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Urisu Tsuneo

Publications -  10
Citations -  10

Urisu Tsuneo is an academic researcher. The author has contributed to research in topics: Thin film & Etching (microfabrication). The author has an hindex of 2, co-authored 10 publications receiving 10 citations.

Papers
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Patent

Method and apparatus for forming fine periodic lattice

TL;DR: In this article, a pattern of a fine periodic lattice is formed by applying a voltage to a piezoelectric element 1 in the course of executing an exposure, and executing a multiple exposure by moving a moving stage 2 by a prescribed distance in the longitudinal direction of a lattice pattern having a disorder by using the piezelectric elements 1, and the disorder of the exposure pattern becomes a relaxed form.
Patent

Photo-reaction device

TL;DR: In this article, a thin film filter is placed between a light source and a substrate so that the thin film can be exchanged without breaking a vacuum in accordance with a selected wave-length region and can be passed through, and a vacuum degree on the side of light sources of the thin-film is equalized to that on the substrate.
Patent

Method of forming fine pattern and device therefor

TL;DR: In this paper, the X-ray mask is made in such a way that patterns made of a substance easy to absorb X-rays are formed on the surface of a pattern supporting film.
Patent

Contamination preventing mechanism of light source in photo-reaction apparatus

Kuraki Oku, +1 more
TL;DR: In this article, the authors proposed to prevent the contamination of a light source by reactive gas and the damage thereof by contamination by imparting predetermined conductance to the flow of gas in order to generate the predetermined difference in a vacuum degree between the light incident and emitting ends of a vacuum propagation part.
Patent

Method and apparatus for detecting ending point of dry etching

TL;DR: In this paper, an optical beam having a wavelength coincident with that to be absorbed of reactively generated species or its secondarily generated species radiated from a semiconductor substrate 3 to be etched is introduced into an etching vessel 1.