S
Susan H. Downey
Researcher at Freescale Semiconductor
Publications - 10
Citations - 395
Susan H. Downey is an academic researcher from Freescale Semiconductor. The author has contributed to research in topics: Wire bonding & Layer (electronics). The author has an hindex of 6, co-authored 10 publications receiving 395 citations.
Papers
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Patent
Semiconductor device having a wire bond pad and method therefor
TL;DR: In this article, the wire bond pad (53) allows routing of conductors in a final metal layer directly underlying the bond pad, thus allowing the surface area of the semiconductor die to be reduced.
Patent
Inductive device including bond wires
Yaping Zhou,Susan H. Downey,Sheila Chopin,Tu-Anh N. Tran,Alan H. Woosley,Peter R. Harper,Perry H. Pelley +6 more
TL;DR: In this paper, an inductive device is formed above a substrate ( 225 ) having a conductive coil formed around a core ( 109 ), the coil comprises segments formed from a first plurality of bond wires and a second plurality of wire bond wires.
Patent
Integrated circuit die I/O cells
TL;DR: In this article, the I/O cell of an integrated circuit die includes an input/output (I/O) cell, a plurality of metal interconnect layers, an insulating layer, a first pad, and a second pad.
Patent
Packaged ic using insulated wire
Susan H. Downey,Peter R. Harper +1 more
TL;DR: In this paper, an IC die is attached to a package substrate, where bond pads of the IC die are electrically connected to bond fingers of the substrate with insulated wire, and the insulator coating includes an inorganic covalently-bonded substance that is not an oxide of the electrically conductive core such as, e.g., silicon nitride or silicon oxide.
Patent
Method and apparatus for providing structural support for interconnect pad while allowing signal conductance
TL;DR: In this paper, the authors proposed a method to provide an interconnect structure having enhanced structural support when underlying functional metal layers are insulated with a low modulus dielectric, where a first metal layer having a plurality of openings overlies the substrate.