A pretreating agent for electroless plating that is soluble in organic solvents and is stable; a method of electroless plating realizing excellent adhesion wherein use is made of the pretreating agent; and a product of electroless plating. Plating object is pretreated with a pretreating agent for electroless plating, comprising a noble metal soap of C5-C25 fatty acid, preferably further comprising a silane coupling agent with metal trapping capability, such as an imidazole silane coupling agent, and subjected to electroless plating. Palladium soap is preferably used as the noble metal soap.

Pretreating agent for electroless plating, method of electroless plating using the same and product of electroless plating

A method for metal plating, characterized in that it comprises subjecting an article to be plated to a surface treatment with a silane coupling agent having, in a molecule thereof, a functional group exhibiting the capability of capturing a metal, treating the resultant article at a high temperature of 150°C or higher, and subjecting the article to a surface treatment with a solution containing a noble metal compound, to thereby carry out an elecroless plating; and a method for metal plating, characterized in that it comprises subjecting an article to be plated to a surface treatment with a fluid obtained by mixing or reacting a silane coupling agent having, in a molecule thereof, a functional group exhibiting the capability of capturing a metal with a noble metal compound, and treating the resultant article at a high temperature of 150°C or higher, to thereby carry out an elecroless plating. The above methods allow the metal plating with good adhesion to an article being difficult to carry out a metal plating.

Method for electroless plating and metal-plated article

An object is to provide an inkjet ink composition to uniformly form a wiring pattern having excellent adhesion on a substrate, and to provide a method to form a wiring pattern by using this ink composition. This ink composition is an inkjet ink composition for drawing a wiring pattern on a substrate, the ink composition comprising an azole-based silane coupling agent as coupling agent for an activator.

Inkjet ink composition

The invention relates to a method for electrodepositing palladium from an ionic liquid. The method is characterized in that an ionic liquid containing PdCl2 is utilized as an electrolyte, and a palladium element is directly obtained on a cathode in a constant current electrodeposition mode at a low temperature (25-70DEG C). The cation of the ionic liquid used in the invention is a 1,3-dialkyl substituted imidazole ionic liquid, and concretely is a 1-ethyl-3-methylimidazolium cation [EMIm] having a low viscosity and a good conductivity at normal temperature, and the anion of the ionic liquid is trifluoroacetate (CF3COO ), trifluoromethanesulfonate (CF3SO3 ), dicyanamide (DCA ), ethylsulfate (C2H5SO4 ) and hexafluorophosphate (PF6 ). The cation is combined with one or more anions to form a substance, and the substance can be used as a PdCl2 solvent and an electrolyte. The method has the advantages of simple operation and low apparatus cost, and the electrolytic medium ionic liquid has the advantages of wide electrochemical window, good thermal stability, wide difference between a solidifying point and a boiling point and the like, so environment pollution caused by the inflammableness and the volatility of a common organic solvent is avoided.

Method for electrodepositing palladium from ionic liquid

The electroless plating solution of the present invention is an electroless plating solution used for selectively forming a protective film on a surface of an exposed wiring in the production of a semiconductor device having a wiring structure, wherein
 the electroless plating solution includes a cobalt ion, an ion of a second metal other than cobalt, a chelating agent, a reducing agent, a surface active agent and a specific tetraalkylammonium hydroxide, and the surface active agent is selected from the group consisting of a compound represented by the following formula (2 a ) or (2 b ), a sulfonic acid type anionic surface active agent, a polyoxyethylene alkyl ether phosphoric ester and a polyoxyalkylene monoalkyl ether, wherein R 5 to R 8 are each a hydrogen atom or a specific alkyl group, R 9 and R 10 are each an alkylene group of 2 to 5 carbon atoms, j and k are each independently an integer of not less than 1, and the sum of j and k is 2 to 50. According to the present invention, a protective film uniformly having a diffusion-preventing ability can be formed on a copper wiring with high selectivity.

Electroless plating liquid

PROBLEM TO BE SOLVED: To provide a pretreatment solution which can reduce frequency of making up a catalyst solution used for electroless nickel plating onto copper or copper alloy. SOLUTION: The method for preparing the pretreatment solution for electroless nickel plating onto copper or copper alloy is characterized by previously mixing or reacting a silane coupling agent containing a functional group having a metal capturing ability in one molecule with a noble metal compound at the weight ratio satisfying the following coequality; 1/10< a silane coupling agent/a noble metal compound <5/1.

Pretreatment solution for electroless nickel plating onto copper or copper alloy and method for electroless nickel plating

PROBLEM TO BE SOLVED: To improve the liquid stability of a pretreatment agent for plating obtained by previously mixing or reacting a silane coupling agent and a noble metal compound even when continuously used at ≥30°C. SOLUTION: The pretreatment agent for plating is obtained by adding hydrogen peroxide to a liquid obtained by previously mixing or reacting a silane coupling agent having functional groups having a metal capturing capacity in one molecule, and is continuously used at ≥30°C. The electroless plating method uses the same agent. It is preferable that the concentration of hydrogen peroxide in the pretreatment agent for plating is 0.1 to 1,000 mg/L, the silane coupling agent having functional groups having a metal capturing capacity in one molecule is the one obtained by the reaction of an azole based compound and an epoxy silane based compound, the functional group having a metal capturing capacity is imidazole group, and the noble metal compound is a palladium compound. COPYRIGHT: (C)2003,JPO

Pretreatment agent for planting and electroless plasting method using the same

PROBLEM TO BE SOLVED: To improve stability of a surface treatment agent, which is prepared by means of previously mixing or reacting a silane coupling agent with a compound of noble metal. SOLUTION: A method for manufacturing the surface treatment agent is characterized by adding an oxidizing agent to a previously prepared liquid by means of mixing or reacting the silane coupling agent, which contains a functional group having metal capturing ability in its one molecule, with the compound of noble metal.

Surface treatment agent and surface treated article therewith

PROBLEM TO BE SOLVED: To provide a method for improving an adhesion between a metal thin film formed on a substrate and a metal film electroplated later thereon, even when the metal thin film is very thin. SOLUTION: The method for improving the adhesion between the metal thin film of a conducting layer and the electroplated film, comprises immersing the substrate provided with the metal thin film of the conducting layer, into a liquid of pH 2 or lower, which includes a predetermined concentration of a coupling agent having metal scavenging ability, before electroplating metal.

Method for improving adhesion between metal films

PROBLEM TO BE SOLVED: To provide a new imidazole alcohol compound highly adhesive to the surface of a metallic product, especially of copper, aluminum or iron and steel and having high rustproof effect even in the form of thin film, and to provide a surface treatment agent using said compound. SOLUTION: The new imidazole alcohol compound of the general formula(1)( wherein, R 1 , R 2 and R 3 are each H, vinyl or 1-20C alkyl, wherein R 2 and R 3 may be joined each other to form an aromatic ring; X is H, a 1-6C alkyl or substituent optionally containing N and/or O; m is an integer of 0-20; and n and l are each an integer of 1-3 ) is obtained by reaction between an imidazole compound and an epoxy alcohol compound. COPYRIGHT: (C)2004,JPO

Sekiguchi Jiyunnosuke

Papers

Pretreatment solution for electroless nickel plating onto copper or copper alloy and method for electroless nickel plating

Pretreatment agent for planting and electroless plasting method using the same

Surface treatment agent and surface treated article therewith

Method for improving adhesion between metal films

New imidazole alcohol compound and method for producing the same and surface treatment agent using the same