Various methods and systems for utilizing design data in combination with inspection data are provided. One computer-implemented method for binning defects detected on a wafer includes comparing portions of design data proximate positions of the defects in design data space. The method also includes determining if the design data in the portions is at least similar based on results of the comparing step. In addition, the method includes binning the defects in groups such that the portions of the design data proximate the positions of the defects in each of the groups are at least similar. The method further includes storing results of the binning step in a storage medium.

Methods and systems for utilizing design data in combination with inspection data

Methods and systems for determining a critical dimension and overlay of a specimen

Methods and systems for determining a critical dimension and a thin film characteristic of a specimen

In one aspect, the present invention is a technique of, and a system and sensor for measuring, inspecting, characterizing and/or evaluating optical lithographic equipment, methods, and/or materials used therewith, for example, photomasks. In one embodiment, the system, sensor and technique measures, collects and/or detects an aerial image produced or generated by the interaction between the photomask and lithographic equipment. An image sensor unit may measure, collect, sense and/or detect the aerial image in situ—that is, the aerial image at the wafer plane produced, in part, by a product-type photomask (i.e., a wafer having integrated circuits formed during the integrated circuit fabrication process) and/or by associated lithographic equipment used, or to be used, to manufacture of integrated circuits. In this way, the aerial image used, generated or produced to measure, inspect, characterize and/or evaluate the photomask is the same aerial image used, generated or produced during wafer exposure in integrated circuit manufacturing. In another embodiment, the system, sensor and technique characterizes and/or evaluates the performance of the optical lithographic equipment, for example, the optical sub-system of such equipment. In this regard, in one embodiment, an image sensor unit measures, collects, senses and/or detects the aerial image produced or generated by the interaction between lithographic equipment and a photomask having a known, predetermined or fixed pattern (i.e., test mask). In this way, the system, sensor and technique collects, senses and/or detects the aerial image produced or generated by the test mask—lithographic equipment in order to inspect, evaluate and/or characterize the performance of the lithographic equipment.

System and method for lithography process monitoring and control

The broadband brightfield/darkfield wafer inspection system provided receives broadband brightfield illumination information via a defect detector, which signals for initiation of darkfield illumination. The defect detector forms a two dimensional histogram of the defect data and a dual mode defect decision algorithm and post processor assess defects. Darkfield radiation is provided by two adjustable height laser beams which illuminate the surface of the wafer from approximately 6 to 39 degrees. Each laser is oriented at an azimuth angle 45 degrees from the orientation of the manhattan geometry on the wafer, and 90 degrees in azimuth from one another. Vertical angular adjustability is provided by modifying cylindrical lens position to compensate for angular mirror change by translating an adjustable mirror, positioning the illumination spot into the sensor field of view, rotating and subsequently moving the cylindrical lens. A brightfield beamsplitter in the system is removable, and preferably replaced with a blank when performing darkfield illumination. Light level control for the system is provided by a dual polarizer first stage. Light exiting from the second polarizer passes through a filter which absorbs a portion of the light and comprises the second stage of light control. The beam then passes through a polarizing beamsplitter. The second channel is further reflected and polarized and both beams thereafter illuminate the substrate.

High throughput brightfield/darkfield wafer inspection system using advanced optical techniques

Apparatus for generating optical radiation includes a laser, which is configured to operate in multiple transverse modes simultaneously so as to generate an input beam, which is characterized by a first speckle contrast. The transverse modes of the input beam are optically mixed so as to generate an output beam have a second speckle contrast, which is substantially less than the first speckle contrast.

Illumination system for optical inspection

A system for inspecting a specimen, such as a semiconductor wafer that uses a laser light source for providing a beam of light. The beam is applied to a traveling lens acousto-optic device having an active region and responsive to an RF input signal to selectively generate plural traveling lenses in the active region. The traveling lens acousto-optic device is operative to receive the light beam and generate plural flying spot beams, at the respective focus of each of the generated traveling lenses. A light detector unit, having a plurality of detector sections, each detector section having a plurality of light detectors and at least one multi-stage storage device operative to receive in parallel an input from the plurality of light detectors, is used to generate useable scan data. Information stored in each of the storage devices is serially read out concurrently from the multiple stages.

Wafer defect detection system with traveling lens multi-beam scanner

Scanning method and apparatus for maintaining a desired position of an article are presented. The apparatus comprises an illumination unit, a focusing optics and a focus detection unit. The illumination unit generates an incident light beam for illuminating an elongated region of the article and producing light returned from the illuminated region. The focusing optics focuses the incident beam onto a focal plane and collects at least a portion of the returned light. The focus detection unit comprises an imaging optics and a detector having a sensing surface responsive to light impinging thereon for generating data representative thereof. The imaging optics is capable of forming first and second images on the sensing surface. The first and second images are formed by first and second spatially separated substantially identical light components of the collected returned light, respectively, which propagate symmetrically relative to an optical axis of the focusing optics. A position of the first image relative to the second image is indicative of the position of the article relative to the focal plane.

Focus error correction method and apparatus

Method and apparatus for optical inspection of an article are presented. The apparatus comprises an illumination unit and at least one detection unit. The illumination unit generates an incident beam and directs it onto a predetermined region of the article. The detection unit includes a light collection system and a detector. The light collection system collects light scattered from the illuminated region with a predetermined constant maximum collection angle, and utilizes a variable angle design for selectively selecting from collected light at least one light component propagating with a solid angle segment of the maximum collection angle, and directing it to the detector.

Optical inspection method and apparatus utilizing a variable angle design

System for scanning a surface, comprising a light source producing an illuminating light beam; an objective lens assembly, located between the light source and the surface; a plurality of interchangeable telescopes, a selected one of the interchangeable telescopes being located between the light source and the objective lens assembly; and at least one light detector, wherein at least one of the light detectors detects at least a portion of a reflected light beam, reflected from the surface and received from the selected telescope.

Ron Naftali

Papers

Illumination system for optical inspection

Wafer defect detection system with traveling lens multi-beam scanner

Focus error correction method and apparatus

Optical inspection method and apparatus utilizing a variable angle design

Method and system for detecting defects