This paper presents an exercise in comparing the performance of microelectromechanical systems (MEMS) actuators and sensors as a function of operating principle. Data have been obtained from the literature for the mechanical performance characteristics of actuators, force sensors and displacement sensors. On-chip and off-chip actuators and sensors are each sub-grouped into families, classes and members according to their principle of operation. The performance of MEMS sharing common operating principles is compared with each other and with equivalent macroscopic devices. The data are used to construct performance maps showing the capability of existing actuators and sensors in terms of maximum force and displacement capability, resolution and frequency. These can also be used as a preliminary design tool, as shown in a case study on the design of an on-chip tensile test machine for materials in thin-film form.

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MEMS actuators and sensors: observations on their performance and selection for purpose

▪ Abstract Polysilicon surface micromachining is advancing significantly and many new applications are moving beyond the prototyping phase. Recent technical successes are leading to excitement concerning various uses of devices in optical, wireless, sensor, and many other areas. Incorporation of state-of-the-art integrated circuit (IC) fabrication methods, such as planarization by chemical mechanical polishing (CMP), has enabled extension to a five-level technology. This has opened significant design space, especially for microactuator applications. Recent advancement of in situ microdiagnostics for materials and surface properties has enhanced our understanding of device reliability and performance and will allow devices to operate near well-known materials limits. New IC-compatible materials will further enhance the capabilities of microsystems in terms of performance, reliability, and operation in harsh environments.

IC-Compatible Polysilicon Surface Micromachining

In the past few years, 3D printing technology has witnessed an explosive growth, penetrating various aspects of our lives. Current best-in-class 3D printers can fabricate micrometer scale objects, which has made fabrication of microfluidic devices possible. The highest achievable resolution is already at nanometer scale, which is continuing to drop. Since geometric complexity is not a concern for 3D printing, novel 3D microfluidics and lab-on-a-chip systems that are otherwise impossible to produce with traditional 2D microfabrication technology have started to emerge in recent years. In this review, we first introduce the basics of 3D printing technology for the microfluidic community and then summarize its emerging applications in creating novel microfluidic devices. We foresee widespread utilization of 3D printing for future developments in microfluidic engineering and lab-on-a-chip technology.

3D printing: an emerging tool for novel microfluidics and lab-on-a-chip applications

Electrostatic, comb-drive actuators have been designed for applications requiring displacements of up to 150 /spl mu/m in less than 1 ms. A nonlinear model of the actuator relates the resonant frequency and the maximum stable deflection to the actuator dimensions. A suite of experiments that were carried out on deep reactive ion etched (DRIE), single-crystal silicon, comb-drive actuators confirm the validity of the model. Four actuator design improvements were implemented. First, a folded-flexure suspension consisting of two folded beams rather than four and a U-shaped shuttle allowed the actuator area to be cut in half without degrading its performance. Second, the comb teeth were designed with linearly increasing lengths to reduce side instability by a factor of two. Third, the folded-flexure suspensions were fabricated in an initially bent configuration, improving the suspension stiffness ratio and reducing side instability by an additional factor of 30. Finally, additional actuation range was achieved using a launch and capture actuation scheme in which the actuator was allowed to swing backward after full forward deflection; the shuttle was captured and held using the backs of the comb banks as high-force, parallel-plate actuators.

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Design of large deflection electrostatic actuators

A heat exchanger and method of manufacturing thereof comprises an interface layer for cooling a heat source. The interface layer is coupled to the heat source and is configured to pass fluid therethrough. The heat exchanger further comprises a manifold layer that is coupled to the interface layer. The manifold layer includes at least one first port that is coupled to a first set of individualized holes which channel fluid through the first set. The manifold layer includes at least one second port coupled to a second set of individualized holes which channel fluid through the second set. The first set of holes and second set of holes are arranged to provide a minimized fluid path distance between the first and second ports to adequately cool the heat source. Preferably, each hole in the first set is positioned a closest optimal distance to an adjacent hole the second set.

