Fundamentals, processes and applications of high-permittivity polymer–matrix composites

Perovskite lead-free dielectrics for energy storage applications

This review summarizes the current state of polymer composites used as dielectric materials for energy storage The particular focus is on materials: polymers serving as the matrix, inorganic fillers used to increase the effective dielectric constant, and various recent investigations of functionalization of metal oxide fillers to improve compatibility with polymers We review the recent literature focused on the dielectric characterization of composites, specifically the measurement of dielectric permittivity and breakdown field strength Special attention is given to the analysis of the energy density of polymer composite materials and how the functionalization of the inorganic filler affects the energy density of polymer composite dielectric materials

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Polymer Composite and Nanocomposite Dielectric Materials for Pulse Power Energy Storage

https://cyberleninka.org/article/n/1082452.pdf

Invited review: Enteric methane in dairy cattle production: Quantifying the opportunities and impact of reducing emissions

Water probably flowed across ancient Mars, but whether it ever exists as a liquid on the surface today remains debatable. Recurring slope lineae (RSL) are narrow (0.5 to 5 meters), relatively dark markings on steep (25° to 40°) slopes; repeat images from the Mars Reconnaissance Orbiter High Resolution Imaging Science Experiment show them to appear and incrementally grow during warm seasons and fade in cold seasons. They extend downslope from bedrock outcrops, often associated with small channels, and hundreds of them form in some rare locations. RSL appear and lengthen in the late southern spring and summer from 48°S to 32°S latitudes favoring equator-facing slopes, which are times and places with peak surface temperatures from ~250 to 300 kelvin. Liquid brines near the surface might explain this activity, but the exact mechanism and source of water are not understood.

https://science.sciencemag.org/content/sci/333/6043/740.full.pdf

Seasonal Flows on Warm Martian Slopes

Contributors.Preface.1 Introduction (Richard K. Ulrich).1.1 Status and Trends in Discrete Passive Components.1.2 Definitions and Configurations of Integrated Passives.1.3 Comparison to Integrated Active Devices.1.4 Substrates and Interconnect Systems for Integrated Passives.1.5 Fabrication of Integrated Passives.1.6 Reasons for Integrating Passive Devices.1.7 Problems with Integrating Passive Devices.1.8 Applications for Integrated Passives.1.9 The Past and Future of Integrated Passives.1.10 Organization of this Book.References.2 Characteristics and Performance of Planar Resistors (Richard K. Ulrich).2.1 Performance Parameters.2.2 Resistance in Electronic Materials.2.3 Sizing Integrated Resistors.2.4 Trimming.References.3 Integrated Resistor Materials and Processes (Richard K. Ulrich).3.1 Single-Component Metals.3.2 Metal Alloys and Metal-Nonmetal Compounds.3.3 Semiconductors.3.4 Cermets.3.5 Polymer Thick Film.3.6 Ink Jet Deposition.3.7 Commercialized Processes.3.8 Summary.References.4 Dielectric Materials for Integrated Capacitors (Richard K. Ulrich).4.1 Polarizability and Capacitance.4.2 Capacitance Density.4.3 Temperature Effects.4.4 Frequency and Voltage Effects.4.5 Aging Effects.4.6 Composition and Morphology Effects.4.7 Leakage and Breakdown.4.8 Dissipation Factor.4.9 Comparison to EIA Dielectric Classifications.4.10 Matching Dielectric Materials to Applications.References.5 Size and Configuration of Integrated Capacitors (Richard K. Ulrich).5.1 Comparison of Integrated and Discrete Areas.5.2 Layout Options.5.3 Tolerance.5.4 Mixed Dielectric Strategies.5.5 CV Product.5.6 Maximum Capacitance Density and Breakdown Voltage.References.6 Processing Integrated Capacitors (Richard K. Ulrich).6.1 Sputtering.6.2 CVD, PECVD and MOCVD.6.3 Anodization.6.4 Sol-Gel and Hydrothermal Ferroelectrics.6.5 Thin- and Thick-Film Polymers.6.6 Thick-Film Dielectrics.6.7 Interlayer Insulation.6.8 Interdigitated Capacitors.6.9 Capacitor Plate Materials.6.10 Trimming Integrated Capacitors.6.11 Commercialized Integrated Capacitor Technologies.6.12 Summary.References.7 Defects and Yield Issues (Richard K. Ulrich).7.1 Causes of Fatal Defects in Integrated Capacitors.7.2 Measurement of Defect Density.7.3 Defect Density and System Yield.7.3.1 Predicting Yield from Defect Density.7.4 Yield Enhancement Techniques for Capacitors.7.5 Conclusions.References.8 Electrical Performance of Integrated Capacitors (Richard K. Ulrich and Leonard W. Schaper).8.1 Modeling Ideal Passives.8.2 Modeling Real Capacitors.8.3 Electrical Performance of Discrete and Integrated Capacitors.8.4 Dissipation Factor of Real Capacitors.8.5 Measurement of Capacitor Properties.8.6 Summary.References.9 Decoupling (Leonard W. Schaper).9.1 Power Distribution.9.2 Decoupling with Discrete Capacitors.9.3 Decoupling with Integrated Capacitors.9.4 Dielectrics and Configurations for Integrated Decoupling.9.5 Integrated Decoupling as an Entry Application.References.10 Integrated Inductors (Geert J. Carchon and Walter De Raedt).10.1 Introduction.10.2 Inductor Behavior and Performance Parameters.10.3 Inductor Performance Prediction.10.4 Integrated Inductor Examples.10.5 Use of Inductors in Circuits: Examples.10.6 Conclusions.Acknowledgments.References.11 Modeling of Integrated Inductors and Resistors for Microwave Applications (Zhenwen Wang, M. Jamal Deen, and A. H. Rahal).11.1 Introduction.11.2 Modeling of Spiral Inductors.11.3 Modeling of Thin-Film Resistors.11.4 Conclusions.References.Appendix: Characteristics of Microscript Lines.12 Other Applications and Integration Technologies (Elizabeth Logan, Geert J. Carchon, Walter De Raedt, Richard K. Ulrich, and Leonard W. Schaper).12.1 Demonstration Devices Fabricated with Integrated Passives.12.2 Commercialized Thin-Film Build-Up Integrated Passives.12.3 Other Integrated Passive Technologies.12.4 Summary.Acknowledgments.References.13 The Economics of Embedded Passives (Peter A. Sandborn).13.1 Introduction.13.2 Modeling Embedded Passive Economics.13.3 Key Aspects of Modeling Embedded Passive Costs.13.4 Example Case Studies.13.5 Summary.Acknowledgments.References.14 The Future of Integrated Passives (Richard K. Ulrich).14.1 Status of Passive Integration.14.2 Issues for Implementation on Organic Substrates.14.3 Progress on Board-Level Implementation.14.4 Three Ways In for Organic Boards.14.5 Conclusion.Index.About the Editors.

