Disclosed is a light-emitting diode package, comprising: a package body having a cavity; a light-emitting diode chip having a plurality of light-emitting cells connected in serial with each other; a fluorescent body for converting the wavelength of light emitted by the light-emitting diode chip; and a pair of lead electrodes. The light-emitting cells are connected together in series between the pair of lead electrodes.

Light emitting diode package

A multi-chip lighting emitting device (LED) lamp for providing white light includes a submount including first and second die mounting regions thereon. A first LED chip is mounted on the first die mounting region, and a second LED chip is mounted on the second die mounting region. The LED lamp is configured to emit light having a spectral distribution including at least four different color peaks to provide the white light. For example, a first conversion material may at least partially cover the first LED chip, and may be configured to absorb at least some of the light of the first color and re-emit light of a third color. In addition, a second conversion material may at least partially cover the first and/or second LED chips, and may be configured to absorb at least some of the light of the first and/or second colors and re-emit light of a fourth color. Related light fixtures and methods are also disclosed.

Multi-chip light emitting device lamps for providing high-CRI warm white light and light fixtures including the same

An LED component comprising an array of LED chips mounted on a planar surface of a submount with the LED chips capable of emitting light in response to an electrical signal. The LED chips comprise respective groups emitting at different colors of light, with each of the groups interconnected in a series circuit. A lens is included over the LED chips. Other embodiments can comprise thermal spreading structures included integral to the submount and arranged to dissipate heat from the LED chips.

Solid state lighting component

By doping an organic compound functioning as an electron donor (hereinafter referred to as donor molecules) into an organic compound layer contacting a cathode, donor levels can be formed between respective LUMO (lowest unoccupied molecular orbital) levels between the cathode and the organic compound layer, and therefore electrons can be injected from the cathode, and transmission of the injected electrons can be performed with good efficiency. Further, there are no problems such as excessive energy loss, deterioration of the organic compound layer itself, and the like accompanying electron movement, and therefore an increase in the electron injecting characteristics and a decrease in the driver voltage can both be achieved without depending on the work function of the cathode material.

Light Emitting Device

A light emitting device having an encapsulant with scattering features to tailor the spatial emission pattern and color temperature uniformity of the output profile. The encapsulant is formed with materials having light scattering properties. The concentration of these light scatterers is varied spatially within the encapsulant and/or on the surface of the encapsulant. The regions having a high density of scatterers are arranged in the encapsulant to interact with light entering the encapsulant over a desired range of source emission angles. By increasing the probability that light from a particular range of emission angles will experience at least one scattering event, both the intensity and color temperature profiles of the output light beam can be tuned.

Encapsulant with scatterer to tailor spatial emission pattern and color uniformity in light emitting diodes

Overmolded lenses and certain fabrication techniques are described for LED structures. In one embodiment, thin YAG phosphor plates are formed and affixed over blue LEDs mounted on a submount wafer. A clear lens is then molded over each LED structure during a single molding process. The LEDs are then separated from the wafer. The molded lens may include red phosphor to generate a warmer white light. In another embodiment, the phosphor plates are first temporarily mounted on a backplate, and a lens containing a red phosphor is molded over the phosphor plates. The plates with overmolded lenses are removed from the backplate and affixed to the top of an energizing LED. A clear lens is then molded over each LED structure. The shape of the molded phosphor-loaded lenses may be designed to improve the color vs. angle uniformity. Multiple dies may be encapsulated by a single lens. In another embodiment, a prefabricated collimating lens is glued to the flat top of an overmolded lens.

LED with phosphor tile and overmolded phosphor in lens

A novel LED light source, “Luxeon Direct”, has been integrated into a highly efficient direct backlight This concept incorporates one of the latest LEDs released by Lumileds™ This direct backlight approach integrates side emitting LEDs with a highly reflective cavity placed behind the LCD Prior to this method it has been very difficult to use high power red, green and blue (RGB) LEDs in a direct backlight design due to the high color and brightness uniformity requirements In this paper a method will be demonstrated that can achieve excellent backlight performance using an indirect illumination approach with high power LEDs

https://www.breault.com/sites/default/files/knowledge_base/wp_sid_009_high_brightness.pdf

43.4: High Brightness Direct LED Backlight for LCD-TV

A light emitting diode (LED) based illumination device include a plurality of LEDS mounted to mounting board and includes a transmissive plate disposed above the LEDs. The transmissive plate includes an amount of wavelength converting material configured to change a wavelength of an amount of light emitted by the plurality of LEDs. A base reflector structure is coupled to the LED mounting board and the transmissive plate between at least two of the LEDs. In another configuration, a dam of reflective material surrounds the LEDs and is coupled to the LED mounting board and the transmissive plate, while a dam of thermally conductive material surrounds the dam of reflective material. In another configuration, the LED mounting board has a protrusion of thermally conductive material that surrounds the LEDs and is coupled to the transmissive plate, and has a void on the side opposite the protrusion.

Stefan Eberle

Papers

LED with phosphor tile and overmolded phosphor in lens

43.4: High Brightness Direct LED Backlight for LCD-TV

Integrated led based illumination device