In a liquid cooling device (1) for a high-power semiconductor module (14), which contains a plurality of heat-generating submodules (8a-h) arranged next to one another on a cooling surface (3) and is fusion-bonded to the cooling surface (3), an improved load cycle resistance is achieved by the liquid cooling device (1) having a housing (2) which encloses a liquid space (4), through which a cooling liquid flows, and the upper side of which forms the cooling surface (3), and by the housing (2) of the liquid cooling device (1), at least in the region of the cooling surface (3), consisting of a metal-ceramic composite material, the coefficient of thermal expansion of which is adapted to the coefficient of thermal expansion of the ceramic substrates or of the power semiconductor devices of the submodules (8a-h) and, by additional means (11a-h; 12) for improving the heat transfer between the cooling surface (3) and the cooling liquid being provided in the liquid space (4) of the liquid cooling device (1).

Liquid cooling device for a high-power semiconductor module

Aviation fuel is used as the coolant for a microchannel heat sink for airborne electronics. The use of preexisting aviation fuel as a coolant medium eliminates the weight, size and expense of a separate liquid system dedicated solely to electronics cooling. The heat sink is comprised of a body of material having high thermal conductivity and in which are formed a set of parallel closed-ended microchannels on the order of 0.001 in. by 0.004 in. separated by a distance of 0.001 in.

Microchannel cooling using aviation fuels for airborne electronics

A device and method for cooling an integrated circuit package - in particular, a microprocessor - within an enclosed computer system. The device comprises a blower (110), a first heat sink (130) attached to the microprocessor, and a first air duct (120) coupling the blower (110) to the first heat sink (130). The blower (110) has an air intake (135) from the exterior of the computer system. The blower (110) generates an air stream which flows through the first air duct (120) to the first heat sink (130) for cooling the first microprocessor (160). A second air duct (140) connected to the first heat sink (130) may be used to subsequently direct the air stream to a second heat sink (150) for cooling a second microprocessor (170). An efficient duct heat sink for use in this cooling system (100) can be easily constructed by attaching two extruded heat sinks.

Ducted opposing bonded fin heat sink blower multi-microprocessor cooling system

A terminal structure provides interfacing with power electronics circuitry and external circuitry. The thermal support may receive one or more power electronic circuits. The support may aid in removing heat from the terminal structure and the circuits through fluid circulating through the support. The support may form a shield from both external EMI/RFI and from interference generated by operation of the power electronic circuits. Features may be provided to permit and enhance connection of the circuitry to external circuitry, such as improved terminal configurations. Modular units may be assembled that may be coupled to electronic circuitry via plug-in arrangements or through interface with a backplane or similar mounting and interconnecting structures.

Cooled electrical terminal assembly and device incorporating same

A support may receive one or more power electronic circuits. The support may aid in removing heat from the circuits through fluid circulating through the support. The support, in conjunction with other packaging features may form a shield from both external EMI/RFI and from interference generated by operation of the power electronic circuits. Features may be provided to permit and enhance connection of the circuitry to external circuitry, such as improved terminal configurations. Modular units may be assembled that may be coupled to electronic circuitry via plug-in arrangements or through interface with a backplane or similar mounting and interconnecting structures.

Electrical power converter method and system employing multiple output converters

The semiconductor wafer of the power module is mounted directly, separated only by thermal expansion control layers and insulator layers, on the metal base which has fins or pins integrally formed thereon. This module is mounted on a coolant fluid flow chamber so that the module mounting is not a thermal interface. In this way, maximum power module cooling is achieved with minimum fluid flow.

Richard J Olaveson

Papers

Integral extended surface cooling of power modules