PURPOSE:To obtain a single layer type photosensitive body superior in positive chargeability, high in sensitivity and small in residual potential by forming a photosensitive layer composed of a specified perylene derivative, a diamine derivative, and a binder resin. CONSTITUTION:The single layer type photosensitive layer comprises as an electric charge generating material, the perylene derivative represented by formula I, each of R -R being lower alkyl, as a charge transfer material, the diamine derivative represented by formula II, each of R -R being H, lower alkyl, or the like; Y being H, lower alkoxy, or the like; and n being an integer of 1-3, and the binder resin, thus permitting the obtained single layer type photosensitive body to be superior in positive chargeability, high in sensitivity, and small in residual potential.

Electrophotographic sensitive body

An object of the present invention is to provide a pressure-sensitive adhesive composition which is excellent in antistatic property of a non-electrification-prevented adherend (subject to be protected) upon peeling, and has reduced stainability in an adherend and is excellent in adhesion reliance, and electrification preventing pressure-sensitive adhesive sheets using the same. There is provided a pressure-sensitive composition comprising an ionic liquid, and a (meth)acryl-based polymer containing, as a monomer component, 0.1 to 100% by weight of a (meth)acrylic acid alkylene oxide. In addition, there is provided a pressure-sensitive composition comprising an ionic liquid, and a polymer containing, as a monomer component, 0.5 to 30 % by weight of a nitrogen-containing monomer and having a glass transition temperature Tg of no higher than 0°C. Furthermore, there is provided a pressure-sensitive composition comprising an ionic liquid, and a (meth)acryl-based polymer containing, as a monomer component, 0.01 to 20% by weight of a reactive surfactant.

Pressure-sensitive adhesive composition, pressure-sensitive adhesive sheets and surface protecting film

The driving forces behind the development of flexible electronics are their flexibility, lightweightedness, and potential for low-cost manufacturing. However, because of physical locations, traditional thermal processes cause deformations in the flexible substrate. As a result, the adhesion quality of the printed wires is deteriorated. This article reviews recent developments in printing circuits on a flexible substrate by combining self-assembled polyelectrolytes, ink-jet printing of a catalyst, and electroless plating of metals. The limitations and potential applications of this technology are also discussed. Experiments implementing this technology demonstrated significant results. By a vibration-induced assistance during an ink-jet printing catalyst process, line width and blurring can be controlled to within ′3% variation. Following the IPC 6013 standard for flexible electronics, the results after thermal cycling (288 °C, 6 times) and a hot oil test (260 °C, 3 times) indicated that the metallic circuit had retained excellent adhesion properties and electric characteristics. We also report the first successful demonstration of a metal film in a via-hole inner wall on a flexible substrate. This novel fabrication method is ideal for the realization of large area, flexible electronics and furore multilayer flexible substrate Application, such as flexible display, chip on flexible substrate, etc. particularly where traditional lithographic processes can not be applied.

Ink-Jet Printing, Self-Assembled Polyelectrolytes, and Electroless Plating: Low Cost Fabrication of Circuits on a Flexible Substrate at Room Temperature

Disclosed is a pressure sensitive adhesive composition characterized by containing an ionic liquid and a polymer which contains, as a monomer unit, 0.1-10% by weight of a (meth)acrylate with a hydroxyalkyl group having 3-12 carbon atoms. The present invention provides a pressure sensitive adhesive composition which is excellent in antistatic property of a no-electrification-prevented adherend upon peeling, and has reduced staining of an adherend and is excellent in adhesion reliance. Also disclosed is an antistatic pressure sensitive adhesive sheet or surface-protecting film prepared using the composition. Also disclosed is an antistatic pressure sensitive adhesive sheet or surface-protecting film prepared using the composition.

Adhesive composition, adhesive sheet and surface protective film

A photosensitive resin composition comprising (A) a binder polymer having carboxyl groups, (B) a photopolymerizable compound having at least one polymerizable ethylenically unsaturated group in the molecule, and (C) a photoinitiator can provide a film excellent in mechanical strength, chemical resistance, flexibility, and suitable for producing a photosensitive element.

