At present, a forming process of a base film through an amorphous silicon film is conducted in respective film forming chambers in order to obtain satisfactory films. When continuous formation of the base film through the amorphous silicon film is performed in a single film forming chamber with the above film formation condition, crystallization is not sufficiently attained in a crystallization process. By forming the amorphous silicon film using silane gas diluted with hydrogen, crystallization is sufficiently attained in the crystallization process even with the continuous formation of the base film through the amorphous silicon film in the single film forming chamber.

Method of Manufacturing a Semiconductor Device

A curable aqueous composition is disclosed comprising a carbohydrate, a crosslinking agent, and an amine base, wherein the curable aqueous composition has a pH adjusted by the amine base. Further disclosed is a method of forming a curable aqueous solution.

Binders and materials made therewith

A Cassegrain-type concentrating solar collector cell includes primary and secondary mirrors disposed on opposing convex and concave surfaces of a light-transparent (e.g., glass) optical element. Light enters an aperture surrounding the secondary mirror, and is reflected by the primary mirror toward the secondary mirror, which re-reflects the light onto a photovoltaic cell mounted on a central region surrounded by the convex surface. The primary and secondary mirrors are preferably formed as mirror films that are deposited or plated directly onto the optical element. A concentrating solar collector array includes a sheet-like optical panel including multiple optical elements arranged in rows. The photovoltaic cells are mounted directly onto the optical panel, and the primary mirrors of the individual collector cells include metal film segments that are coupled by the photovoltaic cells to facilitate transmission of the generated electrical energy. Bypass diodes are connected in parallel with the photovoltaic cells.

Concentrating solar collector with solid optical element

A polyimide resin composition, which comprises 100 parts by weight of a polyimide having repeating units represented by general formula (I), (wherein Y represents a direct bond, a divalent hydrocarbyl group having 1 to 10 carbon atoms, a hexafluoroisopropylidene group, a carbonyl group, a thio group, a sulfinyl group, a sulfonyl group or an oxido group, and R represents a tetravalent aliphatic group having 2 or more carbon atoms, alicyclic group, monocylic aromatic group, fused polycyclic aromatic group or non-fused cyclic aromatic group wherein aromatic groups are linked to each other directly or via a linking member) and 5 to 100 parts by weight of fibrous reinforcing material such as glass fibers, carbon fibers, potassium titanate fibers, aromatic polymide fibers, etc. This resin composition has excellent heat resistance, dimensional stability, and mechanical strength and is a useful material for manufacturing electric or electronic components, precision machine parts, etc. The polyimide to be used can be prepared from an aromatic ether diamine and a tetracarboxylic acid dianhydride, using 4,4'-bis(3-aminophenoxy)biphenyl, 2,2'-bis(4-(3-aminophenoxy)phenyl)propane, bis(4-(3-aminophenoxy)phenyl) sulfide, etc. as the ether diamine and pyromellitic dianhydride, 3,3',4,4'-benzophenonetetracarboxylic acid dianhydride, etc. as the tetracarboxylic acid dianhydride.

Polyimide resin composition

A flexible, high dielectric constant polyimide film composed of either a single layer of an adhesive thermoplastic polyimide film or a multilayer polyimide film having adhesive thermoplastic polyimide film layers bonded to one or both sides of the film and having dispersed in at least one of the polyimide layers from 4 to 85 weight % of a ferroelectric ceramic filler, such as barium titanate or polyimide coated barium titanate, and having a dielectric constant of from 4 to 60. The high dielectric constant polyimide film can be used in electronic circuitry and electronic components such as multilayer printed circuits, flexible circuits, semiconductor packaging and buried film capacitors.

