Showing papers by "Warren B. Jackson published in 2018"
Patent•
PARC1
TL;DR: In this paper, a secure system includes at least one semiconductor chip comprising information processing circuitry, and an array of contact pads is disposed on a surface of the chip and is electrically coupled to the information processing circuits.
Abstract: A secured system includes at least one semiconductor chip comprising information processing circuitry. An array of contact pads is disposed on a surface of the chip and is electrically coupled to the information processing circuitry. The secured system includes one or more semiconductor chiplets. Each chiplet comprises at least a portion of at least one hardware trusted platform module that cryptographically secures the information processing circuitry. An array of electrically conductive microsprings is disposed on a surface of the chiplet and is electrically coupled between the hardware trusted platform module and the contact pads.