A heat exchanger and method of manufacturing thereof comprises an interface layer for cooling a heat source. The interface layer is coupled to the heat source and is configured to pass fluid therethrough. The heat exchanger further comprises a manifold layer that is coupled to the interface layer. The manifold layer includes at least one first port that is coupled to a first set of individualized holes which channel fluid through the first set. The manifold layer includes at least one second port coupled to a second set of individualized holes which channel fluid through the second set. The first set of holes and second set of holes are arranged to provide a minimized fluid path distance between the first and second ports to adequately cool the heat source. Preferably, each hole in the first set is positioned a closest optimal distance to an adjacent hole the second set.

Method and apparatus for efficient vertical fluid delivery for cooling a heat producing device

A microchannel heat exchanger coupled to a heat source and configured for cooling the heat source comprising a first set of fingers for providing fluid at a first temperature to a heat exchange region, wherein fluid in the heat exchange region flows toward a second set of fingers and exits the heat exchanger at a second temperature, wherein each finger is spaced apart from an adjacent finger by an appropriate dimension to minimize pressure drop in the heat exchanger and arranged in parallel. The microchannel heat exchanger includes an interface layer having the heat exchange region. Preferably, a manifold layer includes the first set of fingers and the second set of fingers configured within to cool hot spots in the heat source. Alternatively, the interface layer includes the first set and second set of fingers configured along the heat exchange region.

Interwoven manifolds for pressure drop reduction in microchannel heat exchangers

A heat exchanger apparatus and method of manufacturing comprising: an interface layer for cooling a heat source and configured to pass fluid therethrough, the interface layer having an appropriate thermal conductivity and a manifold layer for providing fluid to the interface layer, wherein the manifold layer is configured to achieve temperature uniformity in the heat source preferably by cooling interface hot spot regions. A plurality of fluid ports are configured to the heat exchanger such as an inlet port and outlet port, whereby the fluid ports are configured vertically and horizontally. The manifold layer circulates fluid to a predetermined interface hot spot region in the interface layer, wherein the interface hot spot region is associated with the hot spot. The heat exchanger preferably includes an intermediate layer positioned between the interface and manifold layers and optimally channels fluid to the interface hot spot region.

Method and apparatus for flexible fluid delivery for cooling desired hot spots in a heat producing device

Liquid-based cooling solutions used to transfer heat produced by one or more heat generating devices from one or more electronics servers to the ambient. Each electronics server includes one or more heat generating devices. Integrated onto each electronics server is a liquid based cooling system. Each liquid based cooling system includes a server pump and one or more microchannel cold plates (MCP) coupled together via fluid lines. The liquid based cooling system for each electronics server includes a rejector plate configured with micro-channels. The MCPs, the server pump and the rejector plate form a first closed loop. The rejector plate is coupled to a chassis cold plate via a thermal interface material. In a multiple electronics server configuration, the rejector plates for each of the electronics servers are coupled to the chassis cold plate configured with fluid channels which are coupled via fluid lines to a liquid-to-air heat exchanging system to form a second closed loop.

Liquid cooling loops for server applications

An apparatus for cooling at least one heated surface includes a base plate defining a number of inlet and outlet manifolds. The inlet manifolds are configured to receive a coolant, and the outlet manifolds exhaust the coolant. The inlet and outlet manifolds are interleaved. The apparatus also includes at least one substrate having inner and outer surfaces. The inner surface is coupled to the base plate and defines a number of microchannels that receive the coolant from the inlet manifolds and deliver the coolant to the outlet manifolds. The microchannels are oriented substantially perpendicular to the inlet and outlet manifolds. The outer surface is in thermal contact with the heated surface. The apparatus also includes an inlet plenum that supplies the coolant to the inlet manifolds, and an outlet plenum that exhausts the coolant from the outlet manifolds. The inlet plenum and outlet plenum are oriented in a plane of the base plate.

Heat sink with microchannel cooling for power devices

Methods and apparatuses for cooling a device are disclosed The device may be an electrical or electronic component that includes an integrated circuit or embedded control The apparatus employs a fluid that near or above its critical pressure and at least one heat exchanger At least two configurations are disclosed: one with a pump and another without a pump

Methods and apparatuses for electronics cooling

A thin-plate microchannel structure of channel depth of 500 microns or less and capable of withstanding pressure up to 6,000 psi inch is disclosed. The thin-plate microchannel structure may be formed from metal, ceramic or polymeric materials. It can be employed to facilitate the exchange of heat between a single fluid in liquid, gaseous or supercritical state and another device, such as an integrated circuit, with which it is near or in contact.

Thin-plate microchannel structure

A method and apparatus for actively cooling a device, space or circuit board are disclosed. The device may be an electrical or electronic component that includes an integrated circuit or embedded control. The apparatus employs a fluid in a closed loop, at least two heat exchangers and a fluid driver.

Method and apparatus for electronics cooling

A heat sink is disclosed including a cold plate, a plurality of heat pipes, and a plurality of fins. The cold plate has a first surface arranged substantially vertical and adapted to thermally couple to a heat source. Each of the plurality of heat pipes have an evaporator section arranged substantially vertical and thermally coupled to the cold plate, a condenser section arranged at an incline, and a single bend section coupling the evaporator section and the condenser section. The plurality of fins are thermally coupled to the condenser sections of the plurality of heat pipes.

Heat pipe heat sink for high power density

A heat sink is disclosed including a cold plate, a plurality of heat pipes, a plurality of fins, and a heating unit. The cold plate has a first surface adapted to thermally couple to a heat source. Each of the heat pipes has an evaporator section thermally coupled to the cold plate and a condenser section coupled to the evaporator section. The plurality of fins are thermally coupled to the condenser sections of the plurality of heat pipes. The heating unit is adapted to heat condenser sections of a subset of the plurality of heat pipes.

Stephan Fatschel

Papers

Methods and apparatuses for electronics cooling

Thin-plate microchannel structure

Method and apparatus for electronics cooling

Heat pipe heat sink for high power density

Heat pipe heat sink with heating unit