Damascene copper electroplating for on-chip interconnections, a process that we conceived and developed in the early 1990s, makes it possible to fill submicron trenches and vias with copper without creating a void or a seam and has thus proven superior to other technologies of copper deposition. We discuss here the relationship of additives in the plating bath to superfilling, the phenomenon that results in superconformal coverage, and we present a numerical model which accounts for the experimentally observed profile evolution of the plated metal.

Damascene copper electroplating for chip interconnections

Electrodeposition of Ni-Fe alloys, composites, and nano coatings–A review

Development of electroplated magnetic materials for MEMS

A method for providing a structure in a magnetic recording transducer is described. The method includes plating a first layer in a plating bath using a first plurality of plating conditions. The first layer has a first galvanic potential. The method also includes modifying the plating bath and/or the first plurality of plating conditions to provide a modified plating bath and/or a second plurality of plating conditions. The method further includes plating a second layer using the modified plating bath and/or the second plurality of plating conditions. The second layer has a second galvanic potential. The first galvanic potential is between the second galvanic potential and a third galvanic potential of a third layer if the third layer adjoins the first layer. The second galvanic potential is between the first galvanic potential and the third galvanic potential of the third layer if the third layer adjoins the second layer.

Method and system for corrosion protection of layers in a structure of a magnetic recording transducer

Provided is a thin film magnetic head capable of improving recording performance The thin film magnetic head comprises a laminate including a main pole layer and an auxiliary pole layer being disposed in a region facing the main pole layer with a non-magnetic layer in between After magnetic flux generated in a thin film coil is contained in the auxiliary pole layer through the non-magnetic layer, and then is concentrated on a front end neighboring portion of a front end portion in the auxiliary pole layer, the magnetic flux passes through the non-magnetic layer again so as to flow into a front end portion of the main pole layer A “main magnetic flux incoming route” flowing from a rear end portion to the front end portion in the main pole layer and an “auxiliary magnetic flux incoming route” flowing from the auxiliary pole layer to the front end portion of the main pole layer can be obtained, so an amount of the magnetic flux supplied to a portion of the front end portion of the main pole layer on a trailing side increases As a sufficient amount of the magnetic flux is supplied to a portion of the front end portion of the main pole layer on the trailing side so that an emitting amount of the magnetic flux increases, thereby a generation intensity and a magnetic field gradient of a perpendicular magnetic field can be obtained

Thin film magnetic head, method of manufacturing the same, and magnetic recording apparatus

The properties of soft magnetic CoNiFe films electrodeposited in the presence of saccharin and sodium lauryl sulfate additives were studied in terms of their thickness and substrate dependence. Auger depth profile analysis of the elemental composition in CoNife films electrodeposited over different substrates (Pd 00 Ni 10. 1.0 T NiFe.Cu) demonstrate that the average composition at the substrate interface and bulk deposited films remains constant. X-ray diffraction (XRD) measurements reveal the existence of mixed fcc + bcc phase with larger amounts of bcc crystallites near the substrate side of the films, i.e.,at the lower thickness. XRD and transmission electron microscopy measurements revealed a larger grain size at the CoNiFe/substrate interface. The measured average stress is both substrate- and thickness-dependent. The easy-axis coercivity, H c , follows the Neel's relation H c = ct n (t is the thickness and c is a constant). It was found that the value of the exponent n is substrate dependent. Mechanisms related to the coercivity of CoNiFe films deposited ovar different substrates (1.0 T NiFe, Cu, Pd 90 Ni 10 , high magnetic moment CoNiFe) are discussed in terms of material properties of these magnetic films.

Composition, Structure, Stress, and Coercivity of Electrodeposited Soft Magnetic CoNiFe Films: Thickness and Substrate Dependence

Enhancement of current for solutions, containing Ni +2 , Fe +2 , and H + ions, has been observed by linear sweep voltammetry and chronoamperometry when a magnetic field of 0.1 T was applied parallel to the cathode. The current enhancement in a magnetic field was attributed to the convection near the electrode surface induced by the Lorentz force. There is a decrease of the Fe content in NiFe films by approximately 4% obtained with applied magnetic field. It was also demonstrated that the applied magnetic field affects the magnetic properties, crystalline structure and/or texture, stress, and surface roughness of NiFe films.

