S
Shuichi Shoji
Researcher at Waseda University
Publications - 443
Citations - 5176
Shuichi Shoji is an academic researcher from Waseda University. The author has contributed to research in topics: Microchannel & Fabrication. The author has an hindex of 32, co-authored 435 publications receiving 4780 citations. Previous affiliations of Shuichi Shoji include Showa Denko & Tokyo University of Agriculture and Technology.
Papers
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Journal ArticleDOI
Micro Total Analysis Systems
TL;DR: In this paper, the authors proposed a Lab-on-a-Chip (LOC) for the first time, which is based on the idea of Labon-A-Chip.
Journal ArticleDOI
MEMS-based design and fabrication of a new concept micro direct methanol fuel cell (μ-DMFC)
TL;DR: In this paper, a design for a novel micro direct methanol fuel cell (μ-DMFC) of 0.018 cm2 active area is described, which was prepared using a series of fabrication steps from micro-machined silicon wafer including photolithography, deep reactive ion etching, and electron beam deposition.
Proceedings ArticleDOI
A very low-power consumption wireless ECG monitoring system using body as a signal transmission medium
TL;DR: A very low-power consumption wireless system for monitoring ECG (electrocardiogram) is proposed that consists of an ECG detector/transmitter located on the chest and the relay transmitter placed at the wrist.
Book ChapterDOI
Fluids for Sensor Systems
TL;DR: In this paper, several techniques for miniaturization of simple chemical and medical analysis systems are described, including microfluidics applied flow devices, micro flow control devices of active and passive microvalves, mechanical and non-mechanical micropumps and micro flow sensors fabricated by micromachining.
Journal ArticleDOI
Studies on SiO2–SiO2 bonding with hydrofluoric acid. Room temperature and low stress bonding technique for MEMS
TL;DR: In this paper, the authors have shown that an interlayer of a silicon oxide complex including hydrogen and fluorine atoms is formed between bonded SiO 2 to SiO2, and that the thickness of the interlayer depends strongly on the applied pressure during bonding.