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Showing papers by "Sang-Hoon Kim published in 2011"


Patent
Gil-Sang Yoo1, Chang-Rok Moon1, Byung-Jun Park1, Sang-Hoon Kim1, Seung-Hun Shin1 
12 Jul 2011
TL;DR: In this article, a photodiode is placed on a support substrate and an insulating layer is provided between the support and the semiconductor substrate, where a first through electrode penetrates the support substrate to be in contact with the first conductive pattern.
Abstract: A semiconductor substrate includes a photodiode on a support substrate. An insulating layer is provided between the support substrate and the semiconductor substrate. A first conductive pattern is provided in the insulating layer. A first through electrode penetrates the support substrate to be in contact with the first conductive pattern.

6 citations