Effect of Magnetic Field on Electrode Reactions and Properties of Electrodeposited NiFe Films

The electroplated magnetic alloys 1.0T Ni80Fe20, 1.6T Ni45Fe55, 2.4T Co40Fe60, obtained in the presence of saccharin, and sputtered magnetic alloys of the same composition showed dramatically different corrosion properties at pH 5.9. The higher corrosion susceptibility of electroplated magnetic alloys, known for many years, was generally attributed to sulfur inclusions into the deposit. However, there was no direct evidence of the structure of sulfur-containing molecules included in deposit. We have analyzed electroplated, EP-CoFe, and sputtered, SP-CoFe, magnetic films using electrochemical, secondary ion mass spectroscopy, X-ray photoelectron spectroscopy XPS, and high-pressure liquid chromatography HPLC techniques. The analysis of electroplated CoFe films obtained in the presence of saccharin revealed saccharin, benzamide, o-toluenbenzamide HPLC and metal sulfides XPS in EP-CoFe deposit. The proposed mechanism for saccharin transformation to metal sulfides involves four steps: i a reductive cleavage of C-S bond in saccharin giving rise to benzamido sulfinate, ii a desulfurization step leading to benzamide and sulfur dioxide, iii an electrochemical reduction of sulfur dioxide to hydrogen sulfide, and iv a reaction between H2 Sa nd M +2

Mechanism of Saccharin Transformation to Metal Sulfides and Effect of Inclusions on Corrosion Susceptibility of Electroplated CoFe Magnetic Films

Stress evolution in CoxFe1−x (x = 0.33–0.87) electrodeposited films

The composition gradient and properties of magnetic 5–100 nm thin CoNiFe films electrodeposited on Cu or Pt substrate were studied. It was found that the average elemental composition of CoNiFe, obtained by ICP analysis, changes during electrodeposition. The extent of anomalous co-deposition achieved at deposit thickness 100 nm. The observations related to the experimental results could be explained through a modified BockrisDrazic-Despic reduction mechanism. The time-dependent dynamics of roughening surface exhibits two characteristic regions, i.e. the first with fast roughening at the thickness 100 nm. The stress evolution show typical compressive-tensile-compressive behavior in the thickness range 5–100 nm. The crystal structure of 20 nm CoNiFe films is mixed fcc + bcc crystallites with the larger grain size close to the substrate while thick films show fcc-rich structure. The mechanism of coercivity in CoNiFe films is governed by magnetoelastic anisotropy and follows Neel’s thickness dependence relation, i.e. Hc = c t−n. The “volcano” type of Hc-t curve obtained at 5–50 nm was explained taking into account: change of composition, stress, crystal structure and roughness. © 2012 The Electrochemical Society. [DOI: 10.1149/2.082207jes] All rights reserved.

http://www.researchgate.net/profile/Steve_Riemer/publication/265122663_Composition_Gradients_and_Magnetic_Properties_of_5100_nm_Thin_CoNiFe_Films_Obtained_by_Electrodeposition/links/53ff33c00cf283c3583c8538.pdf

Steve Riemer

Papers

Composition, Structure, Stress, and Coercivity of Electrodeposited Soft Magnetic CoNiFe Films: Thickness and Substrate Dependence

Effect of Magnetic Field on Electrode Reactions and Properties of Electrodeposited NiFe Films

Mechanism of Saccharin Transformation to Metal Sulfides and Effect of Inclusions on Corrosion Susceptibility of Electroplated CoFe Magnetic Films

Stress evolution in CoxFe1−x (x = 0.33–0.87) electrodeposited films

Composition Gradients and Magnetic Properties of 5–100 nm Thin CoNiFe Films Obtained by Electrodeposition