A semiconductor burn-in thermal management system for providing an effective thermal management system capable of maintaining a desired semiconductor temperature during a burn-in cycle. The semiconductor burn-in thermal management system includes a reservoir for storing a volume of fluid, a pump fluidly connected to the reservoir, and a plurality of spray units fluidly connected to the pump. The spray units dispense the fluid upon the surface of the semiconductor during burn-in thereby maintaining a relatively constant surface temperature. Each of the spray units preferably includes a stationary first portion with a second portion movably positioned within the first portion in a biased manner. When burning in semiconductors without an integrated heat sink that are deeply recessed within the sockets of a burn-in board, the fluid pressure to the second portion is increased thereby extending the second portion from the first portion thereby reducing the effective distance from the surface of the semiconductor.

Semiconductor burn-in thermal management system

In controlledly cooling steel strip in a continuous annealing line, the heat transfer rate needed for attaining the desired cooling rate is calculated from an equation including strip thickness, the cooling starting and finishing temperatures, and the desired cooling rate, and the obtained heat transfer rate is corrected according to the effect of natural cooling in idle-pass zones preceding and following the coolant spray zone. The flow rate of coolant is determined and set by using an equation expressing the predetermined relationship between the heat transfer rate and coolant flow rate. The length of the coolant spraying region extending in the direction of strip travel is calculated from the running speed of the strip, the cooling starting and finishing temperatures, and the desired cooling rate. The nozzles are set to turn on and off so that the coolant is sprayed from such a number of nozzles as correspond to the length of the spraying region thus calculated. Based on these settings, the coolant flow rate is corrected by re-calculating the heat transfer rate when strip thickness varies in the course of controlled cooling. Also, the on-off pattern of the nozzles is corrected by re-calculating the length of the coolant spraying region when the running speed of the strip varies.

Method of controlled cooling for steel strip

Method and apparatus are disclosed for accurately controlling the temperature of a moving metal strip in a continuous heat treating operation. A plurality of temperature sensors are located at fixed intervals along the path of the metal strip through the heat treating apparatus, e.g., the cooling tunnel following an annealing oven, employed to control the application or extraction of heat and thereby the rate of temperature change of the strip. Errors in sensor readings are compensated by secondary averaging of adjacent temperature differential measurements to provide a more accurate temperature control.

Method for metal strip temperature control

The disclosure of the present invention relates to a strip temperature control method and apparatus for a finishing train of a hot strip rolling mill, including strip interstand coolant supply means, and a control for varying the rate of flow thereof, which includes a feed-forward control signal wherein the rate of flow is controlled in certain stands with reference to a computed temperature and a desired temperature of the strip as it leaves the train, and a feed-backward control signal wherein the rate of flow is controlled in one or more stands with reference to the actual temperature and a desired temperature as it leaves the train

Coolant control for hot strip mill

To cool a strip rolled by a hot rolling mill using cooling banks installed on the run out table at the delivery side of the hot rolling mill, and to control the strip temperature in front of coiler to a preset target temperature, the strip is conceptually divided into segments or cooling units which have a length equal to the length of a single cooling bank, the temperatures of the segments are predicted, and the cooling banks are so controlled as to have the prediction temperatures coincide with preset target temperature. In this case, a feed-forward control of the cooling water flow rate in the cooling banks are made so that predictive temperatures on a real time basis of the temperatures of the cooling segments at the time when the segments are staying in the respective cooling banks coincide with the target temperatures.

Coiling temperature control method and system

Cooling of hot rolled strip material, such as low carbon steel strip, is controlled while the strip moves along a rolling mill runout table. The table is provided with a plurality of selectable spray banks, each bank applying the same unit amount of liquid coolant from a low pressure source. A time-sharing mill computer receiving operating information signals selects a number of spray banks based on a feed forward calculation of a cooling factor and a calculation of a predicted cooling error term, the latter term being based on stored signals from previous strips cooled. Control means, including a full time special purpose computer, establishes the minimal unit amount of coolant application. When spray bank selection is held constant, this computer takes over the control function and varies the minimal unit amount of coolant proportional to strip velocity error and strip discharging temperature error during strip cooling.

Rimas A Zinas

Papers

Apparatus and method for controlling accelerated cooling of hot rolled strip material