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Showing papers by "Shuzi Hayase published in 1980"


Patent
14 Aug 1980
TL;DR: An electrically insulated coil is composed of a coil and a mica tape containing a first resinous composition, wound upon the coil; the resinous composite containing a maleimide compound, an epoxy resin, a curing catalyst consisting of an aluminum compound, and a curing accelerator selected from the group consisting of a silane compound having a hydroxyl group and a polysiloxane compound with a hyroxyl groups; the curing catalyst and the curing accelerator each being in an amount of about 00001 to 5% by weight as discussed by the authors.
Abstract: An electrically insulated coil is composed of a coil and a mica tape containing a first resinous composition, wound upon the coil; the resinous composition containing a maleimide compound, an epoxy resin, a curing catalyst consisting of an aluminum compound, and a curing accelerator selected from the group consisting of a silane compound having a hydroxyl group and a polysiloxane compound having a hydroxyl group; the curing catalyst and the curing accelerator each being in an amount of about 00001 to 5% by weight based on the total amount of the maleimide compound and the epoxy resin; and the resinous composition being cured by heating after the mica tape is wound around the coil The electrically insulated coil may further contain a second resinous composition comprising an epoxy resin and an acid anhydride, the second resinous composition impregnating the mica tape after the mica tape is wound around the coil, and being heat-cured together with the first resinous composition

53 citations


Patent
11 Jun 1980
TL;DR: An epoxy resin-based compositions contain epoxy resins and a catalytic amount of curing catalysts which comprise organosilicon compounds having at least one hydroxyl group directly bonded to silicon atom and a compound having organic groups of aluminum, iron or vanadium as discussed by the authors.
Abstract: An epoxy resin-based compositions contain epoxy resins and a catalytic amount of curing catalysts which comprise organosilicon compounds having at least one hydroxyl group directly bonded to silicon atom and a compound having organic groups of aluminum, iron or vanadium.

17 citations


Patent
17 Jun 1980
TL;DR: An epoxy resin-based composition contains epoxy resins and a catalytic amount of latent curing catalysts which comprise organosilicon compounds having hydrolyzable groups and aluminum compound having organic groups.
Abstract: An epoxy resin-based composition contains epoxy resins and a catalytic amount of latent curing catalysts which comprise organosilicon compounds having hydrolyzable groups and aluminum compound having organic groups.

12 citations