Integrated Passive Component Technology

Chapter 1: Introduction and overview of microelectronic packaging. Chapter 2: Materials for microelectronic packaging. Chapter 3: Processing technologies. Chapter 4: Organic printed circuit board materials and processes. Chapter 5: Ceramic substrates. Chapter 6: Electrical considerations, modeling, and simulation. Chapter 7: Thermal considerations. Chapter 8: Mechanical design considerations. Chapter 9: Discrete and embedded passive devices. Chapter 10: Electronic package assembly. Chapter 11: Design considerations. Chapter 12: Radio frequency and microwave packaging. Chapter 13: Power electronics packaging. Chapter 14: Multichip and three-dimensional packaging. Chapter 15: Packaging of MEMS and MOEMS: challenges and a case study. Chapter 16: Reliability considerations. Chapter 17: Cost evaluation and analysis. Chapter 18: Analytical techniques for materials characterization.

Advanced electronic packaging

Greenhouse gas emissions from milk production and consumption in the United States: A cradle-to-grave life cycle assessment circa 2008

A life cycle assessment was conducted to determine a baseline for environmental impacts of cheddar and mozzarella cheese consumption Product loss/waste, as well as consumer transport and storage, is included The study scope was from cradle-to-grave with particular emphasis on unit operations under the control of typical cheese-processing plants SimaPro© 73 (PRe Consultants, The Netherlands, 2013) was used as the primary modeling software The ecoinvent life cycle inventory database was used for background unit processes (Frischknecht and Rebitzer, J Cleaner Prod 13(13–14):1337–1343, 2005), modified to incorporate US electricity (EarthShift 2012) Operational data was collected from 17 cheese-manufacturing plants representing 24 % of mozzarella production and 38 % of cheddar production in the USA Incoming raw milk, cream, or dry milk solids were allocated to coproducts by mass of milk solids Plant-level engineering assessments of allocation fractions were adopted for major inputs such as electricity, natural gas, and chemicals Revenue-based allocation was applied for the remaining in-plant processes Greenhouse gas (GHG) emissions are of significant interest For cheddar, as sold at retail (632 % milk solids), the carbon footprint using the IPCC 2007 factors is 860 kg CO2e/kg cheese consumed with a 95 % confidence interval (CI) of 586–122 kg CO2e/kg For mozzarella, as sold at retail (514 % milk solids), the carbon footprint is 728 kg CO2e/kg mozzarella consumed, with a 95 % CI of 513–989 kg CO2e/kg Normalization of the results based on the IMPACT 2002+ life cycle impact assessment (LCIA) framework suggests that nutrient emissions from both the farm and manufacturing facility wastewater treatment represent the most significant relative impacts across multiple environmental midpoint indicators Raw milk is the major contributor to most impact categories; thus, efforts to reduce milk/cheese loss across the supply chain are important On-farm mitigation efforts around enteric methane, manure management, phosphorus and nitrogen runoff, and pesticides used on crops and livestock can also significantly reduce impacts Water-related impacts such as depletion and eutrophication can be considered resource management issues—specifically of water quantity and nutrients Thus, all opportunities for water conservation should be evaluated, and cheese manufacturers, while not having direct control over crop irrigation, the largest water consumption activity, can investigate the water use efficiency of the milk they procure The regionalized normalization, based on annual US per capita cheese consumption, showed that eutrophication represents the largest relative impact driven by phosphorus runoff from agricultural fields and emissions associated with whey-processing wastewater Therefore, incorporating best practices around phosphorous and nitrogen management could yield improvements

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Richard K. Ulrich

Papers

Integrated Passive Component Technology

Advanced electronic packaging

Greenhouse gas emissions from milk production and consumption in the United States: A cradle-to-grave life cycle assessment circa 2008

Life cycle assessment of cheese and whey production in the USA

Regional analysis of greenhouse gas emissions from USA dairy farms: A cradle to farm-gate assessment of the American dairy industry circa 2008