High dielectric constant flexible polyimide film and process of preparation

Polyimide having repeating units of the following formula (I) and its polyamic acid precursor having repeating units of the following formula (II) are disclosed; ##STR1## (where Y is a radial selected from the group consisting of a bond, divalent hydrocarbon having 1 to 10 carbons, hexafluorinated isopropylidene, carbonyl, thio, sulfinyl, sulfonyl and oxide, and R is a tetra-valent radical selected from the group consisting of aliphatic radical having 2 and more carbons, cyclo-aliphatic radical, monoaromatic radical, condensed polyaromatic radical, and noncondensed polyaromatic radical wherein aromatic radicals ae mutually connected with a bond or a crosslinking function). Typical examples of polyimide and polyamic acid include where Y is thio radical and R is ##STR2## Y is a bond and R is III or IV, andy is isopropylidene radical and R is IV. The polymers can be prepared from corresponding diamine and tetracarboxylic acid dianhydride. Polyimide or polyamic acid of this invention is excellent for high-temperature adhesive.

Polyimide and high-temperature adhesive of polyimide from meta substituted phenoxy diamines

This invention relates to a novel polyimide which is high-temperature resistant and capable of being molded in a fused state. This invention also relates to a high-temperature adhesive using the polyimide. The polyimide consists essentially of recurring units of the formula: ##STR1## where R is a tetra-valent radical selected from the group consisting of an aliphatic radical having 2 or more carbon atoms, alicyclic radical, monoaromatic radical, condensed polyaromatic radical, and non-condensed polyaromatic radical wherein aromatic radicals are linked to one another directly or via a bridge member. The polyimide can be prepared by reacting bis[4-(4-aminophenoxy)phenoxy)phenyl] sulfone with a tetracarboxylic dianhydride in an organic solvent and imidizing the resultant polyamic acid. Various tetracarboxylic dianhydrides can be used and preferred dianhydride are pyromellitic dianhydride, 3,3',4,4'-benzophenonetetracarboxylic dianhydride, bis(3,4-diarboxyphenyl) ether dianhydride, 3,3',4,4'-biphenyltetracarboxylic dianhydride, and 4,4'-(p-phenylenedioxy)diphthalic dianhydride.

Polyimide and high-temperature adhesive thereof

In one aspect, the present invention relates to polyimides having excellent thermal resistance and process for preparing the same comprising carrying out condensation of 4,4'-bis(3-aminophenoxy)biphenyl with pyromellitic dianhydride in the presence of a different diamine compound and optionally with a different tetracarboxylic acid dianhydride. In a second aspect, the present invention relates to a heat resistant resin composition consisting essentially of an aromatic polyetherimide and a defined polyimide. In a third aspect, the present invention relates to a polyimide resin composition comprised on a defined polyimide and a separate high-temperature engineering polymer. In a fourth aspect, the present invention relates to a resin composition comprised of a defined polyimide and an aromatic polyamideimide.

Polyimides, process for the preparation thereof and polyimide resin compositions

PURPOSE: The titled polymer, containing bis(aminophenoxy)biphenyl as a diamine component, capable of giving a specific viscosity to a polyamic acid which is a precursor and having a low water absorption and improved heat resistance, processability, transparency and heat-resistant adhesive property. CONSTITUTION: A polymer, obtained by reacting, e.g. a diamine component consisting of 4,4'-bis(3-aminophenoxy)biphenyl, with a tetracarboxylic acid dianhydride at ≤50°C to give a polyamic acid having repeating units expressed by formula I (R is ≥2C aliphatic group, monocyclic aromatic residue, etc.) and 0.1W4dl/g inherent viscosity (measured by using a solution in N,N- dimethylacetamide solvent in 0.5g/100ml solvent concentration at 35°C) and dehydrating and imidating the above-mentioned polyamic acid which is a precursor of the aimed polymer while heating, e.g. at 100W400°C and having repeating units expressed by formula II. COPYRIGHT: (C)1987,JPO&Japio

Saburo Kawashima

Papers

Polyimide resin composition

Polyimide and high-temperature adhesive of polyimide from meta substituted phenoxy diamines

Polyimide and high-temperature adhesive thereof

Polyimides, process for the preparation thereof and polyimide resin compositions

Polymide and heat-resistant adhesive consisting of polyimide