A manufacturing method for a semiconductor unit which is capable of reducing the generation of a camber of a base member and enhancing reliability in operation. The method comprises the steps of: preparing a lead frame having an outer lead portion and an inner lead portion; preparing an upper mold and a lower mold for forming a cavity; holding the outer lead portion of the lead frame between the upper mold and the lower mold, and injecting molten resin in a cavity formed between the upper and lower molds and hardening the resin, thereby forming a base member having a recessed portion at its approximately central portion and a frame portion which surrounds the outside of an opening portion of the recessed portion and holds the inner lead portion of the lead frame between the base member and the frame portion; mounting a semiconductor device in the recessed portion, and connecting the semiconductor device to the inner lead of the lead frame; and potting a translucent resin in the recessed portion for sealing the semiconductor device.

Manufacturing method for semiconductor unit

Fiber-reinforced composites are made from introducing a fabric into the lower part of an open two-part mold, closing the mold and injecting into the mold under pressure and curing a reactive resin mixture comprising (a) a strained cycloolefin and (b) a ruthenium-containing catalyst.

Process for the manufacture of fibre-reinforced composites

Disclosed herein are polymeric molds that can be used to make molded articles. The polymeric molds are made from cyclic olefin polymers that may be formed by ring opening metathesis polymerization (ROMP) of a polycyclic monomer having two or more reactive double bonds and a cyclic monomer comprising one reactive double bond. Fluorinated monomers may be used. The polymeric molds may be structured molds in that they have at least one microstructured feature having a dimension of less than about 2 mm, or less than about 500 um. The polymeric molds may also have a plurality of such microstructured features. Also disclosed herein are methods of making the polymeric molds, methods of making molded articles therefrom, and the molded articles.

Polymeric molds and articles made therefrom

A method for molding a thermoplastic resin by filling a molten thermoplastic resin into a mold which comprises carrying out the molding of the resin while reducing the solidification temperature of the resin surface which contacts with the mold during the step of filling the resin. According to this molding method, the state of the mold surface can be faithfully transferred to molded articles.

Method for molding thermoplastic resin

Products having improved green strength, improved physical properties and improved thermal properties are prepared via the RIM process using a reaction mixture containing an isocyanate, a specific low molecular weight diol or triol, and a specified amine terminated material.

Production of moldings by the reaction injection molding process

This invention pertains to the use of an organic fluorine compound as a mold release agent wherein at least one norbornene compound is polymerized by ring opening in a mold coated with said release agent. The organic fluorine compound release agent can be used in combination with a conventional mold release agent.

Reaction injection molding method

PURPOSE:To provide the manufacturing method of an insert molded product and a metal mold device used therefor without attachment of resin burr to the surrounding part of an insert member, which is embedded in the insert molded product, and without cleaning and removal of the resin burr after the molding, when the insert molding is performed by using a molding material having the low viscosity, e.g. in reflection injection molding. CONSTITUTION:An insert-molding metal mold device is mounted on either of a first metal mold 22 or a second metal mold. The second metal mold is combined with the first metal mold 2, and a cavity is formed in the inside. A pinhole 46, which faces the inside of the cavity, is formed in a pin attaching part 44 having elasticity. A pin part 62, which is coupled into the pinhole 46 of the pin attaching part 44 so that the pin part is freely coupled and removed, is formed in an insert holding tool 60. An insert nut 66, which is molded as the insert, is fixed to the insert holding tool 60 with a screw. These parts are provided.

Manufacture of insert molded product and mold device therefor

PROBLEM TO BE SOLVED: To form a skin layer excellent in appearance and touch on the arbitrary surface of a molded product and to prevent the adverse effect on the dimensional accuracy of a molded product by thermal expansion even if the temp. of a mold is different. SOLUTION: A mold apparatus 2 having a first mold 4 formed from material quality large in the coefficient of linear expansion and a second mold 6 formed from material quality low in the coefficient of linear expansion is used and, in such a state that the temp. of the second mold 6 is higher than that of the first mold 4, a reactive raw soln. is injected into the cavity of the mold apparatus 2 to perform reactive injection molding. The second mold 6 and the first mold 4 are constituted of material qualities different in the coefficient of linear expansion and making the absolute values of the quantities of thermal expansion of the molds 4, 6 almost equal by the difference between the temps. of the molds 4, 6. That is, the first mold 4 is a cast aluminum mold and the second mold 6 is an electroforming mold. COPYRIGHT: (C)1997,JPO

Tadao Hamada

Papers

Reaction injection molding method

Manufacture of insert molded product and mold device therefor

Manufacture of reactive injection molded product and mold apparatus