The invention relates to a printed circuit board arrangement, more particularly a multilayer printed circuit board. The printed circuit board arrangement comprises at least two printed circuit boards which are arranged parallel to one another and connected to one another. According to the invention, in the case of the printed circuit board arrangement of the type mentioned initially, at least one surface region of one printed circuit board is connected to another printed circuit board of the printed circuit board arrangement by means of an element embodied in an elastic and/or damping fashion in such a way that an oscillatory system, more particularly a spring-mass system, an oscillatory bending strip or a flexurally oscillatory board is formed by means of the surface region of the printed circuit board and the element.

Printed circuit board arrangement comprising an oscillatory system

In various embodiments, a method for manufacturing a chip package is provided. The method includes arranging a chip over a substrate, the chip including a microphone structure and an opening to the microphone structure; and encapsulating the chip with encapsulation material such that the opening is kept at least partially free from the encapsulation material.

Chip package comprising a microphone structure and a method of manufacturing the same

A semiconductor device functioning properly by maintaining an electromagnetic shielding structure by a conductor layer is provided. A semiconductor device includes a wiring board having a surface, a semiconductor element, an insulating layer, and a conductor layer. The semiconductor element is arranged on the surface of the wiring board. The insulating layer is located on the surface of the wiring board and arranged to surround the semiconductor element. The conductor layer covers an outer peripheral surface of the insulating layer, and is connected to the wiring board. The outer peripheral surface of the insulating layer includes an upper surface located over the semiconductor element, and a side surface connecting the upper surface and the wiring board. The side surface includes a reverse tapered portion. The conductor layer is in contact with a surface of the reverse tapered portion.

Semiconductor device and method of manufacturing the same

A sensor unit with high reliability and stable detection accuracy against vibrations of an installation target object is to be provided. A sensor unit includes: a sensor module configured including a substrate with inertial sensors mounted thereon, and an inner case in which the substrate is installed; and an outer case accommodating the sensor module. A recessed part is formed in the inner case. The inertial sensors are arranged in an area overlapping with the recessed part as viewed in a plan view seen from the direction of thickness of the substrate, and a filling member is provided to fill a space formed by the substrate and the recessed part. The sensor module is joined to a bottom wall of the outer case via a joining member.

Sensor unit, electronic apparatus, and moving body

A printed circuit board (PCB) assembly having several electronic components mounted on a PCB and a damping layer covering the electronic components, is disclosed. Embodiments of the PCB assembly include an overmold layer constraining the damping layer against the PCB. Embodiments of the PCB assembly include an interposer between a capacitor of the electronic components and the PCB. Other embodiments are also described and claimed.

Printed circuit board assembly having a damping layer

The micromechanical sensor device has a substrate (1), a circuit chip fixed on the substrate and a mold package, in which the circuit chip is packaged. The mold package has a recess located above the circuit chip, in which a sensor chip is formed. The mold package has a through hole at the base of the recess, opened by a laser beam and extending to a metallization area (2). An electrical connection of the sensor chip is guided on the metallization area formed as contact area on the substrate or on the circuit chip. An independent claim is included for a method for manufacturing a micromechanical sensor device.

Micromechanical sensor device, particularly micromechanical pressure sensors, microphones, acceleration sensors or optical sensors, has substrate, circuit chip fixed on substrate and mold package, in which circuit chip is packaged

A sensor device, having a flexible printed circuit board that has a fastening section for a chip structure, a chip structure situated on the fastening section of the flexible printed-circuit board, and a damper element for damping the chip structure from mechanical influences. The fastening section of the flexible printed circuit board, the chip structure and the damper element are situated one on top of the other.

Sensor having damping

Today's packaging standard for consumer MEMS sensors are plastic mold packages of the LGA or QFN type. Multiple chips are placed on a substrate or leadframe, electrically connected by wire bonds and protected by overmolding the sensitive devices. While being a flexible and very effective packaging technology it contributes significantly to the overall sensor dimensions in x-, y- and z-direction. The main driving forces for further market penetration of consumer MEMS sensors are however further thickness and footprint reduction, while retaining performance and reliability at lowest cost. The obvious approach to achieve these required reductions are new packaging technologies that partly or completely remove the substrate, the wire bonds and the encapsulation mold material. This is why we consider wafer level packaging being the future of Consumer MEMS. It will be presented that wafer level MEMS packaging of existing products already realizes a massive reduction of the sensor dimensions while mastering the challenges of this new technology.

http://ieeexplore.ieee.org/iel7/7369474/7390670/07390708.pdf

Challenges of wafer-level MEMS packaging

Mit der vorliegenden Erfindung werden Masnahmen vorgeschlagen, die eine kostengunstige Verpackung von Sensorchips mit einem Medienzugang ermoglichen. Dazu wird der Sensorchip (1) zunachst auf einem Trager (7) montiert und kontaktiert. Dann wird der Sensorchip (1) zumindest teilweise in eine Moldmasse (3) eingebettet. Schlieslich wird zumindest ein Abschnitt des Medienzugangs durch nachtragliche Strukturierung der Moldmasse erzeugt.

Uwe Hansen

Papers

Printed circuit board arrangement comprising an oscillatory system

Micromechanical sensor device, particularly micromechanical pressure sensors, microphones, acceleration sensors or optical sensors, has substrate, circuit chip fixed on substrate and mold package, in which circuit chip is packaged

Sensor having damping

Challenges of wafer-level MEMS packaging

Verfahren zur Verpackung eines Sensorchips und dermaßen hergestelltes Bauteil