T
Tamami Takahashi
Researcher at Ebara Corporation
Publications - 7
Citations - 682
Tamami Takahashi is an academic researcher from Ebara Corporation. The author has contributed to research in topics: Polishing & Bevel. The author has an hindex of 4, co-authored 7 publications receiving 682 citations.
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Patent
Substrate Processing Apparatus
TL;DR: In this article, a bypass pipe is connected between the mechanical booster pump and the rest vacuum pumps located at a downstream side of the booster pump to prevent the exhaust gas from diffusing back to the inside of a process chamber.
Patent
Device for and method of polishing peripheral edge of semiconductor wafer
Tamami Takahashi,Kenya Ito,Mitsuhiko Shirakashi,Kazuyuki Inoue,Yamaguchi Kenji,Masaya Seki,Satoru Sato,Jun Watanabe,Kenji Kato,Jun Tamura,Souichi Asakawa +10 more
TL;DR: In this article, a device for polishing the peripheral edge part of a semiconductor wafer includes a wafer stage for holding the wafer, a Wafer stage unit including devices for rotating the Wafer and a bevel polishing part.
Patent
Substrate holder and substrate holding method
TL;DR: A substrate holder is a mechanism for holding a substrate, to be polished, by vacuum suction as mentioned in this paper, which includes a substrate-holding stage having a suction surface for the substrate, and a fluid passage selectively coupled to a vacuum source and fluid supply source.
Patent
Polishing apparatus, polishing method, and processing apparatus
TL;DR: In this article, the outside diameters of polishing tape on a polishing-tape supply reel and a recovery reel are calculated from the outside diameter of the rolls of the polishing tool.
Patent
Device for polishing peripheral edge of semiconductor wafer
Tamami Takahashi,Kenya Ito,Mitsuhiko Shirakashi,Kazuyuki Inoue,Yamaguchi Kenji,Masaya Seki,Satoru Sato,Jun Watanabe,Kenji Kato,Jun Tamura,Souichi Asakawa +10 more
TL;DR: In this article, a device for polishing the peripheral edge part of a semiconductor wafer includes a wafer stage for holding the wafer, a Wafer stage unit including devices for rotating the Wafer and a bevel polishing part.