Takahashi Atsushi

TL;DR: In this paper, an adhesive film is obtained which has the transparency and electromagnetic wave shielding effect with the difference in index of refraction less than or equal to 0.14 between the adhesive covering a geometric graph and clear plastic base material.

TL;DR: In this paper, a multilayered wiring board is prepared by using the metallic foil or a bonding sheet, which is obtained by forming an adhesive, containing 100 pts.vol.C glass transition temperature (Tg ) at the time of curing and its curing agent, 20-100 pts.c. curing accelerator, 0.1-10 pts.C coupling agent and an inorganic filler having 5-9m /g BET surface area in a volume of 15-100

TL;DR: In this article, an insulating adhesive film with copper foil is formed, the insulating film with the perforated copper foil for electrical connection and a perforation reinforcing material are superposed on an internal-layer circuit board, and flowed by pressure heating and a cushioning material flowed into the holes of the insulators adhesive film is stacked, and laminated and unified.

TL;DR: An insulating varnish comprising a resin component, electrical insulating whiskers and if necessary, one or more additives such as an ion adsorbent, and/or an organic reagent for preventing injury from copper, produced by adding the additives to the resin component and the whiskers, or filtering the whisker, or milled by using a beads mill or a three-roll mill, or the like, is excellent for producing a multilayer printed circuit board having high wiring density, high reliability and excellent other electrical properties as discussed by the authors.

TL;DR: In this paper, an epoxy resin is obtained by reaction between a compound containing glycidyl groups at both terminals, and an ether group-containing diol compound or a bisphenol compound.