A plastic-molded-type semiconductor device includes a plurality of semiconductor chips, metallic wires connected to the semiconductor chips, leads connected to the metallic wires, and an insulating member interposed between the semiconductor chips and sealed in a resin member. Circuit formed surfaces of the semiconductor chips are directed in the same direction, and one or more of the semiconductor chips serve as a base on which the other semiconductor chips are mounted through the insulating member. One ends of the leads are bonded to the insulating member, and electrodes pad of each semiconductor chip are not covered by the other semiconductor chips, the insulating member and the leads, and therefore are exposed to the surface of the insulating member. In this device, the provision of a tab is omitted, and the laminated chips can be contained in a package thinner than a conventional package. Since the circuit formation surfaces of all of the chips are directed in the same direction, all of the electrical connections can be made by wire bonding from one direction.

Plastic-molded-type semiconductor device

An integrated circuit device package in which integrated circuit devices are mounted with active faces placed facing each other to form a double-device structure. Input/output terminals on the active faces of each device can be electrically interconnected by placing an interconnection means between the chips to electrically interconnect input/output terminals on the active faces of the first and second device. Beam leads, each having an inner and outer lead bond site, project outwardly from between the devices where each of the inner lead bond site is solderlessly bonded between conducting patterns on each device bonded. A series of double-device structures can be formed on a tape having a plurality of sets of beam lead patterns thereon. Each beam lead of each set having an inner and outer lead bond site, projects outwardly from between the double-device structure, the inner lead bond site being solderlessly bonded between conducting patterns on each device.

Double electronic device structure having beam leads solderlessly bonded between contact locations on each device and projecting outwardly from therebetween

A semiconductor device in a plastic or ceramic package contains at least one silicon die on each side of a central die pad of a single metal frame, thus allowing a substantial space saving on the printed circuit assembly card. The bonding of the silicon dies and the soldering of the connecting wires are performed on both sides of the frame by emplying a special slotted clamp fixture inside which a strip of frames is clamped during these assembly operations and relative quality control operations.

Semiconductor device package with dies mounted on both sides of the central pad of a metal frame

Semiconductor devices are each arranged such that a semiconductor chip is disposed on a film carrier, fingers of the film carrier are respectively connected to a multiplicity of electrodes provided on the semiconductor chip, and the fingers are then trimmed, or the fingers are trimmed after the semiconductor chip and parts of the fingers are sealed with a resin or the like. The semiconductor devices thus arranged are respectively mounted on both obverse and reverse surfaces of a substrate at mutually opposing positions thereof, the substrate having electrically conductive patterns formed on both surfaces thereof. The semiconductor devices are sealed with a resin or the like so as to be formed integrally with the substrate.

Structure, method of, and apparatus for mounting semiconductor devices

An integrated circuit package assembly (22) includes a semiconductor chip (10) mounted on a die pad (12), having wire leads (18) attached to bond pads (20) on the chip and lead fingers (16) connected to the wire leads and external connections. A flexible and compressible tape (24) is attached to the bottom of the die pad and extends to the lead fingers to reduce stress and to minimize cracking of the package material that encloses the chip and the wire leads during vapor phase. An optional soft gel (28) is added to coat the chip surface including the bonds to further reduce chip surface stress.

Integrated circuit package assembly

PURPOSE: To increase the mounting density, by lapping a plurality of lead frames connecting electronic circuit elements via electric insulators, molding it with resin, and using the projected lead chips as external terminals with cutting off. CONSTITUTION: The conduction plate is punched out to obtain the lead frames 12, 13, and the semiconductor ship 8 is die-bonded to the element setting lead chip 6 of one frame 12, and the chip 9 is made with the lead chip 7 of another frame 13, respectively by using conductive resin. Next, the chip 8 and the wire connection lead chip 14 of the frame 12, and the chip 9 and the lead chip 15 are bonded respectively by using the wire 10. After that, the frames 12 and 13 are lapped via the electric insulator 5, they are contained in the metal mold to inject the epoxy resin by remaining the tip of the lead pieces 6, 7, 14 and 15, and low pressure molding is made. Thus, the chips 8 and 9 are unifiedly composed and the resin mold 1 can be obtined. COPYRIGHT: (C)1979,JPO&Japio

Takeshi Fujiwara

Papers

Electronic circuit device