A multi-level power amplifier architecture using a multi-tap transformer implemented on a single CMOS integrated circuit wireless communications device is described. By providing a multi-tap transformer for coupling a plurality of power amplifiers to a shared output impedance, such as an antenna, power transmission may be made at different levels while maintaining efficiency. With a multi-tap transformer having “N” taps featuring “N” different impedance levels, each tap may be connected to an amplifier cell which delivers power into the transformer at the tap for coupling to the output load. Any one of the “N” amplifier cells can be turned on at once along with any combination of the “N” amplifier cells.

Multilevel power amplifier architecture using multi-tap transformer

Aspects of a method and system for configurable antenna in an integrated circuit package are provided. In this regard, a phased array antenna embedded in a multi-layer integrated circuit (IC) package may be utilized for transmitting and/or receiving signals. An IC enabled to transmit and/or receive signals may be bonded to the multi-layer IC package and may communicate a reference signal and/or one or more phase shifted versions of said reference signal to the antenna. One or more phase shifters (fabricated, for example, in planar transmission line) may be embedded in the multi-layer IC package and may be controlled via an IC bonded to the multi-layer IC package. The phased array antenna may comprise a plurality of antenna elements which may each comprise an interconnection for communicatively coupling to an associated transmitter and/or receiver, a feeder line, a quarter wavelength transformer, and a radiating portion (e.g., a folded dipole).

Method and system for a phased array antenna embedded in an integrated circuit package

Aspects of a method and system for inter-PCB communication utilizing a spatial multi-link repeater are provided. In this regard, a signal may be transmitted between printed circuit boards via one or more repeaters, wherein the repeaters may frequency shift received signals to generate repeated signals. Each of the repeated signals may be generated by quadrature down-converting said received signal by mixing the received signal with a first LO signal pair, up-converting the down-converted signal by mixing it with a second LO signal pair, and adding or subtracting an in-phase portion and a quadrature-phase portion of the up-converted signal. Each repeated signal may comprise one or more signal components and a phase and/or amplitude of each of the components may be controlled to control a directivity of the repeated signals. The repeater may reside on one of the plurality of printed circuit boards.

Method and System for Inter-PCB Communication Utilizing a Spatial Multi-Link Repeater

A low noise amplifier (LNA) with combined input matching, balun, and/or transmit/receive (T /K) switch is described. In one exemplary design, an apparatus includes a coupled inductor and an LNA. The coupled inductor receives a single-ended input signal, performs single-ended to differential conversion, and provides a differential input signal. The LNA receives and amplifies the differential input signal and provides a differential output signal. The coupled inductor includes magnetically coupled first and second coils. The first coil provides input impedance matching when the LNA is enabled. A resonator circuit formed with the first coil provides high input impedance when the LNA is disabled. A tuning capacitor coupled to the second coil provides amplitude imbalance tuning for the differential input signal. A transmit switch is coupled between the first coil and a transmitter.

Low noise amplifier with combined input matching, balun, and transmit/receive switch

An antenna structure includes first and second antennas The first antenna has a first geometry corresponding to a first frequency The second antenna has a second geometry corresponding to a second frequency The second antenna is proximal to the first antenna and utilizes electrical-magnetic properties of the first antenna to transceive signals at the second frequency

Multiple mode rf transceiver and antenna structure

An integrated low noise amplifier includes an on-chip balun, a line impedance matching circuit and an on-chip differential amplifier. The on-chip balun is operably coupled to convert a single ended signal into a differential signal. The line impedance matching circuit is operably coupled to the primary of the on-chip balun to provide impedance matching for a line carrying the single ended signal. The on-chip differential amplifier is operably coupled to amplify the differential signal and is impedance matched to the secondary of the on-chip balun.

Integrated circuit low noise amplifier and applications thereof

An integrated circuit (IC) low noise amplifier includes an on-chip balun and an on-chip differential amplifier. The on-chip balun is operably coupled to convert a single-ended signal into a differential signal. The on-chip differential amplifier is operably coupled to amplify the differential signal.

Rozieh Rofougaran

Papers

Integrated circuit low noise amplifier and applications thereof

Integrated low noise amplifier