An LED component comprising an array of LED chips mounted on a planar surface of a submount with the LED chips capable of emitting light in response to an electrical signal. The LED chips comprise respective groups emitting at different colors of light, with each of the groups interconnected in a series circuit. A lens is included over the LED chips. Other embodiments can comprise thermal spreading structures included integral to the submount and arranged to dissipate heat from the LED chips.

Solid state lighting component

The present disclosure relates to a semiconductor light emitting device, comprising: a plurality of semiconductor layers, including a first semiconductor layer having a first conductivity, a second semiconductor layer having a second conductivity different from the first conductivity, and an active layer interposed between the first semiconductor layer and the second semiconductor layer, generating light via electron-hole recombination; a first electrode, supplying either electrons or holes to the plurality of semiconductor layers; a second electrode, supplying, to the plurality of semiconductor layers, electrons if the holes are supplied by the first electrode, or holes if the electrons are supplied by the first electrode; a non-conductive distributed bragg reflector coupled to the plurality of semiconductor layers, reflecting the light from the active layer; and a first light-transmitting film coupled to the distributed bragg reflector from a side opposite to the plurality of semiconductor layers with respect to the non-conductive distributed bragg reflector, with the first light-transmitting film having a refractive index lower than an effective refractive index of the distributed bragg reflector.

Semiconductor Light Emitting Device

An illumination light source includes: a light-emitting unit; a disturbance detecting unit which detects a specific disturbance; a timer circuit that times a first period and a second period, the first period starting from when the disturbance detecting unit detects the specific disturbance, a second period immediately following after the first period; and a driving circuit that turns ON the light-emitting unit at a start of the first period, causes the light-emitting unit to emit light during the first period, causes the light-emitting unit to emit light that is different from the light emitted during the second period, and turns OFF the light-emitting unit at an end of the second period.

Illumination light source

By doping an organic compound functioning as an electron donor (hereinafter referred to as donor molecules) into an organic compound layer contacting a cathode, donor levels can be formed between respective LUMO (lowest unoccupied molecular orbital) levels between the cathode and the organic compound layer, and therefore electrons can be injected from the cathode, and transmission of the injected electrons can be performed with good efficiency. Further, there are no problems such as excessive energy loss, deterioration of the organic compound layer itself, and the like accompanying electron movement, and therefore an increase in the electron injecting characteristics and a decrease in the driver voltage can both be achieved without depending on the work function of the cathode material.

Light Emitting Device

To provide a light-emitting diode (21), transparent resin (27) is filled in a hole (25) through a fiberglass-reinforced epoxy substrate (22) between the upper surface (26a) and the lower surface (26b). A light-emitting diode element (29) formed of semiconducting nitride gallium on a transparent sapphire glass substrate (30) is fixedly attached to the transparent resin (27) with transparent adhesive (37). Opaque electrodes (33, 34) are provided on the light-emitting diode element (29) so that the light from the light-emitting diode element (29) can pass through the transparent resin (27) to the lower surface (26b) of the fiberglass-reinforced epoxy substrate (22). When mounted on a motherboard (41), the light-emitting diode (21) is let fall, with its resin mold (38) down, into a hole (42) opened in the motherboard (41), thereby reducing the height above the motherboard.

Light-emitting diode

To provide a bulb-type lamp that can achieve improvement in the heat dissipation properties and size/weight reduction simultaneously, and that can lighten thermal load on a lighting circuit. [Solution] A bulb-type lamp 1 is composed of: an LED module 3 including LEDs; a cylindrically-shaped case 7, to one end of which a base member 15 is attached and which allows dissipation of heat therefrom, the heat being generated by the LEDs emitting light; a mount member 5, on which the LED module 3 is mounted, which closes the other end of the case 7, and allows conduction of the heat to the case 7; a lighting circuit 11 that, upon receiving power via the base member 15, causes the LEDs to emit light; and a circuit holder 13 positioned inside the case 7, with the lighting circuit 11 disposed inside the circuit holder 13. The air space exists between the circuit holder 13 and the case7, and between the circuit holder 13 and the mount member 5. Hence, the lighting circuit 11 is isolated from the air space due to the presence of the circuit holder 13. In the bulb-type lamp 1, a fraction S1/S2 satisfies a relationship 0.5!<=S1/S2, where S1 denotes an area of a portion of the mount member 5 that is in contact with the case 7, and S2 denotes an area of a portion of the mount member 5 that is in contact with a substrate 17 of the LED module 3.

Bulb-shaped lamp and lighting device

A light bulb shaped lamp according to the present invention includes: a hollow globe; an LED module including a base platform and an LED chip mounted on the base platform, the LED module being provided in the globe; a lead wire for supplying power to the LED module; and a stem extending toward the interior of the globe, in which the base platform is directly fixed to the stem.

Light bulb shaped lamp and lighting apparatus

A mount member (5) has a contact surface (27 a) touching the bottom surface of an LED module (3) and protrusions (5 a) protruding from the periphery of the contact surface (27 a) in the thickness direction of the LED module (3) and regulating sliding motions thereof. A fixing member (6) made of a resilient, plate-like member comprises an opposing pair of flat portions (43) near the contact surface (27 a) of the mount member (5) and flat tabs (44) projecting from the flat portions (43) toward the contact surface (27 a) touching the upper surface of a substrate (17). The flat portions (43) of the fixing member (6) are fastened to be lower than the top surface of the substrate (17) of the LED module (3). Thus, elastically deformed areas extending from the fastened parts of the flat portions (43) through the flat tabs (44) press the substrate (17) into the mount member (5).

Illumination device including a light-emitting module fastened to mount member with a constant orientation

Provided is a light source that has high reliability and hardly causes conductivity failure between a light emitting device and a conductive land. In an LED light source of the present invention, an LED bare chip is mounted to conductive lands of a substrate, using bumps (55a, 55b). The LED bare chip (D65) is provided with a p-electrode (Lp) and an n-electrode (Ln) on a rear surface. The p-electrode (Lp) is larger in area than the n-electrode (Ln). The p-electrode (Lp) is bonded to a corresponding conductive land via four bumps (55a), whereas the n-electrode (Ln) is bonded to a corresponding conductive land via one bump (55b). A bonded area (Sn) between the n-electrode (Ln) and the bump (55b) is larger than a bonded area (Sp) between the p-electrode (Lp) and one of the bumps (55a).

Light source, manufacturing method of light source, lighting apparatus, and display apparatus

A light-emitting device (130) includes: a light-transmissive substrate (140); a semiconductor light-emitting element (150) arranged on the substrate (140); a sealing member (160) that seals the semiconductor light-emitting element (150) and contains a first waveform-converting material (161) that converts the wavelength of the light emitted from the semiconductor light-emitting element (150) into a predetermined wavelength; and a groove (145) that is provided to the side of the semiconductor light-emitting element (150), is formed in the shape of a recess from the arrangement surface of the substrate (140) on which the semiconductor light-emitting element (150) is arranged or from the back surface of the substrate, which is the surface on the opposite side from the arrangement surface, and contains a second waveform-converting material (162) that converts the wavelength of the light emitted from the semiconductor light-emitting element (150) into a predetermined wavelength.

Takaari Uemoto

Papers

Bulb-shaped lamp and lighting device

Light bulb shaped lamp and lighting apparatus

Illumination device including a light-emitting module fastened to mount member with a constant orientation

Light source, manufacturing method of light source, lighting apparatus, and display apparatus

Light-emitting device and lamp