Photosensitive resin composition and photosensitive element using the same

A process for producing a printed circuit board, which comprises the steps of forming a layer comprising a photosensitive resin composition on an insulating substrate having on its surface an adhesive layer adherent to a metal being subsequently plated thereon; exposing said layer comprising a photosensitive resin composition to an actinic radiation in a manner so as to form on said layer a negative pattern of a conductor circuit pattern and to semicure said negative pattern to an extent sufficient to keep it from erosion by a plating solution; developing by dissolving away with a solvent the uncured areas not exposed to said actinic radiation, thereby to form a plating resist on the areas of said negative pattern; chemically plating said conductor circuit pattern areas not covered with said plating resist, thereby to form a conductor circuit; and carrying out a curing treatment to cure completely said resist. According to this invention, it is possible to provide a printed circuit board of higher reliability compared with conventional processes.

Process for producing printed circuit board

A process for producing adhesive film comprising coating on a filmlike substrate a composition comprising (i) a copolymer having a glass transition temperature of -30° C. or lower and obtained from one or more monomers (a) such as alkyl acrylates or methacrylates, or the like, and another monomers (b) containing at least one carboxyl, alcoholic hydroxyl, or glycidyl group, (ii) a crosslinking agent having at least two crosslinkable functional groups which can react with the monomers (b), (iii) one or more monofunctional addition polymerizable monomers having a boiling point of 200° C. or higher, (iv) one or more polyfunctional addition polymerizable monomers having a boiling point of 200° C. or higher, and (v) a photochemical initiator, and irradiating said composition with actinic light, is advantageous in that the amount of solvent to be removed after coating the composition on the substrate can be reduced remarkably without lowering properties of the resulting adhesive film.

Process for producing adhesive film

A photosensitive resin composition consisting essentially of (A) a photo-polymerizable unsaturated compound having at least two terminal ethylene groups, (B) a reactive linear high molecular weight compound having in its side chain one or two functional groups selected from the class consisting of tetrahydrofurfuryl group and N-alkoxymethylcarbamoyl group, (C) a sensitizer capable of initiating polymerization of the above unsaturated compound upon irradiation with active rays, (D) a compound having at least two epoxy groups, and (E) a potential or latent curing agent for epoxy resins. The photosensitive resin composition can give a protective film excellent in solvent resistance, chemical resistance, heat resistance and mechanical strengths, and hence can be used in the production of printed circuit boards and the precision-processing of metals.

Photosensitive resin compositions

Two types of additive processes for fine circuit pattern manufacturing technology using electroless copper plating have been developed. The processes offer high dimensional accuracy. Technical aspects of the additive processes, materials for the fabrication of additive circuits, and the performance of these circuits are reported here. >

Fine line circuit manufacturing technology with electroless copper plating

PURPOSE:To form an image having improved heat resistance and a thick film by imagewise exposing a photosensitive layer of a photosensitive resin compsn. contg. a specified photosensitive adduct with active rays of light and by developing the exposed layer with an aq. alkali soln. CONSTITUTION:A photosensitive layer is formed on a base with a photosensitive resin compsn. contg. a photosensitive adduct of a polyimide precursor having repeating units represented by formula I (where R1 is a quatervalent aliphat. or alicyclic group and R2 is a bivalent arom., aliphat. or alicyclic group or an organosiloxane group) to an isocyanato compd. represented by formula II (where each of R3-R5 is H or methyl and R6 is a bivalent hydrocarbon compd. group), a photopolymn. initiator and an org. solvent or further contg. a polymerizable unsatd. compd. The photosensitive layer is imagewise exposed with active rays of light and developed with an aq. alkali soln. By this method, an image having superior heat resistance and a thick film can be formed. The resulting film has satisfactory electrical and mechanical properties and is used for a solid-state element, an integrated circuit or the like in the semiconductor industry.

Toshiaki Ishimaru

Papers

Process for producing printed circuit board

Process for producing adhesive film

Photosensitive resin compositions

Fine line circuit manufacturing technology with electroless copper plating

Image producing method