/pdf/handbook-of-advanced-materials-1kqmvc4p7z.pdf

Handbook of Advanced Materials

Monolithic inductors are widely used in microwave ICs and RFICs. Design considerations for inductors on low-resistivity substrates have been described. A /spl pi/-equivalent model, used to account for various loss mechanisms, can be helpful in understanding differences in the definition of L and Q for single-ended and differential structures that exist in the literature. Specific uses for the equations in this article have been outlined. The L and Q for an example monolithic, differential inductor were extracted from measured two-port S-parameters using equations for differential configurations on low-resistivity substrates.

Quality factor and inductance in differential IC implementations

Corrosion control in electronics and know-how concerning various protection methods have become an important field of design since electronics is increasingly used as integrated into different devices in highly corrosive conditions. On the other hand, the increase of the packaging density of electronics has resulted in electronics that is sensitive to the corrosive effects of the environment even in milder conditions. The project charted the mechanisms through which the climate, humidity, contamination, other environmental factors, the way of use of the device and its structure as well as the manufacturing process affect the corroding and faults of the electronics. A method was developed for solving these problems by which both the experienced and the beginning designer can check the feasibility of the applied corrosion protection technique and foresee possible corrosion problems in the structure of the device as well as find new approaches for solving them. The report also presents an evaluation method for the corrosive effect of the usage environment. In addition, various types of corrosion mechanisms and protection against them are described, corrosion analysis and measurement methods introduced and testing methods used for quality assurance regarding corrosion discussed. Comprehensive lists of standards and literature concerning corrosion and climatic effects are appended to the report. This report is available in English and in Finnish (VTT Publications 623, http://virtual.vtt.fi/inf/pdf/publications/2007/P623.pdf)

Corrosion and climatic effects in electronics

We present RF/microwave characterization of a 20-layer ceramic-based multichip module (MCM-C) on low temperature co-fired ceramic (LTCC). We investigated material properties and performance of embedded passives by design, fabrication and characterization of planar and multilayer integral inductors. Uniform dielectric constant, low loss property and high Q passives fabricated using this technology demonstrate the feasibility for implementing hybrid RF/microwave systems.

RF/microwave characterization of multilayer ceramic-based MCM technology

Recognizing the need for improved materials data to meet the needs of designers of RF and microwave products, DuPont Photopolymers and Electronic Materials (P&EM) has had an ongoing program to generate high frequency data on materials properties (dielectric constant, loss tangent and attenuation). Characterization of ceramic and printed wiring advanced interconnection materials in the 1 to 20 GHz range has been performed for a variety of new Thick Film and Low Temperature Cofired Ceramic (LTCC) dielectrics. Gold and silver conductors applied by both screen printing and photopatterning on these dielectrics as well as on 96% alumina have been tested. These have been benchmarked against Thin Film conductors and copper clad FR-4, Polyimide, BT and Teflon/sup (R)/ printed wiring materials. The performance of many of these systems has been reported for room temperature and humidity conditions. This presentation builds on the previous work with data on the high frequency properties of some of the advanced ceramic and printed wiring materials systems when exposed to 85/spl deg/C temperature and 85% relative humidity. In addition the high frequency performance of a new gold conductor system with both screen printed and photoetched patterning on 96% and 99% Alumina is described demonstrating the improved performance over gold Thin Film metallization typically used in Microwave applications.

High frequency electrical characterization of electronic packaging materials: environmental and process considerations

A new "high density" gold thick film technology is introduced. Circuits produced using the new material system exhibit superior fine line definition, conductivity density and high frequency performance. The high frequency performance of etched "high density" gold circuits were found to be superior to etched thin film circuits in the GHz range.

S.J. Horowitz

Papers

High frequency electrical characterization of electronic packaging materials: environmental and process considerations

New low cost interconnection materials for high frequency MCM applications