T
Takahiro Nomura
Researcher at Hokkaido University
Publications - 96
Citations - 2444
Takahiro Nomura is an academic researcher from Hokkaido University. The author has contributed to research in topics: Phase-change material & Thermal energy storage. The author has an hindex of 20, co-authored 78 publications receiving 1659 citations.
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Impregnation of porous material with phase change material for thermal energy storage
TL;DR: In this article, the impregnation of a porous material with a phase change material (PCM) was studied, where erythritol was selected as the PCM and expanded perlite (EP), diatom earth (DE), and gamma-alumina (GA) were selected as porous materials.
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Microencapsulation of metal-based phase change material for high-temperature thermal energy storage.
TL;DR: The Al-Si alloy microsphere MEPCM developed in this study has great promise in future energy and chemical processes, such as exergy recuperation and process intensification.
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Macro-encapsulation of metallic phase change material using cylindrical-type ceramic containers for high-temperature thermal energy storage
TL;DR: In this paper, the use of ceramic containers comprising a cap and a cup for macro-encapsulation of metallic PCMs, and a sealing method of the containers to endure the thermal stress from volume expansion during the phase change was proposed.
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Microencapsulated phase change materials with high heat capacity and high cyclic durability for high-temperature thermal energy storage and transportation
Takahiro Nomura,Nan Sheng,Chunyu Zhu,Genki Saito,Daiki Hanzaki,Takehito Hiraki,Tomohiro Akiyama +6 more
TL;DR: In this article, a core-shell type microencapsulated phase change material (MEPCM) consisting of Al-25-wt% Si microspheres (mean diameter of 36.3μm and melting temperature of 577°C) and Al2O3 as the shell is presented.
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High thermal conductivity phase change composite with percolating carbon fiber network
TL;DR: In this article, a phase change composite (PCC) with a percolating network of a high thermal conductivity filler was developed, where Erythritol (melting point: 118°C) was used as the PCM and carbon fiber (thermal conductivity: 900 −W −m−m−1−K−1 in the fiber direction).