This invention is an application comprising an electrically operated device, and a flexible thin layer open liquid state electrochemical cell (10) for providing the device with electrical power for its operation; the electrochemical cell including a first layer of insoluble negative pole (14), a second layer of insoluble positive pole (16), and a third layer of aqueous electrolyte (12); the third layer (12) being disposed between the first (14) and second (16) layers; and including a deliquescent material for keeping the open cell (10) wet at all times, an electroactive soluble material for obtaining required ionic conductivity, a watersoluble polymer for obtaining a required viscosity for adhering the first (14), and second (16) layers to the third (12) layer.

Flexible thin layer open electrochemical cell and applications of same

The present invention provides an organic electroluminescence device including an organic layer comprising an emissive layer; a pair of electrodes comprising an anode and a cathode, and sandwiching the organic layer, wherein at least one of the electrodes is transparent; a transparent layer provided adjacent to a light extracting surface of the transparent electrode; and a region substantially disturbing reflection and retraction angle of light provided adjacent to a light extracting surface of the transparent layer or in an interior of the transparent layer, wherein the transparent layer has a refractive index substantially equal to or more than the refractive index of the emissive layer.

Electroluminescence device, planar light source and display using the same

A transistor device 10 is disclosed herein. A doped layer 14 of a radiation sensitive material is formed over a substrate 12. The radiation sensitive material 14 may be polyimide, polybenzimidazole, a polymer, an organic dielectrics, a conductor or a semiconductor and the substrate 12 may be silicon, quartz, gallium arsenide, glass, ceramic, metal or polyimide. A neutral (undoped) layer 16 of radiation sensitive material is formed over the doped layer 14. First and second source/drain regions 18 and 20 are formed in the neutral layer 16 and extend to a top portion of the doped layer 14. A gate region 22 is formed in a top portion of the neutral layer 16 between the first source/drain region 18 and second source/drain region 20 such that a channel region 24 is formed in the doped layer 14 beneath the gate region 22.

Integrated circuits formed in radiation sensitive material and method of forming same

This invention relates in general to the formation of thick films having a biaxial molecular orientation. Such films are prepared in accordance with the present invention from rod-like extended chain aromatic-heterocyclic ordered polymers. Such films have high tensile strength, modulus, and environmental resistance characteristics. A preferred ordered polymer for use in the present invention is poly(para-phenylenebenzo bisthiazole), (PBT), a compound having structure (I). The present invention is also directed to methods and apparatus suitable for producing biaxially oriented films, coatings, and like materials from ordered polymers, preferably PBT.

Biaxially oriented ordered polymer films

Substrates for printed circuit boards and the like, in the form of a substrate base layer and at least one adherent layer fixedly attached thereto. The adherent layer preferably comprises a thermoplastic material having a glass transition temperature in the range of about 180° and about 245° C., or a thermosetting material capable of B-stage curing. The preparation of the novel substrates and printed circuits using the substrates and conductive traces formed with electrically-conductive ink compositions is also described.

Composite substrates for preparation of printed circuits

OF THE DISCLOSURE There are disclosed a flexible printed circuit base board produced as an elemental material suitable for a flexible printed circuit board by coating a heat-resistant resin composition composed of a heat-resistant resin having a heterocyclic ring and an epoxy resin dissolved in an organic solvent on a metal foil and drying it to form a film directly on said foil, and a method for producing the same. Said flexible printed circuit base board is more excellent in heat resistance, flame retardancy, adhesiveness, electric insulation, and heat deterioration characteristics than the conven-tional base board obtained by integrating a heat-resistant film and a metal foil through an adhesive. These properties are of great importance in practical applications of the printed circuit base board. As compared with the conven-tional products, the production is easy, and hence, the present base board can be produced at a low cost. The base board of this invention is not only usable for various types of flexible printed circuit boards but also the film per se obtained from the base board can be used in a field in which a film is used.

Flexible printed circuit base board and method for producing the same

A substrate for flexible printed circuits obtained by coating a metal foil with an organic solvent solution of a heat resistant resin composition consisting of a heat resistant resin having an heterocyclic ring and epoxy resin and then drying the metal foil to thereby form a film directly on the foil as a material adapted for a flexible printed circuit board, and a method of fabricating the same. The printed circuit board exhibits heat resistance, fire retardance, adhesion, electric insulation and heat deterioration characteristics which are remarkably superior to the conventional circuit board which is obtained by integrating a heat resistant film with a metal foil via an adhesive. These properties are very important in practical use of the printed circuit board. The substrate of this invention is inexpensive since it can be easily fabricated as compared with the conventional one. This substrate can also be used for not only various flexible printed circuit boards but also as substrate for films alone.

Sigenori Yamaoka

Papers

Flexible printed circuit base board and method for producing the same

Substrate for flexible printed circuits and method of fabricating the same, and film

Method of producing flexible printed circuit board

Substrate for flexible printed circuits and method of fabricating the same