Forming holes in a material includes focusing a pulsed laser beam into a laser beam focal line oriented along the beam propagation direction and directed into the material, the laser beam focal line generating an induced absorption within the material, the induced absorption producing a defect line along the laser beam focal line within the material, and translating the material and the laser beam relative to each other, thereby forming a plurality of defect lines in the material, and etching the material in an acid solution to produce holes greater than 1 micron in diameter by enlarging the defect lines in the material. A glass article includes a stack of glass substrates with formed holes of 1-100 micron diameter extending through the stack.

Method for rapid laser drilling of holes in glass and products made therefrom

A method and system for laser pre-cutting a layered material (31) with a laser beam (14) is disclosed. The layered material (31) comprises at least one tensile stress layer (TSL), at least one compression stress layer (CSL1, CSL2), and at least one interface region (IR1, IR2) between the at least one tensile stress layer (TSL) and the at least one compression stress layer (CSL1, CSL2) and is transparent to allow propagation of the laser beam (14) through the layered material (31). The method may comprise setting an optical beam path (8) and a laser characteristic of the laser beam (14) such that an interaction of the laser beam (14) with the layered material (31) generates an elongate damage region (57) in the layered material (31), and, for each of a series of pre-cut positions (X N-1 , X N , X N+1 ) of the layered material (31), pre-cutting the layered material (31) by positioning the layered material (31) and the laser beam (14) with respect to each other and irradiating the laser beam (14) such that the respective elongate damage regions (57) extend across the at least one interface region (IR1, IR2).

High speed laser processing of transparent materials

A method for the laser-based machining of a sheet-like substrate, in order to separate the substrate into multiple portions, in which the laser beam of a laser for machining the substrate is directed onto the latter, is characterized in that, with an optical arrangement positioned in the path of rays of the laser, an extended laser beam focal line, seen along the direction of the beam, is formed on the beam output side of the optical arrangement from the laser beam directed onto the latter, the substrate being positioned in relation to the laser beam focal line such that an induced absorption is produced in the material of the substrate in the interior of the substrate along an extended portion, seen in the direction of the beam, of the laser beam focal line, such that a material modification takes place in the material of the substrate along this extended portion.

Method and device for the laser-based machining of sheet-like substrates

The present invention relates to a laser cutting technology for cutting and separating thin substrates of transparent materials, for example to cutting of display glass compositions mainly used for production of Thin Film Transistors (TFT) devices. The described laser process can be used to make straight cuts, for example at a speed of >1 m/sec, to cut sharp radii outer corners (<1 mm), and to create arbitrary curved shapes including forming interior holes and slots. A method of laser processing an alkaline earth boro-aluminosilicate glass composite workpiece includes focusing a pulsed laser beam into a focal line. The focal line is directed into the glass composite workpiece, generating induced absorption within the material. The workpiece and the laser beam are translated relative to each other to form a plurality of defect lines along a contour, with adjacent defect lines have a spacing of 0.1-20 microns.

Laser cutting of display glass compositions

Processes of chamfering and/or beveling an edge of a glass substrate of arbitrary shape using lasers are described herein. Two general methods to produce chamfers on glass substrates are the first method involves cutting the edge with the desired chamfer shape utilizing an ultra-short pulse laser to create perforations within the glass; followed by an ion exchange.

Edge chamfering methods

PROBLEM TO BE SOLVED: To provide a Bessel beam generator which facilitates an assembly adjustment work, is compact and is easy to handle.SOLUTION: The Bessel beam generator includes: a light source; an optical fiber for transmitting light emitted from the light source; a lens mounted on the emission end of the optical fiber; a Bessel beam generating element for generating a Bessel beam by the light emitted from the lens; and a ferrule in which the lens is inserted into the incident end thereof and the Bessel beam generating element is inserted into the emission end thereof.

Bessel beam generator

PROBLEM TO BE SOLVED: To easily eject a cassette without lowering the rigidity of a cassette holder SOLUTION: A cassette sweep-out means 20 is provided for pushing out a tape cassette 12 in a cassette inserting chamber in the ejecting direction when a cassette holder 10 is moved from a cassette loading position to a cassette inserting/ejecting position and the cassette sweep-out means 20 has a sweep-out member 21 which can be transited between a sweep-out standby position located inside a hole 13 of the tape cassette 12 and a cassette sweep-out position for pushing out the tape cassette 12 from the sweep-out standby position to the ejecting direction, energized to the cassette sweep-out position by a first tension spring 22, a first stopper member 23 for locking the sweep-out member 21 at the sweep-out standby position and unlocking it by moving against the spring force of a second tension spring 26, first connecting rod 27 and second connecting rod for pulling the first stopper member 23 to the side of an unlocking position while being interlocked with the eject movement of the cassette holder 10

Cassette loading mechanism for recording and reproducing device

PROBLEM TO BE SOLVED: To provide a management system of a video movie camera which prevents a portable device from being stolen and lost at the time of lending the portable device; and becomes a business model for promoting the lending of a rental car. SOLUTION: A sensor/position information acquiring part 11 built-in a video movie 10 uses signals from, for example, three GPS (global positioning system)satellites 2 to acquire the present position by an arithmetic operation, generates position information and transmits the position information to a position information signal receiving part 21 of a car navigation system 20 installed in a rental car 20a by radio in fixed time intervals, for example, every minute. When the system receives the position information, the system sends an instruction to transmit an operation enabling signal to a CPU 23 and transmits the operation enabling signal to an enabling signal receiving part 12 of a movie. Since the system of the rental car can not received a position information signal from the movie when the portable device is stolen or the like to be carried to a remote place, the position information signal is broken for a fixed time to be unable to transmit the operation enabling signal to the movie so that the movie can not be used. COPYRIGHT: (C)2006,JPO&NCIPI

Sasamuro Takeshi

Papers

Bessel beam generator

Cassette loading mechanism for recording and reproducing device

Management system of portable device and management system of movie camera