An apparatus for manufacturing an organic electroluminescence display having an alignment chamber for aligning a mask having openings corresponding to a predetermined pattern with a substrate on which a first electrode layer is formed and detachably attaching the mask and the substrate. The apparatus further including a number of vacuum processing chambers for sequentially forming a number of organic material layers on the substrate attached with the mask. The apparatus also including a transfer robot for transferring the attached mask and substrate to one of the number of vacuum processing chambers and sequentially transferring it between the number of the vacuum processing chambers.

Apparatus and method for manufacturing an organic electroluminescence display

In electrostatographic apparatus, the ratio of toner particle electrostatic charge-to-toner particle mass and the development rate are determined by providing a piezo device positioned to interact with toner particles. The device is periodically electrically biased to attract toner particles, and the frequency shift of the piezo device due to the mass of attracted toner particles is detected. The electrostatic charge buildup on the electrode due to the attracted toner particles is detected to determine the mass of toner. The potential on the device may be changed periodically from a potential which attracts toner to a potential which repels toner to clean the device.

Determination of charge-to-mass ratio

In the continuous vapor deposition coating of a metal strip, the coating amount can be rapidly changed by keeping the vapor flow at acoustic velocity and changing the cross-sectional area of the vapor path

Method of rapidly changing deposition amount in a continuous vacuum deposition process

An apparatus for automatically controlling the rate of vacuum deposition of thin films on a substrate, consisting of an optical diaphragm or shutter in the form of two overlapping plates which together define a shutter opening between an evaporation crucible and a substrate The overlapping plates are attached to a pair of rack gears to be moved in opposite directions by a pinion gear to vary the size of the shutter opening through which the evaporated material must pass to be deposited on the substrate The rate of evaporation is sensed by a quartz crystal monitor and a signal therefrom is compared to a reference signal The difference between the two signals is used to control the movement of the apertured plates thereby correcting the rate of deposition of the thin film

Automatic variable rate evaporation source for thin film deposition

A slider of the type for use with a rotatable magnetic disk is disclosed. The slider has two ends and a bottom surface which includes an air bearing surface. An adhesive layer and continuous coating of carbon is located on the air bearing surface. A method of sputter depositing this continuous layer of carbon upon the air bearing surface of the slider is also provided. The continuous layer of carbon is crown-shaped and deposited using the sputtering technique. The carbon is directed from a source at the air bearing surface of a slider. A mask is placed between the source and slider so that the carbon is deposited in a crown shape. When the slider is viewed from front to rear the maximum depth of the coating is less than about 6 to 10 nm, while at the ends of the slider the coating depth is near 0 nm. The resistivity of the protective carbon layer is controlled for the additional benefit of protection from damages by electrostatic discharge.

Method of manufacturing a slider having a carbon overcoat and an electrically conductive adhesive layer

Apparatus for sensing deposition of a thin film layer of a material from a source onto a substrate having a carriage assembly including a predetermined number of apertures for selectively passing predetermined portions of a material from the source along each of a plurality of predetermined paths located in the proximity of the substrate under conditions correlated to that under which the material is deposited through a deposition path onto the substrate, inhibiting elements positioned relative to the carriage assembly for selectively inhibiting passage of predetermined portions of the material through a selected number of the predetermined number of the apertures, and a monitior for monitoring a selected parameter of the thin film material which is passed through other than the selected number of apertures of the carriage assembly wherein the monitor includes a plurality of detectors one of each of which is positioned along one of the plurality of predetermined paths and being adapted to sense a predetermined portion of a thin film material being passed along its associated predetermined path and for producing electrical signals derived from the selected parameter representating at least one of the mass per unit area, thickness and deposition rate of the thin film material is shown. A method for measuring at least one of the mass per unit area, thickness and deposition rate of a thin film layer being deposited through a deposition mask selected from a plurality of deposition masks adapted to be positioned between a substrate and a source is also shown.

Richard T. Martin

Papers

Apparatus for sensing deposition of a thin film layer of a material