A technique for forming a film of material (12) from a donor substrate (10). The technique has a step of introducing energetic particles (22) through a surface of a donor substrate (10) to a selected depth (20) underneath the surface, where the particles have a relatively high concentration to define a donor substrate material (12) above the selected depth. An energy source is directed to a selected region of the donor substrate to initiate a controlled cleaving action of the substrate (10) at the selected depth (20), whereupon the cleaving action provides an expanding cleave front to free the donor material from a remaining portion of the donor substrate.

Controlled cleaving process

A technique for forming a film of material ( 12 ) from a donor substrate ( 10 ). The technique has a step of forming a stressed region in a selected manner at a selected depth ( 20 ) underneath the surface. An energy source such as pressurized fluid is directed to a selected region of the donor substrate to initiate a controlled cleaving action of the substrate ( 10 ) at the selected depth ( 20 ), whereupon the cleaving action provides an expanding cleave front to free the donor material from a remaining portion of the donor substrate.

Method and device for controlled cleaving process

A technique for forming a film of material (12) from a donor substrate (10). The technique has a step of introducing energetic particles (22) in a selected manner through a surface of a donor substrate (10) to a selected depth (20) underneath the surface, where the particles have a relatively high concentration to define a donor substrate material (12) above the selected depth and the particles for a pattern at the selected depth. An energy source such as pressurized fluid is directed to a selected region of the donor substrate to initiate a controlled cleaving action of the substrate (10) at the selected depth (20), whereupon the cleaving action provides an expanding cleave front to free the donor material from a remaining portion of the donor substrate.

Controlled cleavage process using pressurized fluid

A cleaving tool provides pressurized gas to the edge of a substrate in combination with a sharpened edge to cleave the substrate at a selected interface. The edge of the tool is tapped against the perimeter of a substrate, such as a bonded substrate, and a burst of gas pressure is then applied at approximately the point of contact with the edge of the tool. The combination of mechanical force and gas pressure separates the substrate into two halves at a selected interface, such as a weakened layer in a donor wafer.

Nozzle for cleaving substrates

A technique for forming a film of material (12) from a donor substrate (10). The technique has a step of introducing energetic particles (22) in a selected manner through a surface of a donor substrate (10) to a selected depth (20) underneath the surface, where the particles have a relatively high concentration to define a donor substrate material (12) above the selected depth and the particles for a pattern at the selected depth. An energy source is directed to a selected region of the donor substrate to initiate a controlled cleaving action of the substrate (10) at the selected depth (20), whereupon the cleaving action provides an expanding cleave front to free the donor material from a remaining portion of the donor substrate.

Controlled cleavage process and device for patterned films

The mechanical properties of a metal matrix composite material e.g. a bar 12 depend upon both the proportion of filler and the proportion of voids or pores. The filler proportion and the porosity can be assessed non-destructively by causing ultrasonic waves to propagate through a specimen, and measuring both the wave velocity and attenuation in the specimen. These measured values are compared (for example graphically) with those obtained with material of known filler volume fraction and porosity, and hence the unknown values determined. The apparatus 10 includes a tank 14 containing water 16 (as a coupling fluid). The tank has leaky seals 18. Two transducers 20, 22 are provided and a computer 24 is used to provide the results.

Ronald Leslie Smith

Papers

Ultrasonic testing of metal-matrix composite materials