栄一 鳥養

TL;DR: In this article, the substitution type gold electroless plating liq. is proposed, which is capable of forming the gold film free from pinhole, uniform and dense, whose deposition rate is hardly affected by the electroless Ni plating film of a substrate and whose such characteristic is maintained over a long period of time.

TL;DR: In this article, an electrochemical film material for sealing and reinforcing a fluorine base ion exchange membrane by forming a thin film of a high molecular solid electrolyte on one side of an oriented and porous sheet of polytetrafluoroethylene is presented.

TL;DR: In this article, a solution for treating copper foil of circuit board multilayer printed wiring board is composed of an aqueous solution or emulsified solution containing at least one kind of compound selected out of an aminothiazole compound and aminobenzothiazoles compound.

TL;DR: In this article, the authors proposed an electroless palladium plating liquid which can be used in an industrial scale, and the plating bath is hydrophosphorus acid type containing (1) 0.001-0.1mol/l palladium compd., (2) at least one kind of hydrophophosphite compd. by 0.01-1mol /l, and (3) atm alkylamine and satd.

TL;DR: In this article, the authors proposed a method to make it possible to continuously use an electroless gold plating soln. over a long period of time while maintaining a constant plating rate and uniformity of deposited films by keeping the concn. of cyanide ions in the soln within a certain range.