A lightweight radio/CD player for vehicular application is virtually “fastenerless” and includes a case and frontal interface formed of polymer based material that is molded to provide details to accept audio devices such as playback mechanisms (if desired) and radio receivers, as well as the circuit boards required for electrical control and display. The case and frontal interface are of composite structure, including an insert molded electrically conductive wire mesh screen that has been pre-formed to contour with the molding operation. The wire mesh provides EMC, RFI, BCI and ESD shielding and grounding of the circuit boards via exposed wire mesh pads and adjacent ground clips. The PCB architecture is bifurcated into a first board carrying common circuit components in a surface mount configuration suitable for high volume production, and a second board carrying application specific circuit components in a wave soldered stick mount configuration. The major components and subassemblies are self-fixturing during the final assembly process, eliminating the need for dedicated tools, fixtures and assembly equipment. The major components and subassemblies self-interconnect by integral guide and connection features effecting “slide lock” and “snap lock” self-interconnection. The radio architecture includes improved push buttons employing 4-bar living hinge linkage and front loaded decorative trim buttons.

Lightweight audio system for automotive applications and method

An electronic package having enhanced heat dissipation is provided exhibiting dual conductive heat paths in opposing directions. The package includes a substrate having electrical conductors thereon and a flip chip mounted to the substrate. The flip chip has a first surface, solder bumps on the first surface, and a second surface oppositely disposed from the first surface. The flip chip is mounted to the substrate such that the solder bumps are registered with the conductors on the substrate. The package further includes a stamped metal heat sink in heat transfer relationship with the second surface of the flip chip. The heat sink includes a cavity formed adjacent to the flip chip containing a thermally conductive material.

Flip chip heat sink package and method

In a power drive unit having power modules (three-phase inverter circuits) connected to a control circuit board, bus bars extending from the power modules and a current sensor each installed near the bus bars and including a sensing element that detects currents outputted from the bus bars, there are provided a sensor board on which the sensing element is mounted, and lead pins each connecting the sensor board to the control circuit board and having a bowed shape whose one end is connected to the sensor board and other end once extends away from the circuit board and then turns back toward the circuit board. With this, the circuit board and current sensors can be connected through the lead pins without increasing the distance therebetween and stress produced in the lead pins can be alleviated, thereby enabling the unit to be minimized in size and utilized in a harsh service environment.

Power drive unit

A system and method for conducting heat from electrical devices mounted on a circuit board is disclosed. A heat sink for conducting the heat is provided that includes a pair of substantially parallel vertical legs and a horizontal member coupled between the pair of substantially parallel vertical legs to form a “U” shape. The horizontal member includes an outer surface and an inner surface both having a layer of thermal interface material. The heat sink is surface mountable to a heat sink mounting pad on a surface of a printed circuit board. The heat sink mounting pad is adjacent to and thermally coupled to a heat transfer pad of an electronic device. The heat sink is thermally coupled to the electronic device.

Surface mounted conduction heat sink

The electronic control enclosure includes devices and methods for removing heat energy from the electronic components of an electronic control unit. The components are mounted to a substrate and are protectively housed in an interior chamber of an environmentally sealed enclosure housing. Electrical communication is established with the components via a header assembly that includes plug receptacles. To remove heat generated by the components from the enclosure housing, one or more heat sinks are disposed through the enclosure housing such that the heat sinks have an interior surface exposed to the interior chamber and an exterior surface exposed to the exterior of the enclosure housing. In other embodiments, the enclosure housing may be made of a heat conductive material and the heat sink is integral with the enclosure housing. In one aspect, a spring urges the components against the interior surface. In another aspect, the components are mounted to and directly contact the interior surface.

Electronic control enclosure

A heat sink assembly to remove heat from electrical components mounted on a circuit board is disclosed. The assembly contains a housing that is formed from a suitable heat sinking material and is appropriate for receiving a circuit board with surface mounted electrical components. The invention provides an improved apparatus for establishing thermal contact from a heat generating, surface mounted electrical component to the housing. A resilient biasing element is fixed in relation to the circuit board and the housing in order to urge the circuit board with a plurality of surface mounted electrical components in thermal contact with the housing. Once the heat sink is assembled the invention provides various means for which heat can be readily transferred from the electrical components to the housing. Heat can be transferred away from the electrical component to the housing through a thermal via incorporated within the circuit board, though the resilient biasing element, or by direct contact of the electrical component and the housing.

Heat sink assembly for electrical components

An electronic fuel injector driver circuit is a high speed operator of electromagnetic fuel injector valves for internal combustion engine. The drive circuit includes a solenoid coil for each electromagnetic fuel injector. A one shot timer circuit sends a predetermined timing signal to a first controller circuit interconnecting the one shot timer circuit and the solenoid coil wherein the predetermined timing signal is used to control the high side of the solenoid coil. A second controller circuit is connected to the solenoid coil and controls the low side of the solenoid coil in response to the predetermined timing signal. A switchable voltage reference circuit is connected to the second controller circuit and controls current through the solenoid coil.

Electronic fuel injector driver circuit

An electronic oil pressure transducer circuit interfaces a piezoresistive pressure sensor to magnetic needle movement and lamp or electronic instrument control computer for reliable automotive engine oil pressure instrumentation. Circuit design uses standard components suited for automotive under-hood environment. Calibration is performed at the design level, eliminating the need for expensive on-line procedures. Circuit assembly is designed for automated, high-volume production.

Stephen W. Burcham

Papers

Heat sink assembly for electrical components

Electronic fuel injector driver circuit

Electronic oil pressure sensor circuit