scispace - formally typeset
U

Upasani Neeraj S

Researcher at Intel

Publications -  12
Citations -  25

Upasani Neeraj S is an academic researcher from Intel. The author has contributed to research in topics: Encryption & Firmware. The author has an hindex of 3, co-authored 12 publications receiving 25 citations. Previous affiliations of Upasani Neeraj S include McAfee.

Papers
More filters
Patent

Systems, apparatuses, and methods for platform security

TL;DR: In this paper, the authors describe a system comprising a manageability server to generate an encrypted sideband message having at least one command; a server including: a radio frequency identification (RFID) device, the RFID device to include storage to store at least 1 encrypted message with at least 2 commands, and a security circuit coupled to the RFID device.
Patent

Hardware accelerator for platform firmware integrity check

TL;DR: In this paper, the authors described the encryption of a basic input/output system (BIOS) using a programmable logic device (PLD) in a static random access memory.
Patent

Remote provisioning and authenticated writes to secure storage devices

TL;DR: In this paper, a system for securing electronic devices includes a storage device including a SDF controller processor, at least one non-transitory machine readable storage medium in firmware of the storage device communicatively coupled to the SDF, and a monitor application comprising computer-executable instructions on the medium.
Patent

Techniques for processor boot-up

TL;DR: In this paper, a processor can be configured to access boot firmware from a remote location independent from use of a chipset, without the need to use a physical link with the remote device.
Patent

System, Apparatus And Method For Securely Protecting A Processor In Transit

TL;DR: In this paper, a processor includes: a first die including at least one processor core to execute instructions and a non-volatile storage to store an identifier to be provisioned into the processor during manufacture; a second die to couple to the first die, the second die including a wireless circuit and a second nonvatile storage; and a wireless interface to couple with the second chip to enable wireless communication with a wireless device.