V
Vito Palazzo
Researcher at Alcatel-Lucent
Publications - 7
Citations - 136
Vito Palazzo is an academic researcher from Alcatel-Lucent. The author has contributed to research in topics: Signal & Acoustic emission. The author has an hindex of 6, co-authored 7 publications receiving 136 citations.
Papers
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Patent
Nondestructive real-time method for monitoring the quality of a weld
Min-Chung Jon,Vito Palazzo +1 more
TL;DR: In this paper, an acoustic sensor is positioned at a distance from the welding zone and picks up airborne acoustic emission signals associated with the laser welding process, which are detected and analyzed to determine the quality of the weld.
Patent
Electrostatic discharge event detector
Min-Chung Jon,Vito Palazzo +1 more
TL;DR: In this article, the existence, magnitude, and frequency of occurrence of a plurality of ESD events is detected by using an envelope detector to process signals generated by electromagnetic fields and received by an antenna.
Patent
Method and apparatus for monitoring cracking using stress wave emission techniques
TL;DR: In this paper, a technique for monitoring signals emanating from a ceramic article (10) during a soldering operation is presented. But the technique is limited to the case where the signal has an amplitude exceeding a preset threshold (51), during a period of time.
Patent
Method for determining lead frame failure modes using acoustic emission and discriminant analysis techniques
TL;DR: In this paper, an automatic pull tester and an acoustic emission system are combined to analyze the failure modes of lead frames bonded to integrated circuits by using a discriminant analysis technique, a specific failure mode can be determined in real-time by first measuring up to five variables during the pulling operation.
Patent
Connector assembly to eliminate or reduce ESD on high-speed communication cables
TL;DR: In this article, a connector assembly for removing static electricity generated in high-speed communication cable as a result of tribocharging is described, which is realized with a typical high speed cable having a connector provided with a dissipative medium and at least one conductive pad.