A multiple layer inductor has a first spiral conductive pattern disposed on a first surface; a second spiral conductive pattern disposed on a second surface; a continuing interconnection coupled to the first and second spiral conductive patterns; an interface coupled to the first and second spiral conductive patterns; and a conductive shield pattern disposed on a third surface that is adjacent to the second surface. The interface includes a first terminal disposed on the first surface that is coupled to the first spiral conductive pattern. The interface also includes a second terminal that is disposed on the first surface and coupled to said second spiral conductive pattern.

Multiple layer inductor and method of making the same

A navigation assembly ( 5 l ) for mounting a navigational device ( 10 l ) in an open port ( 12 l ) of a vehicle resulting from removal of a non-navigational component is provided. The navigation assembly ( 5 l ) broadly comprises a mounting assembly ( 218 l ) and the navigational device ( 10 l ). The mounting assembly ( 218 l ) is mounted within the open port ( 12 l ), and the navigational device ( 10 l ) is fixedly or removably attached to the mounting assembly ( 218 l ), such that the navigational device ( 10 l ) may be linearly raised or lowered between two viewing positions that are in a general linear relationship to each other. The navigational device ( 10 l ) is operable to pivot left and right within the open port ( 12 l ). Additionally, a navigation assembly ( 5 m ) broadly comprising a mounting assembly ( 218 m ) and a navigational device ( 10 m ) for raising and lowering the navigational device ( 10 m ) among three viewing positions that are in a general linear relationship to each other is provided.

Navigational device for installation in a vehicle and a method for doing same

A method and structure for a three-axis magnetic field sensing device is provided. The device includes a substrate, an IC layer, and preferably three magnetic field sensors coupled to the IC layer. A nickel-iron magnetic field concentrator is also provided.

Three axis magnetic sensor device and method

A computer implemented method for initiating capture of an image on a computer system, performed by the computer system that is programmed to perform the method includes determining by a physical sensor of the computer system, a change in physical state of the computer system, wherein the change in physical state is associated with a magnitude of change in physical state, determining by the computer system, whether the magnitude of change in physical state by the physical sensor exceeds a threshold level, determining by the computer system, a plurality of parameters for a camera associated with the computer system, and initiating by the computer system, capture of one or more images using the camera after the magnitude of change in physical state by the physical sensor exceeds the threshold level.

Methods and apparatus for initiating image capture on a hand-held device

An apparatus for packaging MEMS and ICs can include a semiconductor substrate, one or more MEMS devices, an enclosure, and one or more bonding structures. The semiconductor substrate can be bonded to a portion of the surface region. The semiconductor substrate can include one or more integrated circuits. Also, the semiconductor substrate can have an upper surface region. The one or more MEMS devise can overlie an inner region of the upper surface region formed by the semiconductor substrate. The enclosure can house the one or more MEMS devices. The enclosure can overlie a first outer region of the upper surface region. Also, the enclosure can have an upper cover region. The one or more bonding structures can be provided within a second outer region of the supper surface region.

Integrated MEMS and CMOS package and method

A multilayer microelectronic circuit to be directly mounted on a substrate and to be used, for example, as a resonator. The multilayer microelectronic circuit comprises a plurality of dielectric layers and patterned electrodes which are laminated one upon another to form a laminated structure, the dielectric layers and the patterned electrodes forming an electrical circuit. The laminated structure has side surfaces extending along a direction in which the dielectric layers and the patterned electrodes are laminated. An input line is formed at one of the side surfaces and connected with an input section of the electrical circuit. An output line is formed at one of the side surfaces and connected with an output section of the electrical circuit. A grounding line is formed at one of the side surfaces and connected with a grounding section of the electrical circuit. Additionally, a signal line formed at one of the side surfaces, for connecting sections of the electrical circuit. The signal line has an end positioned adjacent a mounting surface at which the multilayer microelectronic circuit is directly mounted on the substrate, in which the end of the signal line is separate from the mounting surface so as to be insulated from electrical contact with the substrate.

Multilayer microelectronic circuit

The multilayer microelectronic circuit comprises a main capacitor dielectric layer, a main capacitor first electrode disposed on one of opposite sides of the main capacitor dielectric layer, a main capacitor second electrode disposed on the other of the opposite sides of the main capacitor dielectric layer in a way as to oppose the main capacitor first electrode through the main capacitor dielectric layer, a first trimming capacitor dielectric layer disposed on a side of the main capacitor first electrode opposite to the main capacitor dielectric layer, a first trimming capacitor electrode disposed on a side of the first trimming capacitor dielectric layer opposite to the main capacitor first electrode in a way as to oppose the main capacitor first electrode through the first trimming capacitor dielectric layer, a second trimming capacitor dielectric layer disposed on a side of the first trimming capacitor electrode opposite to the first trimming capacitor dielectric layer, and a second trimming capacitor electrode disposed on a side of the second trimming capacitor dielectric layer opposite to the first trimming capacitor electrode in a way as to oppose the first trimming capacitor electrode through the second trimming capacitor dielectric layer. The first trimming capacitor electrode is first trimmed for rough adjustment of a capacitance of the circuit. The second trimming capacitor electrode is then trimmed for fine adjustment of the capacitance.

Multilayer microelectronic circuit with trimmable capacitors

A multilayer LC filter includes a terminal layer, and a plurality of capacitor electrode layers laminated together on the terminal layer. An inductor layer is disposed above the capacitor electrode layers to thereby form a laminated body. First and second strip-shaped side-surface electrodes are formed on opposite side surfaces of the laminated body, and are connected to input and output terminals of the terminal layer, respectively. The distal ends of the first and second strip-shaped side-surface electrodes extend to the corresponding side surfaces of the capacitor electrode layers, but do not reach the side surfaces of the inductor layer. Thus, the distances between the resonator inductors of the inductor layer and the strip-shaped side-surface electrodes are increased, and as a result, very little stray capacitance is generated between the resonator inductors and the side-surface electrodes.

Multilayer LC filter

A multilayer LC filter includes two LC resonance circuits ( 21 and 22 ) in a two-stage circuit configuration First and second resonator inductors (L 21 and L 22 ) formed by two strip-like electrical paths ( 14 and 15 ) extend laterally in parallel and are patterned on the same inductor layer (c) A strip-shaped shielding or ground path ( 35 ) is formed between, and in parallel with, the two strip-shaped electrical paths ( 14 and 15 ) such that the electrical paths are in the shape of a fork on the inductor layer c The magnetic coupling between the resonator inductors (L 21 and L 22 ) is thus weakened and, even when pattern dislocations occur during the patterning of the paths, there is substantially no variation in the magnetic coupling characteristics of multilayer LC filters of this construction

Multilayer LC filter with improved magnetic coupling characteristics

A monolithic LC filter which provides increased magnetic field coupling as compared with a conventional monolithic LC filter, without an increase in component size of the filter. The monolithic LC filter includes first and second resonator inductors coupled together by magnetic field coupling. The inductors include parallel-extending straight coupling sections formed by conductive lines which extend in parallel generally along a diagonal of a supporting dielectric layer. This configuration enables the lengths of the coupling sections to be increased as compared with the lengths of the corresponding coupling sections of a conventional monolithic LC filter.

Tadashi Shingaki

Papers

Multilayer microelectronic circuit

Multilayer microelectronic circuit with trimmable capacitors

Multilayer LC filter

Multilayer LC filter with improved magnetic coupling characteristics

Monolithic LC filter with enhanced magnetic coupling between resonator inductors