Hydrophobic coating compositions are provided as are processes to coat articles with the compositions. Extremely hydrophobic coatings are provided by the compositions. Durable, weatherable and scratch-resistant coatings are provided by compositions comprising a trifluoromethyl-containing component and a hardenable material. Processes are also provided for forming hydrophobic coatings on articles without any substantial loss of fluorocarbon solvent used in the coating composition. Articles are coated on a surface thereof with a hydrophobic coating reactant or reaction product which forms a coating having an exposed surface populated with 30% by area or more terminal trifluoromethyl groups.

Hydrophobic coating compositions, articles coated with said compositions, and processes for manufacturing same

An enhanced reactive plasma processing method and system useful for deposition of highly insulating films. A variety of alternative embodiments are allowed for varying applications. In one embodiment, a tapped inductor is switched to ground or some common level to achieve substantial voltage reversal of about 10% upon detection of an arc condition. This reversal of voltage is maintained long enough to either afford processing advantages or to allow restoration of uniform charge density within the plasma prior to restoration of the initial driving condition. A technique for preventing arc discharges involving periodically either interrupting the supply of power or reversing voltage is effected through a timer system in the power source.

Enhanced reactive DC sputtering system

A sputtering system (50) using an AC power supply (59) in the range of 10 kHz to 100 kHz uses two rotatable cylindrical magnetrons (60, 62). The rotatable cylindrical magnetrons (60, 62), when used for depositing a dielectric layer onto a substrate (80), clean off dielectric material that is deposited onto the target (64, 65). This prevents a dielectric layer on the target (64, 65) from acting like a capacitor and may help avoid arcing. Additionally, an impedance-limiting capacitor (58) can be placed in series in the electrical path between the targets (64, 65) through the transformer (54) so as to reduce arcing. This impedance-limiting capacitor (58) has a value much larger than the capacitor used to couple the power supply (59) to a target (64, 65) in radio frequency sputtering systems.

Sputtering system using cylindrical rotating magnetron electrically powered using alternating current

"The Foundations of Vacuum Coating Technology" is a concise review of the developments that have led to the wide variety of applications of this technology. This book is a must have for materials scientists and engineers working with vacuum coating in the invention of new technologies or applications in all industries. With over 370 references, this is an excellent starting point for those who don't want to reinvent the wheel. In particular, the book is a valuable reference for those interested in researching proposed or existing patents. This unique book provides a starting point for more in-depth surveys of past and recent work in all aspects of vacuum coating.The author uses his extensive knowledge of the subject to draw comparisons and place the information into the proper context. This is particularly important for the patent literature where the terminology does not always match industry jargon. A section of acronyms for vacuum coating and glossary of terms at the end of the book are critical additions to the information every reader needs.

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The Foundations of Vacuum Coating Technology

The time evolution of the electron density Ne, effective electron temperature Teff, floating Vf and plasma potential Vp has been measured using a Langmuir probe in a mid-frequency bipolar pulsed DC magnetron system. The measurements were made at the position of the substrate for pulse frequencies of 50 and 100 kHz, and a duty cycle of 80%. Non-reactive sputtering of an Al target in argon at a pressure of 0.27 Pa was performed. On the application of the duty power ('pulse on'), a burst of 'hot' or 'beam-like electrons' are detected with Teff~20 and 8 eV for pulse frequencies of 50 and 100 kHz, respectively. Approximately 1 mus later, secondary energetic, but cooler groups are seen. During the rest of the duty cycle, Teff remains roughly constant, however, above the value obtained in the DC equivalent conditions, (there is a 25% increase in time-averaged value of Teff at 50 kHz and 33% at 100 kHz). During the positive voltage reversal ('pulse off'), Teff decays slowly with a characteristic cooling time of approximately 20 mus. However, in this phase, Ne falls by approximately an order of magnitude with a decay time constant of approximately 1 mus. As well as electron heating, measurements show pulsing the discharge increases the time averaged electron density, (21% at 50 kHz and 18% at 100 kHz). The presence of energetic electrons detected at the probe is discussed in terms of their acceleration in the rapidly expanding cathode sheath and subsequent transport both along and across the magnetic field. A simple model for the observed net electron heating due to pulsing of the cathode sheath is proposed and the effect of denser and more energetic plasmas on the flux and energy flux of impinging ions at the substrate is also discussed.

Time-resolved Langmuir probe measurements at the substrate position in a pulsed mid-frequency DC magnetron plasma

An improved method is described for coating a substrate in a system in which an insulating layer is also formed on one portion of a conductive target plate which is bombarded with ions. One such system is a reactive sputtering system in which a predetermined partial pressure of a reactive gas is established between a reactive metal target plate and the substrate. The bombarding ions are formed in a glow discharge plasma which may be magnetically confined. In accordance with the invention, an ac potential is applied to the target plate in order to prevent arcing which is believed due to the dielectric breakdown of the insulating layer.

Robert L Cormia

Papers

Method for coating a substrate

Verfahren zur beschichtung eines substrats

Verfahren zur beschichtung eines substrats mit einer lage polymeren materials