An apparatus for spreading the heat generated by a semiconductor device. In one embodiment, a semiconductor device, such as a CPU, is mounted to a package substrate. A cover is attached to the package substrate creating a space therebetween for accommodating the semiconductor device. The package cover includes an external top surface and an external bottom surface and an inner cavity that comprises a heat pipe. The semiconductor device is thermally coupled to the bottom external surface of the cover.

Heat pipe lid for electronic packages

A cooling apparatus using 'low profile extrusions' is disclosed. The cooling apparatus of the present invention may be incorporated into a closed loop liquid cooling system which is particularly well suited to heat removal from electronic components in applications where space is limited. A cooling system in accordance with the present invention is illustrated for use in a typical wireless telecommunication bases station for removing heat from power amplifiers and other electronic components. Cooling is carried out by drawing heat away from the electronic components and into at least one low profile extrusion attached directly to the heat generating components or a heat sink, and transferring the removed heat to a cooling fluid circulating through a plurality of micro tubes or channels within each low profile extrusion. The cooling fluid is subsequently pumped through a liquid-to-air heat exchanger, to reject the removed heat into the atmosphere, prior to being recirculated through each of the low profile extrusions.

Electronic enclosure cooling system

A heat pipe heat spreader is provided having a substantially L-shaped enclosure with an internal surface and a plurality of post projecting from the surface. A working fluid is disposed within the enclosure, and a grooved wick is formed on at least a portion of the internal surface. The grooved wick includes a plurality of individual particles having an average diameter, and including at least two lands that are in fluid communication with one another through a particle layer disposed between the at least two lands that comprises less than about six average particle diameters. A method for making a grooved heat pipe wick on an inside surface of a heat pipe container a layer of sintered powder between adjacent grooves that comprises no more than about six average particle diameters.

Vapor chamber with sintered grooved wick

The present invention provides a thermal energy management architecture (5) for a functioning system of electronic components and subsystems (10) comprising a hierarchical scheme in whic thermal management components are: (i) operatively engaged with individual protions of the system of electronic components (22) and subsystems (24), in multiple defined levels and (ii) substantially only thermally driven, i.e., heat transfer devices (12, 14, 16, 18) that have no moving parts and require no external power for their operations. In one embodiment thermal management devices and technologies are divided into five separate levels within a functioning electronics system. In another embodiment, a sixth level is provided for bypassing one or more of the five levels.

Integrated thermal architecture for thermal management of high power electronics

A cooling apparatus having a plurality of heat pipes is improved to reduce the condensation capacity of selected heat pipes when ambient air temperature is low, so as to facilitate start-up of the cooling apparatus from a state in which the working fluid in the heat pipes has been frozen. The cooling apparatus has a block of a high heat conductivity in which one end of each heat pipe serving as an evaporation section of the heat pipe is embedded. Heat radiation fins are attached to portions of the heat pipes exposed from the block, so that the exposed portions of the heat pipes serve as condensation sections of the respective heat pipes. There are two types of heat radiation fins: a first type of fins which are attached to all the heat pipes and a second type of fins which are attached only to selected heat pipes.

Heat-pipe type cooling apparatus

A heat pipe type cooling apparatus for a semiconductor, comprises a plurality of first copper pipes, each of the first pipes having a plurality of V-shaped grooves formed in an inner surface thereof and arranged in a circumferential direction thereof, and a plurality of second copper pipes, each of the second pipes having a plurality of second grooves formed in an inner surface thereof, each of the second grooves having an opening narrower than an inner part thereof. A plurality of ceramic pipes connect the first pipes and the second pipes, through intermediate pipes made of a nickel-iron alloy. One end of each of the second pipes is inserted in a metal block on which a semiconductor is mounted.

Heat pipe type cooling apparatus for semiconductor

PURPOSE: To prevent the transfer of a potential from a thyristor to a heat sink part, by connecting a heat pipe part, in which a fin is inserted and which forms the heat sink part, and a heat pipe part, which is inserted in a metal block and forms an endothermic part, through an electrically insulating film pipe, and forming each heat pipe. CONSTITUTION: A fin is inserted in each heat pipe 1 and a heat skink is formed. A heat pipe 1' is inserted in a metal block 3 and forms an endothermic part. The heat pipe 1 and the heat pipe 1' are connected through an electric insulating pipe 8. V shaped grooves are formed in the inner surface of the pipe 1. The upper end part of the pipe is formed in a semi-spherical shape, and a nozzle 6 is formed at the tip. After actuating liqiid 10 is supplied, the nozzle 6 is sealed. Grooves having a hollow part 12 are provided in an opening part 11 and the deep place in the inner surface of the pipe 1'. The heat dispersion property and the endothermic property are improved by these grooves. Then, only heat is conducted to the heat sink part. The heat sink part is electrically insulated. Thus the risk of electric shock can be prevented. COPYRIGHT: (C)1987,JPO&Japio

Suemi Tanaka

Papers

Heat pipe type cooling apparatus for semiconductor

Heat pipe cooler for semiconductor and manufacture thereof