An electrical connector assembly includes a metallic cage defining a receiving space therein, a receptacle connector unit received in the receiving space and including a pair of mating ports, and a number of terminal wafers stacked with one another with corresponding contacting sections exposed upon the mating ports and tail sections to be mounted on a printed circuit board on which the receptacle connector unit is mounted, and a middle heat transfer unit located between the two mating ports in a vertical direction and including a heat base linked with a pair of heat pipes on two sides, the pair of heat pipes extending through a rear of the cage and connected to a rear heat sink unit located behind the rear of the cage. Each of the pair of heat pipes is directly contacted with at least two different surfaces of the heat base.

Electrical connector assembly equipped with heat pipe and additional heat sink

Techniques for implementing a fan-less mode in a Power over Ethernet (PoE) network device are provided. According to one set of embodiments, the PoE network device can receive a user command to enable the fan-less mode. In response to the command, the PoE network device can (1) turn off the active cooling fans of the device, and (2) modify a PoE power budget of the device from a first amount to a second, reduced amount that is less than the first amount.

Fan-less mode in a power over ethernet (PoE) network device

The invention provides a high efficiency high power controller, belonging to the field of control equipment. The high efficiency high power controller comprises a vertical board, a motherboard, two base plates and a plurality of connection wires. The two substrates are posted at two sides of the motherboard. The vertical board is vertically arranged between the two substrates and is in welding connection with the motherboard through pins. The motherboard is connected to external equipment through the connection wires. The motherboard is provided with switch tube devices and capacitor devices. The switch tube devices are welded at two sides of the motherboard, and the switch tube devices are mounted to the two substrate. The capacitor devices are uniformly distributed and welded at the upper surface of the motherboard.

High efficiency high power controller

Engine control unit

A control method and apparatus for a smart power component, a storage medium and a processor are provided. The method includes that: first fitting information and second fitting information, which is detected by the smart power component, between a smart power component and an external heat sink is acquired; it is determined whether the first fitting information satisfies a preset condition, and it is determined whether the second fitting information satisfies a preset condition; when the first fitting information does not satisfy the preset condition, first prompt information is output; and when the second fitting information does not satisfy the preset condition, second prompt information is output. Thus, the technical problem that a poor fit between a smart power component and an external heat sink is not detected is solved.

Control method and apparatus for smart power component, storage medium and processor

A fanless industrial computer enclosure dissipates heat generated by the hottest components on heat sinks dedicated to respective heat zones within the enclosure. Heat generated by the component that operates at the highest temperature in each heat zone is conducted to a heat sink on the exterior of the enclosure. Using a heat sink dedicated to each heat zone, heat generated by components such as an industrial computer, storage devices, power supply, or other electrical components, is dissipated on the outer surface of the enclosure to the surrounding ambient environment. Providing a low resistance heat conductive path from the hottest components to respective heat sinks to dissipate heat outside the enclosure from each heat zone creates an environment within the enclosure where disk drives do not exceed the specified upper operating temperature rating without regard to the operating temperature of other electrical components in the enclosure.

Scott David Lindstrom

Papers

Enclosure with multiple heat dissipating surfaces