Process gas discharged from a bypass pipe to a gas exhaust system can be prevented from diffusing back to the inside of a process chamber without having to install a dedicated vacuum pump at the downstream side of the bypass pipe. The substrate processing apparatus includes a process chamber accommodating a substrate, a gas supply system supplying process gas from a process gas source to the process chamber for processing the substrate, a gas exhaust system configured to exhaust the process chamber, two or more vacuum pumps installed in series at the gas exhaust system, and a bypass pipe connected between the gas supply system and the gas exhaust system. The most upstream one of the vacuum pumps is a mechanical booster pump, and the bypass pipe is connected between the mechanical booster pump and the rest vacuum pumps located at a downstream side of the mechanical booster pump.

Substrate Processing Apparatus

A rotatable substrate supporting mechanism for use in a chemical vapor deposition reaction chamber of the type used in producing semi-conductor devices is provided with a susceptor for supporting a single substrate, or wafer, for rotation about an axis normal to the center of the wafer. The mechanism is provided with a temperature sensing system for producing signals indicative of sensed temperatures taken at the center of the susceptor and at various points about the periphery thereof. A gas purging system is provided for inhibiting the flow of reactant gas in unwanted areas of the reaction chamber and in the supporting system itself. Rotational driving of the mechanism is accomplished by a variable speed motor under control of a circuit which stops and starts the rotation at controlled speeds and stops the rotation at a home position for enhancing the handling of the wafers.

Rotatable substrate supporting mechanism with temperature sensing device for use in chemical vapor deposition equipment

The present invention provides an apparatus for vacuum processing generally comprising an enclosure having a plurality of isolated chambers formed therein, a gas distribution assembly disposed in each processing chamber, a gas source connected to the plurality of isolated chambers, and a power supply connected to each gas distribution assembly.

Tandem process chamber

A process for applying a metallization interconnect structure to a semiconductor workpiece having a barrier layer deposited on a surface thereof is set forth. The process includes the forming of an ultra-thin metal seed layer on the barrier layer. The ultra-thin seed layer having a thickness of less than or equal to about 500 Angstroms. The ultra-thin seed layer is then enhanced by depositing additional metal thereon to provide an enhanced seed layer. The enhanced seed layer has a thickness at all points on sidewalls of substantially all recessed features distributed within the workpiece that is equal to or greater than about 10% of the nominal seed layer thickness over an exteriorly disposed surface of the workpiece.

Apparatus and method for electrolytically depositing copper on a semiconductor workpiece

A method and system for probing with electrical tests signals on an integrated circuit specimen using a scanning electron microscope (SEM) (10) positioned for observing a surface of the specimen (50) exposing electrically conductive terminals on the specimen. A carrier (25) is provided for supporting the specimen (50) in relation to the scanning electron microscope (10) while a computer acquires an image identifying conductive path indicia of the surface of the specimen (50) from the scanning electron microscope (12). A motorized manipulator remotely controlled by the computer manipulates a plurality of probes (24) positionable on the surface of the specimen (50) for conveying electrical test signals inside a vacuum chamber inner enclosure (27) which houses the scanning electron microscope (12), the carrier (25), the motorized manipulator and the plurality of probes (24) for analyzing the specimen (50) in a vacuum. A feedthrough on the vacuum chamber (27) couples electrical signals from the computer to the motorized manipulator and the plurality of probes (24).

High resolution analytical probe station

Wafer transfer apparatus for horizontal transfer of a wafer between a cassette and an input station of a vacuum processing system includes a wafer transfer arm with a primary section linked to a secondary section so as to move a wafer in a straight line to a location and orientation station and then to the input station. The actual location of the wafer center and the angular orientation of the wafer flat are determined, and the wafer is rotated to a desired angular orientation at the location and orientation station. A solar cell is used to sense actual wafer position by sensing the wafer edge as it is rotated. The required correction and rotation are calculated from the solar cell output. As the wafer is transferred to the input station, correcting displacements are added to the movement so that the wafer is accurately positioned at the input station. A strain gauge is used to reliably sense wafer presence or absence on the transfer arm.

Wafer transfer system

A device for releaseably holding a workpiece includes a resilient collet which is pivotally attached to a base Several fingers for holding the workpiece extend from the collet The fingers are pivoted by actuating a member which elastically deforms the collet and causes the fingers to pivot from a position for engaging the workpiece to a position for releasing the workpiece and vice-versa In one application, the base is a platen for supporting a wafer in a semiconductor processing system and a plurality of such platens and a corresponding plurality of the holding devices are arranged around the periphery of the disk A counterweight ring is attached to the ring-shaped collet to counter-balance the moment generated by the centrifugal force of the wafer pressing against the fingers as the disk is rotated

Apparatus for retaining wafers

Apparatus for programmably orienting a semiconductor wafer (122) in an ion implantation system so as to limit channeling and to control the depth of penetration of impinging ions. The apparatus is associated with a processing chamber door (134) and includes a rotatable vacuum chuck (138) for engaging the wafer (122) and a motor (142) for rotating the vacuum chuck (138) and the wafer (122) through a preselected angular displacement. The apparatus further includes a programmable control assembly (144) operative to deenergize the motor (142) upon sensing rotation of the vacuum chuck (138) through the preselected angular displacement. The wafer orientation apparatus is typically utilized in a system for the vertical transfer of wafers between a cassette and a processing chamber (114).

Wafer orientation system

A tactile pick includes a base and a lever attached beneath the base by a pivot. A load sensing device including a strain gauge is located between the base and the portion of the lever on one side of the pivot; the portion of the lever on the other side of the pivot is adapted to receive a semiconductor wafer. Rotation of the lever about the pivot induced by the weight of a wafer causes an actuator to depress a flexible member on which a strain gauge is mounted. The output signal of the strain gauge is processed by a controller to provide an output signal which varies monotonically with the magnitude of the weight placed on the wafer receiving portion of the lever. The pick is employed in connection with the wafer transport system which transfers wafers from a cassette to the pick lever.

Low deflection force sensitive pick

A flow sensor for regulating the air flow rate to a cooling system can be formed as a housing for channeling the flow through a retangular cavity and a one piece vane of bent metal strip which deflects and closes an electrical contact at a predetermined air flow rate and opens when the air flow rate falls below a preset threshold level.

Richard J Hertel

Papers

Wafer transfer system

Apparatus for retaining wafers

Wafer orientation system

Low deflection force sensitive pick

Fluid flow sensor with flexible vane