Showing papers by "Tomiya Sasaki published in 1997"

Substrate cooling equipment

Abstract: PROBLEM TO BE SOLVED: To make it possible to cool a high-density mounting type circuit board uniformly and efficiently by providing nozzle pipes having jet nozzles and supply pipes supplying a cooling material to the nozzle pipes between a plurality of substrates mounting integrated circuits. SOLUTION: Substrates 27 inside a substrate storing portion 16 are arranged radially at predetermined intervals mutually normal to an upper lid of a case 14 so as to surround a microscope cylinder 13. A supply pipe 19 for supplying a cooling material is located on a peripheral surface inside the substrate storing portion 16. A cooling medium supply pipe 36 for supplying a cooling material from the outside of tone substrate storing portion 16 to the supply pipe 19 is connected to the supply pipe 19. A nozzle pipe 22 is connected to the supply pipe 19, and the nozzle pipe 22 is arranged without contact to an IC28. The nozzle pipe 22 has holes 23 (jet holes) for jetting the cooling material on the surface facing the substrate 27, at least one is provided for each IC28 on the substrate 27.