scispace - formally typeset
W

Wan Wang

Researcher at Northwestern Polytechnical University

Publications -  9
Citations -  153

Wan Wang is an academic researcher from Northwestern Polytechnical University. The author has contributed to research in topics: Alloy & Dislocation. The author has an hindex of 1, co-authored 4 publications receiving 13 citations.

Papers
More filters
Journal ArticleDOI

Atomistic insights into the deformation mechanism of a CoCrNi medium entropy alloy under nanoindentation

TL;DR: In this article, the authors investigate the nucleation and evolution of dislocations in CoCrNi MEA during nanoindentation and analyze the effects of composition inhomogeneity and temperature on the defect behavior.
Journal ArticleDOI

Molecular dynamics simulation of the tribological performance of amorphous/amorphous nano-laminates

TL;DR: In this article, the nano-scratch performance of amorphous/amorphous nano-laminates was evaluated by molecular dynamics simulation, and their dependences on the type of indenter, layer thickness, stacking mode and scratch depth were systematically analyzed.
Journal ArticleDOI

Molecular dynamics simulation of deformation mechanism of CoCrNi medium entropy alloy during nanoscratching

TL;DR: In this paper, the deformation mechanism of CoCrNi medium entropy alloy (MEA) during nanoscratching has been explored in depth at a qualitative level by molecular dynamics simulation.
Journal ArticleDOI

Atomistic understanding of incipient plasticity in BCC refractory high entropy alloys

TL;DR: In this article , the initial dislocation nucleation and motion mechanisms in the TaTiZrV RHEA and their dependence on temperature were investigated upon nanoindentation by molecular dynamics simulations.
Journal ArticleDOI

Effect of a water film on the material removal behavior of Invar during chemical mechanical polishing

TL;DR: In this article , the chemical mechanical polishing (CMP) mechanism of the Invar alloy under water-lubrication by use of molecular dynamics simulation was revealed, and the results showed that the appropriate thickness of the water film and polishing speed can significantly reduce the surface roughness of the work piece and eliminate subsurface defects.