Tremmel Robert A

TL;DR: In this article, an aqueous bath for the electrodeposition of a bright iron-nickel alloy and a process utilizing the same, the bath comprising iron ions, nickel ions, an iron complexing agent containing at least two complexing groups independently selected from the group consisting of carboxy and hydroxy provided at least one group is a carboxys group, and a reaction product of a polyamine and an alkylating or sulfonating agent.

TL;DR: A COMPOSITE NICKEL-CONTAINING ELECTROPLATE is forMED on a base metal surface by ELECTrOPlating on the surface an ADHERENT NICKel or NICKels AllOY LAYER HAVING A THICKness of from about 0.15 to 1.5 MILS and an average SULFUR CONTent of less than 0.03% as discussed by the authors.

TL;DR: An improved aqueous acidic trivalent chromium electrolyte and process for increasing the tolerance of such electrolytes to the presence of deleterious contaminating metal ions which normally progressively increase during commercial operation of the electrolyte ultimately resulting in chromium electrodeposits which are commercially unsatisfactory due to streaks, clouds and hazes in the deposit as discussed by the authors.

TL;DR: An improved aqueous cyanide-free electrolyte and process for depositing ductile, fine-grained adherent copper deposits on conductive substrates was described in this paper.

TL;DR: In this paper, a composite nickel-containing electroplate is formed on a base metal surface by electroplating on the surface an adherent nickel or nickel alloy layer having a thickness of from about 0.15 to 1.5 mils and an average sulfur content of less than 0.03%.