A light-emitting device package including: a package main body including a cavity and a lead frame including a mounting portion disposed in the cavity and a plurality of terminal portions; a light-emitting device chip mounted on the mounting portion; a plurality of bonding wires for electrically connecting the plurality of terminal portions and the light-emitting device chip; a light-transmitting encapsulation layer filled in the cavity; and a light-transmitting cap member disposed in the cavity and blocking the encapsulation layer to contact the plurality of bonding wires.

Light emitting device package

By doping an organic compound functioning as an electron donor (hereinafter referred to as donor molecules) into an organic compound layer contacting a cathode, donor levels can be formed between respective LUMO (lowest unoccupied molecular orbital) levels between the cathode and the organic compound layer, and therefore electrons can be injected from the cathode, and transmission of the injected electrons can be performed with good efficiency. Further, there are no problems such as excessive energy loss, deterioration of the organic compound layer itself, and the like accompanying electron movement, and therefore an increase in the electron injecting characteristics and a decrease in the driver voltage can both be achieved without depending on the work function of the cathode material.

Light Emitting Device

Disclosed herein are compositions comprising a. from 35 to 80 vol % of a thermoplastic polymer; b. from 5 to 45 vol % of a low thermally conductive, electrically insulative filler with an intrinsic thermal conductivity of from 10 to 30 W/mK; c. from 5 to 15 vol % of a high thermally conductive, electrically insulative filler with an intrinsic thermal conductivity greater than or equal to 50 W/mK; and d. from 5 to 15 vol % of a high thermally conductive, electrically conductive filler with an intrinsic thermal conductivity greater than or equal to 50 W/mK, wherein the composition is characterized by: i. a thermal conductivity of at least 1.0 W/mK; and ii. a volume resistivity of at least 10 7 Ohm.cm. Also disclosed are articles and methods of use therefor.

Thermally conductive and electrically insulative polymer compositions containing a low thermally conductive filler and uses thereof

A light-reflective anisotropic conductive adhesive used for anisotropic conductive connection of a light-emitting element to a wiring board includes a thermosetting resin composition containing a silicone resin and a curing agent, conductive particles and light-reflective insulating particles. The light-reflective insulating particle is at least one kind of inorganic particles selected from the group consisting of titanium oxide, boron nitride, zinc oxide, silicon oxide, and aluminum oxide. The silicone resin is a glycidyloxyalkyl-alicyclic alkyl-modified organopolysiloxane.

Light-reflective anisotropic conductive adhesive and light-emitting device

A resin composite material according to the present invention contains a thermoplastic resin composition containing a polyphenylene oxide, a layered clay mineral dispersed in the thermoplastic resin composition and organized with an organizing agent, and a polar compound dispersed in the thermoplastic resin composition and chemically bonded to the layered clay mineral. The layered clay mineral is satisfactorily uniformly dispersed in the thermoplastic resin composition even after kneading under high temperature conditions. The resin composite material has adequately enhanced characteristics of mechanical strength, durability, and so on.

Resin composite material

The objective of the present invention is to provide a heat-dissipating resin composition that is used for forming a substrate for LED mounting or a reflector provided on the substrate for LED mounting and is excellent in heat dissipation, electrical insulation, heat resistance and light resistance while an LED element emits light, a substrate for LED mounting and a reflector comprising the composition. The present composition comprises a thermoplastic resin such as modified PBT and a thermally conductive filler consisting of scaly boron nitride or the like, and has thermal deformation temperature of 120° C. or higher, a thermal conductivity of 2.0 W/(m·K) or higher, and a thermal emissivity of 0.7 or higher.

Heat-dissipating resin composition, substrate for led mounting, reflector, and substrate for led mounting having reflector portion

PROBLEM TO BE SOLVED: To provide a heat-dissipating resin composition which is used for forming a substrate for mounting an LED or a reflector provided on the substrate for mounting an LED, and is excellent in heat dissipation, electrical insulation, heat resistance, and light resistance, when the LED element is emitting light, and a substrate for mounting an LED and a reflector containing the composition. SOLUTION: The heat-dissipating resin composition contains a thermoplastic resin such as modified PBT (PolyButylene-Terephthalate) and a thermally conductive filler such as flake boron nitride. The composition has a thermal deformation temperature not less than 120°C, thermal conductivity not less than 2.0 W/(m×K), and heat emissivity not less than 0.7. COPYRIGHT: (C)2009,JPO&INPIT

Heat-dissipating resin composition, substrate for mounting led, reflector, and substrate for mounting led provided with reflector portion

PROBLEM TO BE SOLVED: To provide a heat-radiating resin excellent in heat radiation, heat deformation resistance, color-toning property, glossiness, impact resistance, bending distortion characteristics and light fastness, and a molded article containing the same. SOLUTION: This heat-radiating resin composition is provided by containing a thermoplastic resin, a thermoconductive filler, an ultraviolet light-absorber and a light stabilizer, and having 5 to 95 mass% and 95 to 5 mass% ratio of the ultraviolet light absorber to light stabilizer, respectively in the case of making 100 mass% total of the both, ≥2.0 W/(m×K) heat conductivity, ≥0.7 heat emissivity and ≥30% whiteness. COPYRIGHT: (C)2009,JPO&INPIT

Heat-radiating resin composition and molded article containing the same

PROBLEM TO BE SOLVED: To provide a magnesium oxide filler for compounding in resins, which gives molded articles excellent in moldability, heat conductivity and water resistance, and to provide a heat-conductive resin composition containing the same. SOLUTION: This magnesium oxide filler for compounding in resins, having a purity of ≥95.0 mass%, is characterized by having a BET specific surface area of ≤5.0 m 2 /g, a volume-average particle diameter (Dv) of 0.5 to 60 μm, and a volume-average particle diameter (Dv)/number-average particle diameter (Dn) ratio of 10 to 55. COPYRIGHT: (C)2007,JPO&INPIT

Magnesium oxide filler for compounding in resin and heat-conductive resin composition containing the same

PROBLEM TO BE SOLVED: To provide a heat-dissipating resin composition excellent in heat-dissipating property, thermal deformation resistance, toning property, glossiness, impact resistance and flexural strain characteristics, and to provide a molded article containing the same. SOLUTION: The heat-dissipating resin composition comprises a polyarylene sulfide (A), polytetramethylene adipamide (B), and boron nitride (C), wherein the amounts of the components (A), (B) and (C) are 10 to 90 mass%, 5 to 70 mass%, and 5 to 85 mass% [the total amount of the components (A) to (C) is 100 mass%], respectively. COPYRIGHT: (C)2009,JPO&INPIT

Shinsuke Fujioka

Papers

Heat-dissipating resin composition, substrate for led mounting, reflector, and substrate for led mounting having reflector portion

Heat-dissipating resin composition, substrate for mounting led, reflector, and substrate for mounting led provided with reflector portion

Heat-radiating resin composition and molded article containing the same

Magnesium oxide filler for compounding in resin and heat-conductive resin composition containing the same

Heat-dissipating resin composition