S
Suyog Jhavar
Researcher at Indian Institute of Technology Indore
Publications - 17
Citations - 426
Suyog Jhavar is an academic researcher from Indian Institute of Technology Indore. The author has contributed to research in topics: Deposition (phase transition) & Die (manufacturing). The author has an hindex of 6, co-authored 15 publications receiving 311 citations. Previous affiliations of Suyog Jhavar include University of Texas at Austin & Narsee Monjee Institute of Management Studies.
Papers
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Causes of failure and repairing options for dies and molds: A review
TL;DR: In this paper, the authors present a comprehensive study of the die and mold repairing industries and assist the selection of the most appropriate process depending upon the availability of resources with thorough knowledge of the advantages and limitations.
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Development of micro-plasma transferred arc (μ-PTA) wire deposition process for additive layer manufacturing applications
TL;DR: In this paper, a micro-plasma transferred arc (μ-PTA) deposition process has been used for small-scale fabrication and repair of the defective dies and molds.
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Parametric review of microwave-based materials processing and its applications
TL;DR: In this article, the authors provide insights into microwave-based heating parameters and their effect on the response parameters of major microwave processing applications and identify the future scope of research in this field.
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Micro-Plasma Transferred Arc Additive Manufacturing for Die and Mold Surface Remanufacturing
TL;DR: In this article, an automatic micro-plasma deposition setup was deployed to deposit a wire of 300µm of AISI P20 tool steel on the substrate of the same material for the potential application in remanufacturing of the die and mold surface.
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Enhancement of Deposition Quality in Micro-plasma Transferred Arc Deposition Process
TL;DR: In this article, the authors proposed an elliptical arc model for the micro-plasma-transferred arc (µPTA) wire deposition process to predict the cross-sectional area of each deposition track and the overlap between successive deposition tracks.