In this letter, an ultra-wideband common mode filter is proposed for high-speed differential signal transmission. By etching a slot in the inner patch of a double slit complementary split ring resonator (S-DBCSRR), the noise rejection bandwidth can be expanded. The equivalent circuit model and surface current distribution are given to explain the working principle of the filter. From the simulated and measured results, it is found that the fractional bandwidth of the presented filter is 92% with a noise suppression level of 20 dB, and the differential signal can propagate with little degradation.

An Ultra-Wideband Common-Mode Suppression Filter Based on S-DBCSRR for High-Speed Differential Signals

In this work, we report on the design of a wide-band digital lock-in amplifier (DLIA) of up to 65 MHz and its application for electrical impedance measurements in microfluidic devices. The DLIA is comprised of several dedicated technologies. First, it features a fully differential analog circuit, which includes a preamplifier with a low input noise of 4.4 nV/√Hz, a programmable-gain amplifier with a gain of 52 dB, and an anti-aliasing, fully differential low-pass filter with -76 dB stop-band attenuation. Second, the DLIA has an all-digital phase lock loop, which features a phase deviation of less than 0.02° throughout the frequency range. The phase lock loop utilizes an equally accurate period-frequency measurement, with a sub-ppm precision of frequency detection. Third, a modified clock link is implemented in the DLIA to improve the signal-to-noise ratio of the analog-to-digital converter affected by clock jitter of up to 20 dBc. A series of measurements were performed to characterize the DLIA, and the results showed an accurate performance. Additionally, impedance measurements of standard-size microparticles were performed by frequency sweep from 300 kHz to 30 MHz, using the DLIA in a microfluidic device. Different diameters of microparticle could be accurately distinguished according to the relative impedance at 2.5 MHz. The results confirm the promising applications of the DLIA in microfluidic electrical impedance measurements.

https://www.mdpi.com/1424-8220/19/16/3519/pdf

A Wide-Band Digital Lock-In Amplifier and Its Application in Microfluidic Impedance Measurement

The electromagnetic interference (EMI) caused by the noise resulting from a common mode of stacked I/O connectors is analyzed using both numerical simulation and experimental measurements. The use of stacked connectors exists on the PCBs of today’s information technology equipment in order to reduce size; however, size reductions will cause increased severe EMI. After diagnosis and analysis, a strategy is presented to suppress the EMI noise level, as well as its emissions, and is found to be very effective as shown by our experiments.

Experimental investigation and analysis of EMI in stacked I/O connectors of PCB

To reduce the noise created by a power delivery network, the number, the value of decoupling capacitors and their arrangement on the board are critical to reaching this goal. This work deals with specific improvements, implemented on a genetic algorithm, which used for the optimization of the decoupling capacitors in order to obtain the frequency spectrum of the input impedance in different positions on the network, below previously defined values. Measurements are performed on a specifically manufactured board in order to validate the effectiveness of the proposed algorithm and the optimization results obtained for a specific example board.

/pdf/efficient-iterative-process-based-on-an-improved-genetic-ayr4ntpvgu.pdf

Efficient Iterative Process Based on an Improved Genetic Algorithm for Decoupling Capacitor Placement at Board Level

Power efficiency and utilization are important factors for a cloud service provider. In this paper, we provide one quick design method both for a high-current density power distribution printed circuit board (PCB) design and for an improvement of a high end server system. This design method also takes into consideration both load balance and failures of a multipower supply server system, when the server system is supported by a redundancy power source. Our design is based on a system power source to sink the current path for both PCB copper shape dimension and thickness design, and to add some power or ground via for stitching either each power or ground plane on a multilayer PCB design to reduce direct current resistance. It also considers the airflow necessary for cooling the power distribution board to lower the temperature rise when high current is delivered with a resulting lower power loss and higher power efficiency and performance per watt.

Improvement of High-Current Density PCB Design With PSU Load Balance and Redundancy on a High End Server System

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Ursula Dresdner

Papers

Pcb Design For Real World Emi Control