Method and apparatus for efficient vertical fluid delivery for cooling a heat producing device

Microfluidic devices are disclosed which can be manufactured using surface-micromachining. These devices utilize an electroosmotic force or an electromagnetic field to generate a flow of a fluid in a microchannel that is lined, at least in part, with silicon nitride. Additional electrodes can be provided within or about the microchannel for separating particular constituents in the fluid during the flow based on charge state or magnetic moment. The fluid can also be pressurized in the channel. The present invention has many different applications including electrokinetic pumping, chemical and biochemical analysis (e.g. based on electrophoresis or chromatography), conducting chemical reactions on a microscopic scale, and forming hydraulic actuators.

Surface-micromachined microfluidic devices

Although many actuators employing electrostatic comb drives have been demonstrated in a laboratory environment, widespread acceptance in mass produced microelectromechanical systems (MEMS) may be limited due to issues associated with low drive force, large real estate demands, high operating voltages, and reliability concerns due to stiction. On the other hand, comb drives require very low drive currents, offer predictable response, and are highly compatible with the fabrication technology. The expand the application space and facilitate the widespread deployment of self-actuated MEMS, a new class of advanced actuation systems has been developed that maintains the highly desirable aspects of existing components, while significantly diminishing the issues that could impede large scale acceptance. In this paper, the authors will present low-voltage electrostatic actuators that offer a dramatic increase in force over conventional comb drive designs. In addition, these actuators consume only a small fraction of the chip area previously used, yielding significant gains in power density. To increase the stroke length of these novel electrostatic actuators, the authors have developed highly efficient compliant stroke amplifiers. The coupling of compact, high-force actuators with fully compliant displacement multipliers sets a new paradigm for highly integrated microelectromechanical systems.

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A New Class of High Force, Low-Voltage, Compliant Actuation System

A surface-micromachined rotatable member formed on a substrate and a method for manufacturing thereof are disclosed. The surface-micromachined rotatable member, which can be a gear or a rotary stage, has a central hub, and an annulus connected to the central hub by an overarching bridge. The hub includes a stationary axle support attached to the substrate and surrounding an axle. The axle is retained within the axle support with an air-gap spacing therebetween of generally 0.3 μm or less. The rotatable member can be formed by alternately depositing and patterning layers of a semiconductor (e.g. polysilicon or a silicon-germanium alloy) and a sacrificial material and then removing the sacrificial material, at least in part. The present invention has applications for forming micromechanical or microelectromechanical devices requiring lower actuation forces, and providing improved reliability.

Surface—micromachined rotatable member having a low-contact-area hub

A process is disclosed for forming a microelectromechanical (MEM) structure on a substrate having from 5 to 6 or more layers of deposited and patterned polysilicon. The process is based on determining a radius of curvature of the substrate which is bowed due to accumulated stress in the layers of polysilicon and a sacrificial material used to buildup the MEM structure, and then providing one or more stress-compensation layers on a backside of the substrate to flatten the substrate and allow further processing.

Process for fabricating a microelectromechanical structure

The design, fabrication and characterization of a low-voltage rotary stepper motor are presented in this work. Using a five-level polysilicon MEMS technology, steps were taken to increase the capacitance over previous stepper motor designs to generate high torque at low voltages. A low-friction hub was developed to minimize frictional loads due to rubbing surfaces, producing an estimated resistive torque of about 6 pN-m. This design also allowed investigations into the potential benefit of using hard materials such as silicon nitride for lining of both the stationary and rotating hub components. The result is an electrostatic stepper motor capable of operation at less than six volts.

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Thomas W. Krygowski

Papers

Surface-micromachined microfluidic devices

A New Class of High Force, Low-Voltage, Compliant Actuation System

Surface—micromachined rotatable member having a low-contact-area hub

Process for fabricating a microelectromechanical structure

A low-voltage rotary actuator fabricated using a five-level polysilicon surface micromachining technology