order 1000, corresponding to air velocities of order 1 m/s, and for both developing and fully-developed laminar parallel planes channel flow. >

A method having for providing a thermal analysis of an assembly (206) having a first component (208) with an attached friction material controllably engaged with a second component (210). The method includes the steps of determining an initial interface temperature of the first and second components (208, 210), determining a first net heat flux split as a function of the initial interface temperature, determining a first net heat flux into the first component (208) and a second net heat flux into the second component (210) as a function of the heat flux split, and determining a first and a second real interface temperature of the respective first and second components (208, 210) as afunction of the respective first and second net heat fluxes.

Ramesh Sugavanam

Papers

A numerical investigation of conjugate heat transfer from a flush heat source on a conductive board in laminar channel flow

A numerical investigation of conjugate heat transfer from a flush heat source on a conductive board in laminar channel flow

Method for thermal analysis of a clutch-brake system