A cooling apparatus comprises a first outer portion comprising a fluid inlet and a first exterior cooling surface A first fluid-diverting structure is in fluid communication with the fluid inlet A second outer portion comprises a fluid outlet and a second exterior cooling surface A second fluid-diverting structure is in fluid communication with the fluid outlet An electrical substrate is coupled to at least one of the first and second exterior cooling surfaces An intermediate portion is in a facing relationship with the first and second outer portions The intermediate portion defines an aperture for transferring a fluid between a first cavity and a second cavity The first cavity is defined between the first outer portion and the intermediate portion The second cavity is defined between the second outer portion and the intermediate portion The fluid absorbs heat from the electrical substrate

Cooling apparatus for an electrical substrate

An apparatus including a primary device and at least one secondary device coupled in a planar array to a substrate; a first heat exchanger disposed on the primary device and having an opening over an area corresponding to the at least one secondary device; a second heat exchanger disposed in the opening on the at least one secondary device; at least one heat pipe coupled to the first heat exchanger and the second heat exchanger. A method including placing a heat exchanger on a multi-chip package, the heat exchanger including a first portion, a second portion and at least one heat pipe coupled to the first portion and the second portion; and coupling the heat exchanger to the multi-chip package.

Heat Sink Coupling Using Flexible Heat Pipes for Multi-Surface Components

Device for controlling the radiant heat area of heat sink

PURPOSE: To provide a cooling system which is used for various electronic packages used in an electronic equipment, especially capable of efficiently cooling a highly-dense electronic package used in an electronic equipment, and limits less the freedom of design for an electronic equipment. CONSTITUTION: A cooling system is equipped with a heat radiator 40 installed in a separate housing site previously prepared inside the case of an electronic equipment, a heat transfer plate element 36 provided so as to receive heat from a electronic package in the case, and a heat conduction path element 38 provided between the heat transfer plate element 36 and the heat radiator to transmit heat.

Suzuki Masahiro

Papers

Cooling system of electronic package