寿雄 藤田

TL;DR: In this article, the authors proposed a method of producing a flexible printed circuit board where, even in the case electroless nickel plating is applied to both the faces of a polyimide resin film, the content of moisture remaining in the polyimides resin film is reduced, and also, the thickness of the electroless Nickel plated layer can be increased.

TL;DR: In this paper, a flexible printed circuit board capable of increasing the adhesion of both side plating and through hole plating is presented, where wet blast treatment, short-wave ultraviolet-ray treatment and activation treatment using an alkali metal hydroxide are sequentially applied on both surfaces of a polyimide resin film and the inner circumferential surface of the through hole.

TL;DR: In this paper, a flexible printed circuit board manufacturing method with which activation of a surface can be omitted when electroless nickel plating is applied to a polyimide resin film, and the adhesion reliability of an electroless Nickel Plating layer to a copper plating layer deposited on a surface thereof can be enhanced, and a base material for a circuit to be used therefor.

TL;DR: In this article, the authors proposed a manufacturing method of a multi-layered metal plated base material capable of consistently performing the film deposition of a second electroless metal plating layer, and suppressing an increase of the manufacturing cost compared with a conventional case.