A process for applying a metallization interconnect structure to a semiconductor workpiece having a barrier layer deposited on a surface thereof is set forth. The process includes the forming of an ultra-thin metal seed layer on the barrier layer. The ultra-thin seed layer having a thickness of less than or equal to about 500 Angstroms. The ultra-thin seed layer is then enhanced by depositing additional metal thereon to provide an enhanced seed layer. The enhanced seed layer has a thickness at all points on sidewalls of substantially all recessed features distributed within the workpiece that is equal to or greater than about 10% of the nominal seed layer thickness over an exteriorly disposed surface of the workpiece.

Apparatus and method for electrolytically depositing copper on a semiconductor workpiece

A process for metallization of a workpiece, such as a semiconductor workpiece. In an embodiment, an alkaline electrolytic copper bath is used to electroplate copper onto a seed layer, electroplate copper directly onto a barrier layer material, or enhance an ultra-thin copper seed layer which has been deposited on the barrier layer using a deposition process such as PVD. The resulting copper layer provides an excellent conformal copper coating that fills trenches, vias, and other microstructures in the workpiece. When used for seed layer enhancement, the resulting copper seed layer provide an excellent conformal copper coating that allows the microstructures to be filled with a copper layer having good uniformity using electrochemical deposition techniques. Further, copper layers that are electroplated in the disclosed manner exhibit low sheet resistance and are readily annealed at low temperatures.

Method for electrochemically depositing metal on a semiconductor workpiece

Ni–W/ZrO2 nanocomposites obtained by ultrasonic DC electrodeposition

Ultrafine TiO 2 dispersed nickel composite coatings have been prepared by direct current deposition process on steel substrate from Watt's bath to improve the surface mechanical property of conventional nickel coating. To resist agglomeration of ultra fine particles in plating bath due to high surface free energy and to get homogeneous coating, magnetic stirring was applied during deposition with prior ultrasonic agitation. For de-agglomeration, Hexa decylpyridinium bromide (HPB) was used in varying quantity in plating bath as surfactant. Characterization of TiO 2 powder as well as microstructure, hardness and wear properties of the coatings were studied by means of XRD, SEM, microhardness tester and ball-on-plate type wear tester. TiO 2 incorporation in the coatings was uniform and dispersion of TiO 2 was below 100 nm size along with the faceted nickel matrix. Selective amount of HPB addition produces hard orientation of nickel in the composite coating along with better TiO 2 co-deposition rate leading to higher microhardness and wear resistance. Wear is mainly adhesive in nature and the worn out TiO 2 particles shift it nominally to abrasive mechanism.

http://dspace.nitrkl.ac.in:8080/dspace/bitstream/2080/1499/1/SCT.pdf

Synthesis and characterization of Ni-TiO2 composite coatings by electro-co-deposition

Electrodeposition of zinc and composite zinc–yttria stabilized zirconia coatings

The effects of electrochemical parameters on the development of Nickel–Titanium Carbo Nitride (TiCN) metal matrix nanocomposite deposits were studied in Watts type nickel bath. The extent of TiCN incorporation into nickel matrix was studied with respect to TiCN particle concentration ranged between 2 and 15 g l − 1 , current density ranging from 2 to 10 Ad m − 2 , bath pH from 2 to 5 and a bath temperature range of 30–70 °C. Effects of TiCN particle incorporation on surface morphology, crystal structure, micro hardness, wear resistance and corrosion resistance of the composite deposits were studied. It was found that the incorporation of TiCN particles in the composite deposit increased with increasing TiCN content in the bath. Operating the bath with 6 g l − 1 TiCN particle concentrations at 4 Ad m − 2 , at 50 °C, and at pH 4 gave about 23.9 vol.% TiCN incorporation in the composite deposit. The results showed that the codeposition of TiCN particles with nickel modified the surface morphology of nickel and its preferred orientation. The Ni–TiCN composite deposits showed better corrosion resistance in 3.5 wt.% NaCl solution and high hardness and wear resistance than nickel electrodeposited under the same conditions.

http://krc.cecri.res.in/ro_2012/2012-035.pdf

Development and characterization of electro deposited Nickel–Titanium Carbo Nitride (TiCN) metal matrix nanocomposite deposits

Oxidation characteristics of electrodeposited nickel–zirconia composites at high temperature

Effect of organic dye on copper metallization of high aspect ratio through hole for interconnect application

Zinc-iron alloy electrodeposits have industrial significance, since they provide better corrosion resistance and with improved mechanical properties when compared to pure zinc coatings. This is due to the unique phase structure of the alloy formed. But this deposition belongs to anomalous deposition, where the electrochemically less noble zinc deposits more preferentially, than the more noble iron. So the industrial pro- cess control over the deposition becomes difficult. So, this study correlates the effect of various deposition parameters over the deposition kinetics and deposited alloy characteristics. Transition and partial current den- sities were computed. Effect of hydrogen overpotential and surface coverage due to the adsorbed intermediates over anomalous deposition were explored. Plausible deposition mechanism and mathematical model was pro- posed to predict the anomalous electrodeposition characteristics. Textural, morphological and phase structural characteristics of the alloy was investigated. By the substitution of iron in the hcp lattice, c/a ratio was low- ered and the lattice geometry was distorted. Intermetallic compounds of variable composition such as FeZn14, Fe5Zn33 ,F e 3Zn13 and FeZn3 with 'η' and '� ' phase structures were noted. Electrodeposition parameters were optimized and smooth, adherent, strain-free deposits with required iron content and hardness were obtained.

/pdf/textural-and-morphological-studies-on-zinc-iron-alloy-440xr0fgj3.pdf

Textural and morphological studies on zinc–iron alloy electrodeposits

A non-cyanide bath useful for electroplating adherent copper deposits directly on mild steel has been developed in a study based on the need for new processes that are more acceptable, environmentally, than earlier processes containing toxic substances.

Sobha Jayakrishnan

Papers

Development and characterization of electro deposited Nickel–Titanium Carbo Nitride (TiCN) metal matrix nanocomposite deposits

Oxidation characteristics of electrodeposited nickel–zirconia composites at high temperature

Effect of organic dye on copper metallization of high aspect ratio through hole for interconnect application

Textural and morphological studies on zinc–iron alloy electrodeposits

Electroplating of copper from a non-cyanide electrolyte