A system for providing wireless, charging power and/or primary power to electronic/electrical devices is described whereby microwave energy is employed. Microwave energy is focused by a power transmitter comprising one or more adaptively-phased microwave array emitters onto a device to be charged. Rectennas within the device to be charged receive and rectify the microwave energy and use it for battery charging and/or for primary power. A locator signal generated by the device to be charged is analyzed by the system to determine the location of the device to be charged relative to the microwave array emitters, permitting the microwave energy to be directly specifically towards the device to be charged. Backscatter detectors respond to backscatter energy reflected off of any obstacle between the device to be charged and the microwave array emitters. Power to any obstructed microwave array emitter is reduced until the obstruction is removed. Optionally, data can be modulated onto microwave energy beams produced by the array emitters and demodulated by the device, thereby providing means of data communication from the power transmitter to the device. Similarly, data can be modulated onto the locator signal and demodulated in the power transmitter, thereby providing means of data communication from the device to the power transmitter.

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Charging of devices by microwave power beaming

Ink-jet pens having multiple print heads are manufactured with readily replaceable unit print head assemblies that facilitate testing of print head performance prior to complete assembly of the pen.

Unit print head assembly for ink-jet printing

An electrospray device, a liquid chromatography device and an electrospray-liquid chromatography system are disclosed. The electrospray device comprises a substrate defining a channel between an entrance orifice on an injection surface and an exit orifice on an ejection surface, a nozzle defined by a portion recessed from the ejection surface surrounding the exit orifice, and an electrode for application of an electric potential to the substrate to optimize and generate an electrospray; and, optionally, additional electrode(s) to further modify the electrospray. The liquid chromatography device comprises a separation substrate defining an introduction channel between an entrance orifice and a reservoir and a separation channel between the reservoir and an exit orifice, the separation channel being populated with separation posts perpendicular to the fluid flow; a cover substrate bonded to the separation substrate to enclose the reservoir and the separation channel adjacent the cover substrate; and, optionally, electrode(s) for application of a electric potential to the fluid. The exit orifice of the liquid chromatography device may be homogeneously interfaced with the entrance orifice of the electrospray device to form an integrated single system. An array of multiple systems may be fabricated in a single monolithic chip for rapid sequential fluid processing and generation of electrospray for subsequent analysis, such as by positioning the exit orifices of the electrospray devices near the sampling orifice of a mass spectrometer.

Integrated monolithic microfabricated electrospray and liquid chromatography system and method

A thermal ink jet recording apparatus includes at least a substrate having a gap disposed over an ink reservoir on a base in communication with an ink source. A film circuit of electrodes and heating elements is formed on each substrate. A nozzle plate covering the substrates has a lower step portion and a upper step portion. The upper step portion includes nozzles substantially directly above and corresponding to the plurality of heating elements. Ink which is used for this apparatus includes ionic or non-ionic surface active agents for increasing permeability of the ink on a recording medium.

Thermal jet recording apparatus

This expanded and thoroughly revised edition of Thomas H. Lee's acclaimed guide to the design of gigahertz RF integrated circuits features a completely new chapter on the principles of wireless systems. The chapters on low-noise amplifiers, oscillators and phase noise have been significantly expanded as well. The chapter on architectures now contains several examples of complete chip designs that bring together all the various theoretical and practical elements involved in producing a prototype chip. First Edition Hb (1998): 0-521-63061-4 First Edition Pb (1998); 0-521-63922-0

The Design of CMOS Radio-Frequency Integrated Circuits: RF CIRCUITS THROUGH THE AGES

A passivation layer in a thermal ink jet printhead is formed or "grown" by a reaction between the materials of the ink jet structure to be protected and an element which will form a chemically inert, electrically insulating, thermally conductive compound. The resistor structure may be of tantalum or tantalum nitride and the electrical conductors therefor may be of aluminum. By subjecting this resistor-conductor structure to a reactive oxide atmosphere, the exposed surfaces of both are anodized so that a surface film of aluminum oxide is formed on the aluminum conductor and a surface film of tantalum pentoxide or tantalum oxynitride is formed on the resistor structure.

Thermal ink jet printhead with self-passivating elements

This application discloses a thermal ink jet printhead and method of manufacture featuring an improved all-metal orifice plate and barrier layer assembly. This assembly includes constricted ink flow ports to reduce cavitation damage and smooth contoured convergent ink ejection orifices to prevent "gulping" of air during an ink ejection process. Both of these features extend the maximum operating frequency, fmax, of the printhead. The nickle barrier layer and the underlying thin film resistor substrate are gold plated and then soldered together to form a good strong solder bond at the substrate-barrier layer interface.

Barrier layer and orifice plate for thermal ink jet printhead assembly

This application discloses a thermal ink jet printhead and method of manufacture featuring an improved all-metal orifice plate and barrier layer assembly. This assembly includes constricted ink flow ports to reduce cavitation damage and smooth contoured convergent ink ejection orifices to prevent "gulping" of air during an ink ejection process. Both of these features extend the maximum operating frequency, fmax, of the printhead. The nickel barrier layer and the underlying thin film resistor substrate are gold plated and then soldered together to form a good strong solder bond at the substrate - barrier layer interface.

Barrier layer and orifice plate for thermal ink jet print head assembly and method of manufacture

Apparatus and method for testing and determining the operating status of a plurality of ink-ejecting nozzles in a thermal ink jet array. An electrically conductive plate is placed adjacent the ink-ejecting orifices in a test position. An ink droplet appearing from an orifice will, for some brief moment, be in contact with both the orifice plate and the electrically conductive plate. The droplet completes a circuit with a conduction detector and allows current to flow thereby indicating an operative nozzle.

Nozzle test apparatus and method for thermal ink jet systems

A resistive heater is disclosed which comprises two 
spaced resistive elements (8′, 8″) separated by a gap so that 
cavitation of an ink bubble occurs over the gap, thereby mini­
mizing damage to the resistive elements.

Robert R. Hay

Papers

Thermal ink jet printhead with self-passivating elements

Barrier layer and orifice plate for thermal ink jet printhead assembly

Barrier layer and orifice plate for thermal ink jet print head assembly and method of manufacture

Nozzle test apparatus and method for thermal ink jet systems

Resistor structures for thermal ink jet printers